AMD XC2V1500-4FGG676I

Overview

XC2V1500-4FGG676I from Xilinx is a 1.5-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating over –40°C to +100°C industrial temperature range. It integrates 7,680 Configurable Logic Blocks (CLBs), 48 Digital Clock Managers (DCMs), 240 dedicated 18×18 multipliers, and 528 user I/Os - deployed in high-speed telecom infrastructure for protocol bridging between PCI-X, LVDS, and DDR interfaces.

For engineers reviewing the XC2V1500-4FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include verified industrial-temperature operation, DCI-enabled on-die termination for HSTL/SSTL/LVCMOS I/O standards, dual-port Block SelectRAM capacity (528 Kbits), and DCM-based clock de-skew and phase-shifting capability up to ±180° in 1/256-clock-period increments.

Technical Context

The XC2V1500-4FGG676I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support true DDR input/output paths using two edge-triggered registers per I/O, driven by DCM-synchronized 180°-phase-shifted clocks.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, fast carry chains, and horizontal cascade logic; each Block SelectRAM provides synchronous dual-port RAM configurable from 16K×1 to 512×36 bits with three read-during-write modes. The device uses 1.5V VCCINT core supply, 3.3V VCCAUX auxiliary supply, and programmable VCCO per bank (1.5V–3.3V).

Key Specifications

Pinout & Package

XC2V1500-4FGG676I is housed in a Pb-free 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, 27 mm × 27 mm body size, and wire-bond interconnect. The package supports 392 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-4FGG676I, the -5 variant improves timing margin without changing footprint or power envelope, while the XC2V2000-4FF896I expands I/O and logic capacity at the cost of larger board area, higher assembly cost, and increased thermal load - making XC2V1500-4FGG676I optimal for cost-sensitive, space-constrained industrial control and video processing applications.

Availability

XC2V1500-4FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video systems, PCI-X bridge modules, and automated test equipment requiring stable component supply across extended lifecycle programs.

Supply support for XC2V1500-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGA, adaptive SoC, and ACAP technologies for high-performance computing and signal processing.

The Virtex-II family was designed for high-speed, high-density logic implementation in telecom, networking, and video applications - delivering industry-first features including DCI, integrated DCMs, and SelectRAM memory hierarchy to replace ASICs in evolving standards-based systems.

FAQ

What is the maximum operating junction temperature for XC2V1500-4FGG676I?

The XC2V1500-4FGG676I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is guaranteed across all speed grades and I/O standards when used with appropriate PCB thermal design, including adequate copper pour and thermal vias beneath the FGG676 package body. The device's 1.5V VCCINT supply contributes to lower dynamic power versus older 2.5V-core FPGAs.

Does XC2V1500-4FGG676I support IEEE 1532 boundary-scan configuration?

Yes, XC2V1500-4FGG676I fully supports IEEE 1532-compliant boundary-scan configuration through its dedicated JTAG TAP controller. The device implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions - enabling in-system programming, configuration verification, and real-time debugging without requiring external configuration PROMs.

Can XC2V1500-4FGG676I interface directly with 3.3V PCI-X 133 MHz buses?

Yes, XC2V1500-4FGG676I supports native PCI-X 133 MHz compliance at 3.3V through its SelectIO-Ultra I/O architecture. Its IOBs meet PCI-X electrical specifications for voltage levels, timing, and drive strength without external level shifters. The device also supports PCI 66/33 MHz and CardBus 33 MHz standards within the same I/O bank when configured with appropriate VCCO and IOSTANDARD attributes.

How many Block SelectRAM modules does XC2V1500-4FGG676I contain, and what is their total capacity?

XC2V1500-4FGG676I contains 48 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. This yields a total raw capacity of 864 Kb, with up to 528 Kb usable as synchronous dual-port memory (e.g., 512×36-bit configuration). Each block supports independent read/write clocks, three read-during-write modes, and cascading to build larger memory structures - essential for video frame buffers and packet FIFOs.

Is XC2V1500-4FGG676I compatible with Xilinx ISE 14.7 design tools?

No - XC2V1500-4FGG676I requires Xilinx ISE Foundation or Alliance Series software versions 6.3 through 10.1, with ISE 8.2i being the final officially supported release for full Virtex-II timing analysis and bitstream generation. ISE 14.7 targets 7-series and later devices; attempting to synthesize XC2V1500-4FGG676I in newer tools will result in library mismatches and unsupported primitives.