AMD XC2V1500-6BGG575C

Overview

XC2V1500-6BGG575C from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at commercial temperature range (0°C to +85°C), with 392 user I/Os, 48 Configurable Logic Blocks (CLBs), and 48 Digital Clock Managers (DCMs). It delivers high-speed logic implementation for telecom, networking, and DSP systems requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V1500-6BGG575C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, DCM timing parameters, and wire-bond BGA package constraints - all specific to the XC2V1500-6BGG575C variant.

Technical Context

The XC2V1500-6BGG575C implements a 0.15 µm / 0.12 µm 8-layer metal CMOS architecture with SRAM-based configuration, 1.5 V core supply (VCCINT), and dedicated 3.3 V auxiliary (VCCAUX) and I/O (VCCO) supplies. Its IOBs support 19 single-ended and 6 differential I/O standards including LVDS, BLVDS, and LVPECL, with Digitally Controlled Impedance (DCI) for on-chip series or split termination.

Internally, it integrates 7,680 CLB slices, 240 dedicated 18×18 multipliers, 48 Block SelectRAM™ modules (each 18 Kb dual-port RAM), and 48 DCMs offering precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution). Routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2V1500-6BGG575C uses a Pb-free 575-ball standard BGA (BGG575) package with 1.27 mm pitch and 31 mm × 31 mm body size. It is wire-bonded, not flip-chip, and shares footprint compatibility with other BG/BGG575 Virtex-II devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V1500-6BGG575C, the XC2V1500-6FG676C offers 92 more I/Os in a smaller footprint but demands tighter manufacturing tolerances, while the XC2V1000-6BGG575C retains full pin compatibility at 22% lower logic capacity - enabling drop-in migration downward for cost optimization without layout change.

Availability

XC2V1500-6BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, broadcast video processing, and PCI-X server acceleration requiring stable component supply across long-lifecycle programs.

Supply support for XC2V1500-6BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architectures for high-performance digital system design.

The Virtex-II family, including XC2V1500-6BGG575C, was engineered for high-bandwidth, low-latency applications in telecommunications, networking, and DSP - emphasizing I/O flexibility, clock management, and embedded memory/multiplier resources.

FAQ

What is the maximum operating frequency of the XC2V1500-6BGG575C core logic?

The XC2V1500-6BGG575C supports internal clock speeds up to 420 MHz, as specified in Advance Data documentation. This applies to synchronous logic paths within the CLB array under typical conditions. Actual achievable frequency depends on design complexity, placement, and routing; timing closure must be verified using Xilinx ISE tools with the -6 speed grade constraint files. The XC2V1500-6BGG575C DCMs can synthesize higher-frequency clocks from lower-speed inputs via integer/non-integer M/D ratios.

Does XC2V1500-6BGG575C support 5V-tolerant I/Os?

No, XC2V1500-6BGG575C does not support native 5V-tolerant I/Os. Its IOBs are designed for 1.5 V to 3.3 V operation and lack internal 5V protection circuitry. As an input, it may interface with 5V signals only when external current-limiting resistors are used per Xilinx Tech Topic "5V Tolerant I/Os"; as an output, it is incompatible with 5V bus environments. The XC2V1500-6BGG575C VCCO must match the selected I/O standard's required voltage (e.g., 3.3 V for LVTTL).

Can XC2V1500-6BGG575C perform partial reconfiguration?

Yes, XC2V1500-6BGG575C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of functional modules (e.g., changing encryption engines or protocol handlers) without resetting the entire device. Implementation requires Xilinx ISE 8.2i or later, BITGEN options for partial bitstreams, and careful floorplanning to isolate reconfigurable regions. The XC2V1500-6BGG575C configuration memory is accessible via JTAG or SelectMAP for runtime updates.

What power supplies are required for XC2V1500-6BGG575C operation?

XC2V1500-6BGG575C requires three dedicated supplies: VCCINT = 1.5 V ±3% for core logic, VCCAUX = 3.3 V ±5% for DCMs and configuration circuitry, and VCCO (per I/O bank) = 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on I/O standard selection. Each supply must be independently decoupled with low-ESR capacitors near the BGG575 package. The XC2V1500-6BGG575C datasheet specifies absolute maximum ratings and recommended sequencing (VCCAUX before VCCINT before VCCO) to prevent latch-up.

Is XC2V1500-6BGG575C compatible with modern Xilinx development tools?

XC2V1500-6BGG575C is supported exclusively by legacy Xilinx ISE Design Suite (v14.7 and earlier); it is not compatible with Vivado. Synthesis, place-and-route, and bitstream generation require ISE 8.x–14.7 with Virtex-II device libraries. Programming uses iMPACT or ChipScope Pro. While no new tool updates are issued, ISE remains functional on Windows 7/10 (32-bit) and Linux RHEL 5/6. The XC2V1500-6BGG575C bitstream format and configuration protocol are fixed and unchanged since production release.