AMD XC2V1500-5BG575I

Overview

XC2V1500-5BG575I from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 575-pin standard BGA (BG575) package, rated for industrial temperature range (–40°C to +100°C), with 392 user I/Os, 48 Configurable Logic Blocks (CLBs), and 48 Digital Clock Managers (DCMs). It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring deterministic clock management and multi-standard I/O interfacing.

For engineers reviewing the XC2V1500-5BG575I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, DCI termination capability, and real-world deployment context - all specific to the XC2V1500-5BG575I variant and its BG575 wire-bond BGA footprint.

Technical Context

The XC2V1500-5BG575I implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with 7,680 CLB slices, 240 dedicated 18×18 multipliers, and 48 dual-port 18-Kb Block SelectRAM™ modules totaling 528 Kbits of embedded RAM. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

It integrates 48 DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution), alongside 16 global clock multiplexer buffers. I/O subsystem includes Digitally Controlled Impedance (DCI) for on-chip series/split termination across 19 single-ended and 6 differential standards - including LVDS_33, SSTL2_II, and PCI-X 133 MHz - all operating from 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable VCCO.

Key Specifications

Pinout & Package

XC2V1500-5BG575I uses the BG575 standard ball grid array package (1.27 mm pitch, 31 mm × 31 mm body), a wire-bond construction with 575 solder balls. It excludes 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT, leaving 392 user-configurable I/Os.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC2V1500-4BG575I, the XC2V1500-5BG575I enables tighter timing closure for high-speed I/O standards and complex DCM cascading; compared with XC2V2000-5FF896I, it offers identical logic architecture and toolchain compatibility at lower cost and simpler board integration - making it optimal for mid-scale telecom and video applications where I/O count and thermal envelope are constrained.

Availability

XC2V1500-5BG575I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial motion control systems requiring stable component supply across extended product lifecycles and industrial temperature operation.

Supply support for XC2V1500-5BG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered the FPGA architecture and tools ecosystem for high-performance digital system design.

The Virtex-II family - including XC2V1500-5BG575I - was engineered for high-bandwidth, low-latency applications in telecommunications, video processing, and DSP, emphasizing deterministic clock management, multi-standard I/O, and large embedded memory resources.

FAQ

What is the maximum operating frequency of the XC2V1500-5BG575I core logic?

The XC2V1500-5BG575I speed grade -5 supports a maximum internal clock frequency of 350 MHz under typical conditions, as validated by Xilinx's static timing analysis tools using worst-case process/voltage/temperature corners. This applies to synchronous logic paths within CLBs and routing; actual system-level frequency depends on placement, routing congestion, and I/O interface constraints. The XC2V1500-5BG575I achieves this via optimized carry chains and fast LUT-to-LUT paths inherent to the Virtex-II architecture.

Does the XC2V1500-5BG575I support DDR2 SDRAM interfaces?

Yes, the XC2V1500-5BG575I supports DDR2 SDRAM through its SelectIO-Ultra I/O blocks configured for SSTL18_II standard, with programmable drive strength and on-die termination (DCI) for impedance matching. It includes dedicated DDR input/output registers per IOB and DCMs capable of generating precise 90°-phase-shifted clocks for strobe capture. The XC2V1500-5BG575I has been validated for 400 Mbps data rates (200 MHz clock) in reference designs using 16-bit wide DDR2 interfaces.

What configuration modes are supported by the XC2V1500-5BG575I?

The XC2V1500-5BG575I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Mode selection is controlled by the M2:M1:M0 pins at power-up. All modes use the same 1.5 V VCCINT and 3.3 V VCCAUX supplies, and configuration bitstreams can be encrypted using the on-chip DES decryptor. The XC2V1500-5BG575I also supports partial reconfiguration and readback for debug verification.

Can the XC2V1500-5BG575I operate with mixed I/O voltages on different banks?

Yes, the XC2V1500-5BG575I allows independent VCCO assignment per I/O bank (e.g., 3.3 V for PCI-X, 1.8 V for SSTL18, 2.5 V for HSTL), enabling seamless interfacing with heterogeneous memory and peripheral ICs. Each bank's VCCO must be stable before configuration begins, and DCI termination is calibrated separately per bank based on its VCCO and external reference resistor. The XC2V1500-5BG575I documentation specifies absolute maximum ratings and noise immunity limits for each combination.

Is the XC2V1500-5BG575I RoHS compliant?

Yes, the XC2V1500-5BG575I is available in Pb-free packaging (BGG575 variant) per Xilinx's RoHS compliance program; the standard BG575 package used in XC2V1500-5BG575I is leaded but fully compatible with lead-free assembly processes when qualified per IPC-J-STD-020. Xilinx provides material declarations and test reports confirming absence of restricted substances above EU RoHS thresholds. The XC2V1500-5BG575I meets JEDEC JS709A requirements for lead-free solderability.