AMD XC2V1500-5FGG676I

Overview

XC2V1500-5FGG676I from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, rated for industrial temperature range (–40°C to +100°C), with 392 user I/Os, 48 Configurable Logic Blocks (CLBs), and 48 Digital Clock Managers (DCMs). It implements high-speed logic, embedded memory, and DSP functions in telecom, networking, and video systems requiring PCI-X, LVDS, and DDR interfaces.

For engineers reviewing the XC2V1500-5FGG676I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource count, and wire-bond BGA package constraints - all confirmed from Xilinx DS031 v3.5.

Technical Context

The XC2V1500-5FGG676I integrates 7,680 CLB slices, 240 dedicated 18×18 multipliers, and 48 dual-port 18-Kb Block SelectRAM modules (totaling 528 Kb RAM), all interconnected via fourth-generation Active Interconnect routing. Its 48 DCMs provide fully digital clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution).

IOBs support 19 single-ended standards (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and 6 differential standards (LVDS, BLVDS, LVPECL, LDT), with Digitally Controlled Impedance (DCI) enabling on-chip series or split termination for select I/Os. Core voltage is 1.5 V (VCCINT), with separate 3.3 V VCCAUX and programmable VCCO per bank.

Key Specifications

Pinout & Package

XC2V1500-5FGG676I uses a 27 mm × 27 mm Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch and Pb-free wire-bond construction. Pin definitions follow Xilinx's standardized Virtex-II IOB tile layout, with dedicated global clock, configuration, and JTAG boundary-scan pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V1500-5FGG676I, the -4 variant trades timing headroom for cost savings, while the XC2V2000-5FGG676I provides scalable logic density without changing PCB layout - both retain identical I/O banking, DCM count, and DCI support.

Availability

XC2V1500-5FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, medical imaging back-end, and test & measurement equipment requiring stable component supply across extended lifecycle programs.

Supply support for XC2V1500-5FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-II family was designed for high-speed, high-density applications in telecommunications, networking, and video, emphasizing I/O flexibility (PCI-X, LVDS), embedded memory, and deterministic clock management - directly embodied in XC2V1500-5FGG676I.

FAQ

What is the maximum number of user I/Os supported by XC2V1500-5FGG676I?

XC2V1500-5FGG676I supports 392 user I/Os in the FGG676 wire-bond BGA package, as confirmed in Table 6 of Xilinx DS031 v3.5. This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The I/Os are organized into banks with independent VCCO supplies, enabling mixed-voltage operation across standards like LVCMOS, SSTL, and HSTL.

Does XC2V1500-5FGG676I support LVDS signaling?

Yes, XC2V1500-5FGG676I supports LVDS signaling at up to 840 Mb/s, with dedicated current-mode drivers and matching termination. It implements LVDS_33 and LVDS_25 standards, and also supports LVDS with Digitally Controlled Impedance (LVDS_25_DCI) for on-chip differential termination. Each differential pair requires two adjacent I/O pads and shares a switch matrix, as defined in Xilinx DS031 Module 2.

What are the power supply requirements for XC2V1500-5FGG676I?

XC2V1500-5FGG676I requires three distinct supply voltages: 1.5 V for core logic (VCCINT), 3.3 V for auxiliary circuitry (VCCAUX), and programmable I/O voltage (VCCO) per bank - selectable between 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on I/O standard. VCCO must match the selected IOSTANDARD (e.g., 3.3 V for LVTTL, 1.8 V for SSTL18), and VCCAUX remains fixed at 3.3 V regardless of I/O configuration.

How many Digital Clock Managers (DCMs) does XC2V1500-5FGG676I include?

XC2V1500-5FGG676I includes 48 Digital Clock Managers (DCMs), as specified in Table 1 of Xilinx DS031 v3.5. Each DCM provides fully digital clock deskew, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to 1/256 of period), and duty cycle correction - enabling precise multi-domain clocking without external PLLs or delay lines.

Is XC2V1500-5FGG676I compatible with Pb-free assembly processes?

Yes, XC2V1500-5FGG676I uses the FGG676 package, which denotes Pb-free wire-bond construction per Xilinx's ordering nomenclature. The "GG" suffix explicitly indicates RoHS-compliant, lead-free finish. It supports standard reflow profiles for Pb-free soldering (e.g., JEDEC J-STD-020), and its thermal characteristics are validated for industrial temperature operation (–40°C to +100°C) under Pb-free conditions.