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AMD XC2V1500-5BGG575C
- Part No.:
- XC2V1500-5BGG575C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 575-BBGA
- Datasheet:
-
XC2V1500-5BGG575C.pdf
- Description:
- IC FPGA 392 I/O 575BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC2V1500-5BGG575C from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 7,680 CLBs, 240 dedicated 18×18 multipliers, 48 Block SelectRAM™ modules (528 Kbits total), and 12 Digital Clock Managers (DCMs) for high-precision clock synthesis and de-skew. It supports LVDS, SSTL, HSTL, PCI-X, and DDR I/O standards and is used in telecom line cards requiring high-bandwidth packet processing and deterministic timing.
For engineers reviewing the XC2V1500-5BGG575C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability per package, DCM timing parameters, DCI termination support, and validated alternative FPGAs for migration or second-sourcing - all grounded in DS031 (v3.5) November 2007 official specification.
Technical Context
The XC2V1500-5BGG575C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-data-rate (DDR) input/output paths using two phase-opposed clocks generated by integrated DCMs, enabling 840 Mb/s LVDS signaling and source-synchronous interfaces.
Internally, it uses a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Digitally Controlled Impedance (DCI) provides on-die series or split termination for LVDCI, SSTL_DCI, and HSTL_DCI standards without external resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1.5 million - defines logic capacity for complex RTL implementation, e.g., multi-channel DSP pipelines or protocol stacks. |
| CLBs / Slices | 7,680 CLBs (48×40 array) - each CLB contains 4 slices with dual 4-LUTs, flip-flops, carry chains, and horizontal cascade for arithmetic/logic density. |
| Block RAM | 48 × 18-Kb dual-port SelectRAM blocks = 528 Kbits - supports true dual-port synchronous access for FIFOs, frame buffers, or coefficient storage. |
| Multipliers | 240 × 18-bit × 18-bit hard multipliers - enables parallel MAC operations for FIR filters, FFT engines, or modulation/demodulation without LUT resource penalty. |
| DCMs | 12 Digital Clock Managers - provide jitter-free clock multiplication/division, ±1/256-cycle phase shift, and zero-delay buffer outputs for timing-critical I/O and internal logic. |
| I/O Count (BGG575) | 392 user I/O pins - confirmed for wire-bond BGG575 package; supports up to 19 single-ended and 6 differential standards including LVDS, SSTL2/3, HSTL, and PCI-X. |
| Speed Grade | -5 grade - specifies worst-case internal timing performance (e.g., TCKO ≤ 2.5 ns, TPD ≤ 1.8 ns per DS031 Module 3) for synthesis and place-and-route constraints. |
Pinout & Package
XC2V1500-5BGG575C is housed in a Pb-free 575-ball standard BGA (BGG575) package with 1.27 mm pitch, 31 mm × 31 mm body size, and 408 total balls - of which 392 are user I/Os (excluding 15 dedicated configuration/control pins and VBATT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or SelectMAP configuration; must be stable during bitstream loading; not usable as general-purpose clock post-configuration. |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful configuration completion; requires external pull-up for system reset synchronization. |
| M0–M2 | Mode Selection Inputs | Three-pin binary encoding selects one of five configuration modes (e.g., Master Serial, Slave SelectMAP); latched on PROG_B rising edge. |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration; must be held low ≥ 300 ns before release. |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port; supports INTEST, EXTEST, and HIGHZ instructions; enables readback and ILA debugging. |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO-Ultra I/O Technology | Supports 19 single-ended (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and 6 differential (LVDS, BLVDS, LVPECL, LDT) standards with programmable drive strength (2–24 mA) and slew rate control. |
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for LVDCI, SSTL_DCI, and HSTL_DCI standards eliminates external resistors and improves signal integrity for point-to-point DDR memory interfaces. |
| 12 DCM Modules | Each provides fully digital clock deskew, frequency synthesis (M/D ratio), and fine-grained phase shift (1/256 cycle) - enabling precise clock domain crossing and source-synchronous capture alignment. |
| Triple-DES Bitstream Encryption | Optional on-chip DES decryptor secures configuration data using one or two key sets; prevents reverse engineering and unauthorized cloning of FPGA logic design. |
| Readback & Integrated Logic Analyzer (ILA) | Full configuration memory, register, and block RAM contents can be read back via JTAG; ILA core allows real-time trigger-based signal acquisition without external probes. |
Applications
| Telecom Line Card Processing | High-Speed Memory Interface Controller |
|---|---|
|
Use Scenario: Aggregating and switching OC-48/STM-16 traffic in carrier-grade edge routers with packet classification, QoS scheduling, and CRC offload. IC Role / Device Role / Timing Role: Configurable fabric implementing SERDES interface logic, TCAM lookup engines, and time-sensitive scheduler state machines synchronized by DCM-generated clocks. Use Value: 392 I/Os enable full-width DDR2 SDRAM and QDR SRAM interfaces; 240 multipliers accelerate polynomial CRC-32 computation at line rate. |
Use Scenario: Acting as a memory controller bridge between PowerPC processor bus and dual-rank DDR2-400 DIMMs in industrial automation HMIs. IC Role / Device Role / Timing Role: Implements PHY-level DDR2 command/address/data timing, write leveling, and read deskew using DCM phase-shifted clocks and IOB DDR registers. Use Value: DCI termination ensures impedance-matched stub-free routing for 400 MT/s operation; 528 Kbits of block RAM buffers command queues and calibration data. |
| PCI-X Peripheral Accelerator | Video Frame Processing Engine |
|
Use Scenario: Offloading video encode/decode tasks from host CPU in broadcast equipment using PCI-X 133 MHz host interface. IC Role / Device Role / Timing Role: PCI-X compliant endpoint implementing 64-bit/133 MHz transaction layer, DMA engine, and hardware-accelerated motion estimation. Use Value: Native PCI-X 3.3 V signaling support at 133 MHz eliminates level-shifting; 7,680 CLBs implement parallel macroblock processing pipelines. |
Use Scenario: Real-time 1080p60 video scaling, color space conversion, and overlay compositing in medical imaging displays. IC Role / Device Role / Timing Role: Dual-port block RAM buffers frame lines; CLBs execute pixel interpolation and gamma correction; DCMs lock to HDMI pixel clock and generate sub-sampled timing signals. Use Value: 840 Mb/s LVDS I/O supports serialized camera sensor links; 48 DCMs enable independent clock domains for sensor input, processing, and display output. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V1500-6BGG575C | Higher speed grade (-6 vs. -5): tighter internal timing (e.g., TCKO ≤ 2.2 ns), enabling higher clock frequencies or relaxed timing closure margins. | Suitable for designs requiring >200 MHz system clocks or stricter setup/hold slack; identical pinout and feature set. | Select when timing closure fails at -5 grade or when future-proofing for higher-frequency upgrades without PCB change. |
| XC2V2000-5FF896C | Larger device (2M gates, 624 I/Os) in flip-chip FF896 package; same -5 speed grade and DCM/SelectRAM architecture but higher I/O count and thermal capacity. | Required for designs exceeding XC2V1500 logic or I/O resources; supports more DDR channels or higher-density SerDes interfaces. | Choose when migrating from XC2V1500 due to resource exhaustion, especially where >392 I/Os or >528 Kbits RAM are needed. |
Compared with XC2V1500-5BGG575C, the -6 variant offers improved timing margin without architectural change, while the XC2V2000-5FF896C expands I/O and logic capacity in a physically larger, thermally superior flip-chip package - both retain identical toolchain support and DCM/SelectRAM functionality.
Availability
XC2V1500-5BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and broadcast video applications requiring stable component supply across extended production lifecycles.
Supply support for XC2V1500-5BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA platforms enable customizable digital logic implementation across aerospace, communications, and computing markets.
The Virtex-II family was designed for high-performance, high-density system-on-chip integration in wireline/wireless infrastructure and DSP-intensive applications, emphasizing I/O flexibility, clock precision, and embedded memory/multiplier resources.
FAQ
What is the maximum number of user I/O pins supported by XC2V1500-5BGG575C?
XC2V1500-5BGG575C supports 392 user I/O pins in the BGG575 package, as confirmed in Table 6 of DS031 Module 1. This excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The count is specific to wire-bond BGG575; flip-chip variants like FF896 offer 528 I/Os but are not pin-compatible.
Does XC2V1500-5BGG575C support DDR2 memory interfaces?
Yes, XC2V1500-5BGG575C supports DDR2 interfaces through its SelectIO-Ultra I/O banks configured for SSTL18_II or SSTL18_I standards, with programmable drive strength and on-die DCI termination. Its IOBs include dedicated DDR input/output registers, and DCMs generate phase-aligned clocks required for write leveling and read deskew per JEDEC DDR2 specifications.
What clock management resources does XC2V1500-5BGG575C include?
XC2V1500-5BGG575C includes 12 fully digital Digital Clock Managers (DCMs), each capable of clock multiplication/division (M/D ratio), precise phase shifting (1/256 cycle resolution), and zero-delay buffering. These feed 16 global clock multiplexer buffers, enabling robust clock domain crossing and source-synchronous I/O timing critical for high-speed interfaces like LVDS and PCI-X.
Is XC2V1500-5BGG575C compatible with 5V-tolerant I/O standards?
No, XC2V1500-5BGG575C is not 5V-tolerant. Its IOBs operate with VCCO ranging from 1.5 V to 3.3 V depending on I/O standard, and inputs are not rated for 5V. External current-limiting resistors may allow limited 5V input use per Xilinx Tech Topic "5V Tolerant I/Os", but outputs cannot drive 5V buses directly.
Can XC2V1500-5BGG575C perform partial reconfiguration?
Yes, XC2V1500-5BGG575C supports partial reconfiguration as specified in DS031 Module 1. This allows dynamic loading of new logic into designated regions while the rest of the design remains operational - useful for adaptive filtering, protocol switching, or field-upgradable functionality without full device reset.
XC2V1500-5BGG575C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 575-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1920
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 884736
- Number of I/O:
- 392
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 575-BGA (31x31)
XC2V1500-5BGG575C FAQ
1.How can I place an order for XC2V1500-5BGG575C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V1500-5BGG575C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V1500-5BGG575C reliable?
The price and inventory of XC2V1500-5BGG575C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1500-5BGG575C is usually 5 days.
3.What payment methods are accepted for XC2V1500-5BGG575C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1500-5BGG575C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V1500-5BGG575C?
XC2V1500-5BGG575C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V1500-5BGG575C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V1500-5BGG575C?
For technical support, including XC2V1500-5BGG575C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1500-5BGG575C requirements.
6.How does Aetrix verify that XC2V1500-5BGG575C is sourced from the original manufacturer or authorized distributors?
All XC2V1500-5BGG575C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1500-5BGG575C meets industry standards.
7.What is the process for return or replacement of XC2V1500-5BGG575C?
All XC2V1500-5BGG575C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1500-5BGG575C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V1500-5BGG575C part is unused and in its original packaging.
Return procedure for XC2V1500-5BGG575C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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