AMD XC2V1500-5BGG575I

Overview

XC2V1500-5BGG575I from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, rated for industrial temperature (–40°C to +100°C), with 392 user I/Os, 48 Configurable Logic Blocks (CLBs), and 48 Digital Clock Managers (DCMs). It delivers high-speed logic implementation for telecom, networking, and video systems requiring DDR interfaces, LVDS I/O, and embedded memory.

For engineers reviewing the XC2V1500-5BGG575I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, DCM timing parameters, and industrial-grade thermal performance - all confirmed from Xilinx DS031 (v3.5).

Technical Context

The XC2V1500-5BGG575I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates 7,680 CLB slices, 48 × 18-Kb dual-port Block SelectRAM, 240 dedicated 18×18 multipliers, and 48 DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period).

Routing uses Active Interconnect Technology with 24 long lines per row/column, shared timing models across IOBs/CLBs/SelectRAM, and hierarchical switch matrices enabling predictable high-speed interconnect. IOBs support DDR input/output registers, Digitally Controlled Impedance (DCI) for on-chip series/split termination, and 19 single-ended plus 8 differential I/O standards including LVDS_33, SSTL3_II, and PCI-X 133 MHz at 3.3 V.

Key Specifications

Pinout & Package

XC2V1500-5BGG575I uses a 575-ball standard BGA (BGG575) package with 1.27 mm pitch, 31 mm × 31 mm body size, and Pb-free construction. Pin definitions follow Xilinx's standardized Virtex-II IOB layout with dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP signals (TCK/TMS/TDI/TDO), and 392 user-configurable I/O banks grouped in quads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-5BGG575I, the -4 speed grade trades performance margin for cost, while the XC2V2000-5FF896I offers gate count and I/O expansion at the expense of package compatibility and layout effort - both require full timing revalidation and I/O constraint updates.

Availability

XC2V1500-5BGG575I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video systems, and wireless baseband applications requiring stable component supply, long-lifecycle support, and industrial-temperature operation.

Supply support for XC2V1500-5BGG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-speed, high-density logic implementation in telecommunications, networking, and video applications - delivering integrated clock management, memory, and I/O flexibility in a single reprogrammable device.

FAQ

What is the maximum operating temperature range for XC2V1500-5BGG575I?

The XC2V1500-5BGG575I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is defined in Xilinx DS031 (v3.5) Module 1 and validated across all speed grades and package types. Thermal derating applies above 85°C ambient depending on airflow and PCB copper area; full functionality is guaranteed within the specified Tj range.

Does XC2V1500-5BGG575I support LVDS I/O at 840 Mb/s?

Yes, XC2V1500-5BGG575I supports LVDS_33 and LVDS_25 I/O standards with guaranteed 840 Mb/s data rates, as documented in the "SelectIO™-Ultra Technology" section of DS031 Module 1. This performance requires proper PCB layout (controlled impedance, length matching), correct VCCO = 3.3 V or 2.5 V per bank, and use of dedicated LVDS-capable IOBs with matched P/N pairs.

How many Block SelectRAM resources does XC2V1500-5BGG575I include?

XC2V1500-5BGG575I contains 48 Block SelectRAM modules, each providing 18 Kb of dual-port RAM, totaling 528 Kbits. These blocks support configurable widths (512 × 36 to 16K × 1) and three read-during-write modes, as confirmed in Table 1 of DS031 Module 1 and functional description in Module 2.

Is XC2V1500-5BGG575I compatible with IEEE 1532 boundary-scan programming?

Yes, XC2V1500-5BGG575I fully supports IEEE 1532 in-system configuration via JTAG, including boundary-scan testing (EXTEST, INTEST), configuration loading, and readback. The TAP controller implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, and HIGHZ instructions per DS031 Module 1 and Module 2 specifications.

What power supplies are required for XC2V1500-5BGG575I operation?

XC2V1500-5BGG575I requires three dedicated supplies: VCCINT = 1.5 V ±3% for core logic, VCCAUX = 3.3 V ±5% for configuration and DCMs, and per-bank VCCO (1.5 V to 3.3 V) for I/O signaling. Decoupling must meet Xilinx recommendations - 10 µF bulk + 0.1 µF ceramic per supply pin - to maintain signal integrity and avoid configuration failure.