AMD XC2V1500-6FFG896C

Overview

XC2V1500-6FFG896C from Xilinx is a 1.5-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FFG896) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 7,680 CLBs, 240 18×18 multipliers, 48 Block SelectRAM™ modules (528 Kbits total), and 8 DCMs - enabling high-speed telecommunication, DSP, and video processing systems requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V1500-6FFG896C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (528 user I/Os), DCI-enabled on-die termination for HSTL/SSTL/LVDCI standards, dual-port block RAM configurability (up to 16K × 1), DCM phase resolution (1/256 clock period), and support for 840 Mb/s LVDS signaling - all validated for flip-chip FFG896 packaging.

Technical Context

The XC2V1500-6FFG896C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support true DDR input/output registers with 180° phase-shifted clocks generated by integrated DCMs, enabling source-synchronous data capture at up to 420 MHz internal logic speed.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, fast carry chains, and horizontal cascade logic; each Block SelectRAM provides synchronous dual-port access with three read-during-write modes. The device uses a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO).

Key Specifications

Pinout & Package

XC2V1500-6FFG896C uses the FF896 flip-chip fine-pitch BGA package (1.00 mm pitch, 31 mm × 31 mm body), offering 528 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK–TDO, TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2V1500-5FF896C, the XC2V1500-6FFG896C delivers higher timing closure margin for 420 MHz logic and 840 Mb/s LVDS; versus XCVU9P-2FFVB2104I, it offers legacy toolchain compatibility and lower power for non-transceiver-intensive applications, but lacks modern high-speed serial infrastructure.

Availability

XC2V1500-6FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, wireless baseband units, and industrial machine vision systems requiring stable component supply across extended production lifecycles.

Supply support for XC2V1500-6FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture for high-performance, system-level integration.

The Virtex-II family, including XC2V1500-6FFG896C, was designed for high-density, high-speed applications in telecommunications, video processing, and DSP - emphasizing I/O flexibility, embedded memory, and clock management over raw logic density.

FAQ

What is the maximum supported I/O standard voltage for XC2V1500-6FFG896C?

The XC2V1500-6FFG896C supports I/O voltages from 1.5 V to 3.3 V per bank, with VCCO programmable independently for each I/O bank. Valid standards include LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL3, HSTL, and PCI-X at 3.3 V. VCCAUX is fixed at 3.3 V, and VCCINT is fixed at 1.5 V. External termination is required for 5 V-tolerant operation using current-limiting resistors.

Does XC2V1500-6FFG896C support partial reconfiguration?

Yes, XC2V1500-6FFG896C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic replacement of specific logic modules - such as protocol engines or filter coefficients - while the rest of the design remains operational, enabling field-upgradable functionality without system reset.

How many Digital Clock Managers (DCMs) does XC2V1500-6FFG896C contain?

XC2V1500-6FFG896C contains 8 Digital Clock Managers (DCMs). Each DCM provides fully digital clock deskewing, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to 1/256 of the clock period), and duty cycle correction - critical for synchronizing multi-GHz DDR interfaces and LVDS data lanes.

What is the block RAM capacity and configuration flexibility of XC2V1500-6FFG896C?

XC2V1500-6FFG896C provides 48 × 18-Kb Block SelectRAM™ modules totaling 528 Kbits. Each block is independently configurable as dual-port or single-port RAM in widths from 1 to 36 bits and depths from 512 to 16K words, supporting three read-during-write modes and cascading for larger memory structures.

Is XC2V1500-6FFG896C compatible with Xilinx ISE Design Suite?

Yes, XC2V1500-6FFG896C is fully supported by Xilinx ISE Design Suite 14.7 and earlier versions. It is not supported by Vivado, as Virtex-II devices were deprecated before Vivado's introduction. Synthesis, place-and-route, timing analysis, and bitstream generation for XC2V1500-6FFG896C require ISE tools with appropriate service packs.