AMD XC2V1500-5FGG676C

Overview

XC2V1500-5FGG676C from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 7,680 CLBs, 240 18×18 multipliers, 48 Block SelectRAM™ modules (528 Kbits total), and 8 DCMs - enabling high-speed telecommunication, DSP, and video processing systems requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V1500-5FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (392 user I/Os), DCI-enabled on-die termination for HSTL/SSTL/LVDCI standards, dual-port RAM configurability (up to 512×36), and DCM phase-shifting resolution (1/256 clock period).

Technical Context

The XC2V1500-5FGG676C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and glitch-free global clock MUX buffers. Its IOBs support DDR input/output registers clocked by 180°-phase-shifted DCM outputs, enabling true source-synchronous signaling.

Each CLB contains four slices with dual 4-LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM provides synchronous dual-port access with three read-during-write modes. The device uses 1.5V VCCINT, 3.3V VCCAUX, and programmable VCCO per bank.

Key Specifications

Pinout & Package

XC2V1500-5FGG676C is housed in a Pb-free 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, 27 mm × 27 mm body size, and wire-bond interconnect. It supports 392 user I/Os across 12 I/O banks, plus dedicated configuration, clock, and boundary-scan pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC2V1500-5FGG676C, the -4 variant trades 10–15% timing margin for lower cost, while the XC2V2000-5FF896C adds 33% more logic and 60% more I/O at the expense of larger footprint and higher power - making the XC2V1500-5FGG676C optimal for balanced high-performance embedded control with strict board area constraints.

Availability

XC2V1500-5FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and industrial video processing requiring stable component supply across extended production lifecycles.

Supply support for XC2V1500-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, historically focused on FPGA, SoC, and adaptive compute solutions for high-performance digital systems.

The Virtex-II family was engineered for demanding applications in telecommunications, wireless infrastructure, and high-end DSP - delivering scalable logic density, hardened I/O, and deterministic clock management before the advent of modern 28nm+ architectures.

FAQ

What is the maximum supported I/O standard voltage for XC2V1500-5FGG676C?

The XC2V1500-5FGG676C supports single-ended I/O standards at VCCO levels of 1.5V, 1.8V, 2.5V, and 3.3V per bank, with differential standards including LVDS_25 (2.5V), LVDS_33 (3.3V), and LVPECL_33 (3.3V). VCCAUX must be 3.3V, and VCCINT is fixed at 1.5V. No 5V-tolerant operation is supported without external current-limiting resistors.

Does XC2V1500-5FGG676C support partial reconfiguration?

Yes, XC2V1500-5FGG676C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of functional modules (e.g., changing encryption algorithms or protocol stacks) without resetting the entire device or disrupting active I/O operations.

How many DCMs are available in XC2V1500-5FGG676C and what are their key timing capabilities?

XC2V1500-5FGG676C contains 8 Digital Clock Managers (DCMs). Each supports precise input clock de-skew, integer/non-integer frequency synthesis (M/D ratio), coarse phase shifting (90°/180°/270°), and fine-grained phase adjustment in increments of 1/256 of the input clock period - critical for aligning DDR strobes and source-synchronous data capture.

Is XC2V1500-5FGG676C compatible with IEEE 1532 boundary-scan configuration?

Yes, XC2V1532 boundary-scan configuration is fully supported. XC2V1500-5FGG676C implements IEEE 1149.1 (JTAG) and IEEE 1532 standards, enabling in-system programming, configuration verification, and debug access via TCK/TMS/TDI/TDO pins without requiring external configuration PROMs.

What is the block RAM configuration flexibility of XC2V1500-5FGG676C?

Each of the 48 Block SelectRAM modules in XC2V1500-5FGG676C is configurable as dual-port RAM in widths from 1 to 36 bits and depths from 512 to 16K, supporting modes like write-first, read-first, and no-change read-during-write. Cascading enables custom memory depths up to 64K × 1 or 2K × 36, ideal for application-specific buffers and lookup tables.