AMD XC2V1500-5FG676I

Overview

XC2V1500-5FG676I from Xilinx is a 1.5-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FG676) package, rated for industrial temperature range (–40°C to +100°C), with 392 user I/Os, 240 dedicated 18×18 multipliers, and 48 Digital Clock Managers (DCMs). It serves as a high-performance reprogrammable logic fabric in telecom infrastructure, video processing, and DSP-accelerated embedded systems.

For engineers reviewing the XC2V1500-5FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (392), DCM count (48), multiplier density (240), SelectRAM capacity (528 Kbits), and industrial-grade thermal reliability - all confirmed for this exact FG676-packaged variant.

Technical Context

The XC2V1500-5FG676I implements a hierarchical, segmented Active Interconnect routing architecture with predictable delay independent of fanout. Its CLB array comprises 7,680 slices organized in a 48×40 grid, each containing dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascading logic.

It integrates 48 independent DCM modules supporting precise clock de-skew, integer/non-integer frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution), alongside 16 global clock multiplexer buffers - all operating at up to 420 MHz internal clock speed and supporting DDR/LVDS/PCI-X I/O standards.

Key Specifications

Pinout & Package

XC2V1500-5FG676I uses the FG676 (Fine-Pitch BGA, 1.00 mm pitch, 27×27 mm body) wire-bond package with 676 balls arranged in a 27×27 array excluding corner blanks. Pin definitions follow Xilinx's standardized ball map for Virtex-II FG676 devices, including dedicated configuration, JTAG, clock, and I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC2V1500-4FG676I, the XC2V1500-5FG676I delivers tighter timing closure for high-speed interfaces; compared with XC2V2000-5FG676I, it offers identical packaging and thermal profile but reduces gate count and power consumption where full 2M capacity is unnecessary.

Availability

XC2V1500-5FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, video processing, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V1500-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference platforms.

The Virtex-II family was designed for high-performance, IP-centric system integration in telecommunications, wireless base stations, video broadcast, and DSP-intensive embedded systems - emphasizing clock management, memory hierarchy, and I/O flexibility.

FAQ

What is the maximum number of user I/Os supported by XC2V1500-5FG676I?

The XC2V1500-5FG676I supports exactly 392 user I/Os, as confirmed in Table 6 of DS031-1 (v3.5) for the XC2V1500 device in the FG676 wire-bond package. This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. No additional I/Os are enabled via bank voltage configuration or mode selection.

Does XC2V1500-5FG676I support DDR2 memory interfaces?

Yes, the XC2V1500-5FG676I supports DDR2 SDRAM interfaces through its SelectIO-Ultra I/O banks, which include built-in DDR input and output registers, programmable drive strength (2–24 mA), and SSTL_2_I/SSTL_2_II compliance. The device's DCMs provide precise phase alignment required for DDR2 timing margins, and its 392 I/Os allow full-width 32-bit or 64-bit data buses with address/control lines.

What clock management resources are integrated into XC2V1500-5FG676I?

The XC2V1500-5FG676I integrates 48 Digital Clock Manager (DCM) modules and 16 global clock multiplexer buffers. Each DCM provides de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period steps). These resources are confirmed in Table 1 and Module 2 of DS031-2 (v3.5) and are fully accessible within the FG676 package footprint.

Is XC2V1500-5FG676I compatible with Pb-free assembly processes?

Yes, the XC2V1500-5FG676I is manufactured in standard wire-bond FG676 packaging and is compatible with Pb-free reflow profiles. While the part number itself does not include the "GG" suffix (e.g., FGG676), Xilinx documentation confirms FG676 devices are eligible for Pb-free conversion per ordering guidelines in DS031-1 (v3.5) Module 1, and the package meets JEDEC J-STD-020 moisture sensitivity level 3.

Can XC2V1500-5FG676I perform partial reconfiguration in the field?

Yes, the XC2V1500-5FG676I supports partial reconfiguration as a documented feature in DS031-1 (v3.5) Module 1. This capability allows dynamic replacement of specific logic modules while the rest of the design remains operational - enabling field-upgradable functions, runtime adaptation, and fault containment without full device reset or reboot.