AMD XC2V1500-5FF896I

Overview

XC2V1500-5FF896I from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, operating at industrial temperature (–40°C to +100°C), with 528 user I/Os, 7,680 CLB slices, and 48 Digital Clock Manager (DCM) modules. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V1500-5FF896I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, FF896 package mapping, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V1500-5FF896I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates 48 Configurable Logic Blocks (CLBs), 48 Block SelectRAM™ modules (each 18 Kb dual-port RAM), and 240 dedicated 18×18 multipliers - all interconnected via Active Interconnect Technology routing with predictable delay independent of fanout.

It supports simultaneous single-ended (LVTTL, LVCMOS, SSTL, HSTL, GTL, PCI-X) and differential (LVDS, BLVDS, LVPECL, LDT) I/O standards, with Digitally Controlled Impedance (DCI) enabling on-die series or split termination for 15+ standards. Each IOB includes dual-edge DDR registers, clock enable, and synchronous/asynchronous set/reset, enabling source-synchronous interface design up to 840 Mb/s.

Key Specifications

Pinout & Package

XC2V1500-5FF896I uses the FF896 flip-chip fine-pitch BGA package (1.00 mm pitch, 31 mm × 31 mm body), offering 528 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK–TDO, TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT. Pin definitions are documented across 226 pages in DS031 Module 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V1500-5FF896I, XC2V1000-5FF896I offers lower cost and power for constrained logic budgets, while XC2V2000-5FF896I provides headroom for feature expansion and higher I/O bandwidth - both maintain pin-compatible upgrade paths within the FF896 package family.

Availability

XC2V1500-5FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial embedded systems requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for XC2V1500-5FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered the FPGA architecture and tools ecosystem for high-performance digital system design.

The Virtex-II family, including XC2V1500-5FF896I, was engineered for high-speed, high-density applications in telecommunications, wireless infrastructure, and video processing - emphasizing I/O flexibility, clock management, and embedded memory/multiplier resources.

FAQ

What is the maximum supported I/O standard speed for XC2V1500-5FF896I?

XC2V1500-5FF896I supports LVDS signaling at up to 840 Mb/s and PCI-X at 133 MHz (3.3 V), as confirmed in DS031 Module 1. These speeds are achievable using its dedicated differential I/O buffers and DCM-controlled source-synchronous timing. The device's FF896 package and internal routing ensure signal integrity at these rates when layout guidelines are followed.

Does XC2V1500-5FF896I support partial reconfiguration?

Yes, XC2V1500-5FF896I supports partial reconfiguration as documented in DS031 Module 2. This capability allows dynamic replacement of logic modules during operation without resetting the entire device - critical for adaptive systems like radar beamforming or protocol-agile communication links. Configuration is managed via SelectMAP interface with frame-level addressing.

What power supplies are required for XC2V1500-5FF896I operation?

XC2V1500-5FF896I requires three independent supplies: 1.5 V ±3% for VCCINT (core logic), 3.3 V ±5% for VCCAUX (DCMs, configuration, JTAG), and programmable VCCO (1.5 V–3.3 V) per I/O bank to match selected I/O standards. Decoupling must follow Xilinx's recommended capacitor values and placement per DS031 Module 3.

Is XC2V1500-5FF896I compatible with IEEE 1149.1 boundary scan?

Yes, XC2V1500-5FF896I fully complies with IEEE 1149.1 (JTAG) as stated in DS031 Module 1. Its Test Access Port (TAP) supports EXTEST, INTEST, HIGHZ, SAMPLE, and IDCODE instructions, enabling board-level interconnect testing, in-system programming, and debug access - all without requiring external test circuitry.

How many Block SelectRAM modules does XC2V1500-5FF896I contain?

XC2V1500-5FF896I contains 48 Block SelectRAM modules, each providing 18 Kb of dual-port RAM, totaling 528 Kbits. As specified in Table 1 of DS031 Module 1, these blocks support configurable depths (e.g., 16K×1 to 512×36) and three read-during-write modes - essential for FIFOs, frame buffers, and coefficient tables in DSP pipelines.