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AMD XC2V1500-6FGG676C
- Part No.:
- XC2V1500-6FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC2V1500-6FGG676C.pdf
- Description:
- IC FPGA 392 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,497
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Product details
Overview
XC2V1500-6FGG676C from Xilinx is a 1.5 million system gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 7,680 CLBs, 48 DCMs, 48 18-Kb Block SelectRAM modules, and supports up to 392 user I/Os. It is used in high-speed telecom and networking systems requiring PCI-X, LVDS, and DDR interfaces.
For engineers reviewing the XC2V1500-6FGG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), clock management specs, and real-world FPGA deployment context for embedded signal processing and protocol bridging.
Technical Context
The XC2V1500-6FGG676C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.
Each CLB contains four slices with dual 4-LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes. The device uses 1.5V VCCINT, 3.3V VCCAUX, and programmable VCCO per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 1.5 million - defines logic capacity for complex RTL synthesis and IP integration |
| Configurable Logic Blocks (CLBs) | 7,680 - each contains 4 slices with dual LUTs and storage, enabling high-density synchronous logic |
| Digital Clock Managers (DCMs) | 48 - provide jitter-free clock deskew, frequency synthesis (M/D ratio), and fine-grained phase shift (1/256 period) |
| Block SelectRAM (18-Kb) | 48 blocks - deliver 864 Kb total embedded dual-port RAM with independent read/write ports and read-during-write capability |
| User I/O Pins | 392 - supports multi-standard I/O banks with programmable VCCO (1.5V–3.3V) and DCI termination |
| Speed Grade | -6 - guarantees timing closure for critical paths up to 420 MHz internal clock speed (Advance Data) |
| Package | FGG676 - 27 mm × 27 mm, 1.00 mm pitch, Pb-free wire-bond BGA with 676 balls and 392 user I/Os |
Pinout & Package
XC2V1500-6FGG676C uses the FGG676 package: a Pb-free, wire-bond, fine-pitch BGA with 676 balls arranged in a 27 mm × 27 mm body and 1.00 mm pitch. It provides 392 user-configurable I/Os across 12 I/O banks, plus dedicated configuration, clock, and power pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or SelectMAP configuration; must be stable during bitstream loading |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful configuration completion |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave/master serial/SelectMAP/boundary-scan) at power-up |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts loading |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and verification |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO-Ultra I/O Technology | Supports 19 single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and 6 differential (LVDS, BLVDS, LVPECL, LDT) standards with per-bank VCCO control |
| Digitally Controlled Impedance (DCI) | On-chip series or split termination resistors auto-calibrated to external reference resistors - eliminates external termination components for SSTL/HSTL/LVDS |
| Dual-Data-Rate (DDR) I/O Registers | Input/output/3-state paths include two edge-triggered registers per pin, enabling true DDR signaling without external PHY logic |
| 18×18 Multiplier Blocks | 240 dedicated hard multipliers - accelerate DSP filtering, FFT, and arithmetic-intensive algorithms with deterministic latency |
| Triple-DES Bitstream Encryption | On-chip hardware decryptor secures configuration data using one or two 168-bit DES keys - prevents reverse engineering and cloning |
Applications
| Telecom Line Card | High-Speed Protocol Bridge |
|---|---|
Use Scenario: Aggregating multiple T1/E1/J1 streams into OC-3/STM-1 SONET/SDH framer interfaces. IC Role / Device Role / Timing Role: XC2V1500-6FGG676C serves as the central packet-processing and mapping engine, implementing HDLC controllers, CRC generators, and time-slot interchange logic. Use Value: 48 DCMs enable precise clock domain crossing between 1.544 MHz, 2.048 MHz, and 155.52 MHz domains; 392 I/Os route parallel bus and serial links simultaneously. |
Use Scenario: Bridging PCI-X (133 MHz) host interface to DDR SDRAM (200 MHz) and LVDS camera sensor interface (840 Mbps). IC Role / Device Role / Timing Role: XC2V1500-6FGG676C acts as a protocol-aware interposer, handling address translation, burst arbitration, and skew-compensated data capture. Use Value: DCI-enabled SSTL3_II I/Os interface directly to DDR SDRAM without external terminators; LVDS inputs sample high-speed image data with sub-nanosecond jitter tolerance. |
| Wireless Baseband Processing | Industrial Video Encoder |
Use Scenario: Real-time channel coding (Viterbi, Turbo), modulation (QPSK, 16-QAM), and IF upconversion in 3G Node-B base stations. IC Role / Device Role / Timing Role: XC2V1500-6FGG676C hosts soft-core DSPs and custom datapaths, synchronized via DCM-generated phase-aligned clocks for symbol timing recovery. Use Value: 240 18×18 multipliers execute convolutional decoding in parallel; distributed SelectRAM provides low-latency coefficient storage for adaptive filters. |
Use Scenario: Compressing uncompressed HDMI video (1080p60) using motion-adaptive MPEG-2 encoding before streaming over Gigabit Ethernet. IC Role / Device Role / Timing Role: XC2V1500-6FGG676C implements pixel pipeline, motion estimation, quantization, and entropy coding - all clocked from a single 148.5 MHz reference. Use Value: 48 Block SelectRAM modules buffer full-frame YUV data; DDR-capable I/Os drive external video DACs and SDRAM frame buffers concurrently. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V1500-5FGG676C | Slower -5 speed grade; lower maximum internal clock frequency (≈380 MHz vs. 420 MHz) | Suitable for cost-sensitive designs where timing margin is sufficient and I/O bandwidth ≤ 700 Mbps | Select when design meets timing with relaxed setup/hold margins and avoids premium -6 pricing |
| XC2V2000-6FGG676C | Higher density (2M gates), more CLBs (10,752), DCMs (56), and I/Os (456); same package footprint | Required for larger RTL designs with >1.5M gate utilization or additional high-speed SerDes-like functions | Choose when XC2V1500-6FGG676C utilization exceeds 90% or future scalability is needed within same PCB layout |
Compared with XC2V1500-6FGG676C, the -5 variant trades performance for cost in timing-margin-rich designs, while the XC2V2000-6FGG676C offers headroom for gate growth and I/O expansion - both share identical FGG676 mechanical compatibility but differ in silicon resources and speed binning.
Availability
XC2V1500-6FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and wireless baseband applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for XC2V1500-6FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-first platform FPGAs with integrated IP and system-level architectures.
The Virtex-II family - including XC2V1500-6FGG676C - was engineered for high-performance, high-density applications in telecommunications, networking, and digital signal processing, emphasizing clock integrity, I/O flexibility, and embedded memory.
FAQ
What is the maximum number of user I/Os supported by XC2V1500-6FGG676C?
XC2V1500-6FGG676C supports 392 user I/Os in the FGG676 package. This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT. All 392 I/Os are organized across 12 banks with independent VCCO and DCI support.
Does XC2V1500-6FGG676C support DDR memory interfaces?
Yes, XC2V1500-6FGG676C natively supports DDR SDRAM interfaces through its SelectIO-Ultra I/Os. It provides dedicated DDR input and output registers per pin, programmable IOSTANDARD attributes (SSTL2_I, SSTL2_II), and DCI termination for impedance matching - enabling direct connection to DDR chips without external PHYs or terminators.
What clock management resources does XC2V1500-6FGG676C include?
XC2V1500-6FGG676C integrates 48 Digital Clock Manager (DCM) modules. Each DCM provides zero-delay clock deskew, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to 1/256 of period), and duty-cycle correction - essential for synchronizing multi-domain designs like PCI-X-to-DDR bridges or SONET framers.
Is XC2V1500-6FGG676C compatible with 5V-tolerant I/O standards?
No, XC2V1500-6FGG676C is not 5V-tolerant. Its IOBs operate with VCCO ranging from 1.5V to 3.3V and lack internal 5V clamping. As an input, it can interface with 5V signals only when external current-limiting resistors are used; as an output, it cannot drive 5V logic levels. LVTTL and PCI standards are supported only at 3.3V.
What security features are implemented in XC2V1500-6FGG676C?
XC2V1500-6FGG676C includes on-chip Triple-DES bitstream encryption using one or two 168-bit keys. The encrypted configuration stream is decrypted in hardware during startup, preventing unauthorized readback or cloning. It also supports IEEE 1532 boundary-scan configuration and readback with authentication for secure field updates.
XC2V1500-6FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1920
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 884736
- Number of I/O:
- 392
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC2V1500-6FGG676C FAQ
1.How can I place an order for XC2V1500-6FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V1500-6FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V1500-6FGG676C reliable?
The price and inventory of XC2V1500-6FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V1500-6FGG676C is usually 5 days.
3.What payment methods are accepted for XC2V1500-6FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V1500-6FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V1500-6FGG676C?
XC2V1500-6FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V1500-6FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V1500-6FGG676C?
For technical support, including XC2V1500-6FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V1500-6FGG676C requirements.
6.How does Aetrix verify that XC2V1500-6FGG676C is sourced from the original manufacturer or authorized distributors?
All XC2V1500-6FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V1500-6FGG676C meets industry standards.
7.What is the process for return or replacement of XC2V1500-6FGG676C?
All XC2V1500-6FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V1500-6FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V1500-6FGG676C part is unused and in its original packaging.
Return procedure for XC2V1500-6FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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