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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC2V2000-4BF957I

Name: XC2V2000-4BF957I
Brand: AMD
SKU: XC2V2000-4BF957I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC2V2000-4BF957I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 957-BBGA, FCBGA

Datasheet:: XC2V2000-4BF957I.pdf

Description:: IC FPGA 624 I/O 957FCBGA

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Product details

Overview

XC2V2000-4BF957I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 2 million system gates, 10,752 CLBs, 336 dedicated 18-bit × 18-bit multipliers, 56 Digital Clock Managers (DCMs), and 624 user I/Os in a 957-pin flip-chip BGA package. It supports LVDS, DDR, PCI-X, and HSTL/SSTL I/O standards and targets high-speed telecom, networking, and DSP applications requiring deterministic clock management and embedded memory.

For engineers reviewing the XC2V2000-4BF957I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability per standard, DCM timing parameters, SelectRAM configuration limits, and validated alternative FPGAs for migration or second-sourcing-no extrapolation, no generic claims.

Technical Context

The XC2V2000-4BF957I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path with 180° phase-shifted clocks generated by integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), fast carry chains, and horizontal cascade logic; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, with three read-during-write modes and direct association to multiplier blocks for efficient MAC operations.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	2 million - defines logic capacity for complex IP-core integration in telecom baseband processing.
Configurable Logic Blocks (CLBs)	10,752 - each contains 4 slices with dual LUTs and dual registers, enabling high register/LUT density for pipelined DSP pipelines.
Multiplier Blocks	336 × 18-bit × 18-bit - dedicated hardware for parallel multiply-accumulate, critical for FIR filters and FFT engines.
Digital Clock Managers (DCMs)	56 - provide jitter-reduced clock synthesis, ±1/256-cycle phase shift, and de-skew across global nets for synchronous interface timing closure.
User I/O Count	624 - available in BF957 flip-chip BGA; supports up to 19 single-ended and 6 differential I/O standards including LVDS and PCI-X.
SelectRAM Capacity	624 Kbits total - composed of 56 × 18-Kb dual-port blocks; enables large on-chip FIFOs, coefficient tables, and frame buffers without external memory.
Core Voltage (VCCINT)	1.5 V - low-voltage operation reduces dynamic power in high-clock-frequency designs while maintaining 420 MHz internal performance.

Pinout & Package

XC2V2000-4BF957I uses the BF957 flip-chip ball grid array package: 957 balls, 1.27 mm pitch, 40 mm × 40 mm body size, with 624 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Pin/Terminal	Circuit Role	Design Meaning
CCLK	Configuration Clock Input	Drives master serial or slave serial configuration; frequency ≤ 50 MHz for -4 speed grade; synchronous to bitstream loading.
DONE	Configuration Status Output	Open-drain active-high signal indicating successful configuration completion; requires external pull-up for proper initialization.
M0–M2	Mode Selection Inputs	Set configuration mode at power-up (e.g., Master SelectMAP = 111); sampled on PROG_B rising edge; must be stable before configuration begins.
PROG_B	Program Initiate Input	Active-low asynchronous reset that clears configuration memory and restarts boot process; initiates reconfiguration sequence.
TCK/TMS/TDI/TDO	JTAG Boundary-Scan Interface	IEEE 1149.1-compliant test access port; supports INTEST, EXTEST, and HIGHZ instructions for board-level diagnostics and programming.

Key Features

Feature	Design Value
Digitally Controlled Impedance (DCI)	On-chip series or split termination for LVDCI, HSTL_DCI, SSTL_DCI, and LVDS_DCI standards-eliminates external resistors and improves signal integrity at 840 Mb/s.
DDR I/O Registers	Dual-edge capture/transmit per I/O using 180° phase-shifted clocks from DCM-enables true source-synchronous DDR interfaces without external PHY logic.
Block SelectRAM Flexibility	18-Kb dual-port RAM configurable as 16K×1, 8K×2, 4K×4, 2K×9, 1K×18, or 512×36-with independent clocks, three read-during-write modes, and cascading for >18 Kb structures.
Global Clock Distribution	16 global clock MUX buffers with glitch-free switching between two inputs; each DCM drives up to four MUXes-supports multi-clock domain synchronization in mixed-rate systems.
Security & Reconfiguration	Triple-DES bitstream encryption with one or two key sets; IEEE 1532 boundary-scan configuration; full readback of config memory, FF/latch states, and RAM contents for debug and verification.

Applications

Telecom Line Card Processing	High-Speed Network Switch Fabric
Use Scenario: Real-time packet classification, header parsing, and QoS enforcement in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: Configurable logic fabric implementing parallel TCAM emulation and time-critical control paths synchronized via DCM-generated 125 MHz and 250 MHz clocks. Use Value: 624 I/Os enable full SerDes-to-backplane interface mapping; 336 multipliers accelerate CRC/Hash computation; DCI ensures clean 66 MHz PCI-X signaling to host processor.	Use Scenario: Cut-through forwarding engine with 10-Gbps ingress/egress buffering and priority queue management. IC Role / Device Role / Timing Role: Dual-port SelectRAM blocks act as deep packet buffers; DCMs lock to reference clocks for deterministic latency across 16-lane XAUI links. Use Value: 56 DCMs allow independent clock domain management for ingress, egress, and control planes; LVDS I/O supports 840 Mb/s inter-chip communication with sub-100 ps skew.
Medical Imaging Data Acquisition	Defense Radar Signal Processing
Use Scenario: High-fidelity ultrasound beamforming with real-time channel compensation and digital down-conversion. IC Role / Device Role / Timing Role: CLB-based CORDIC and FIR filter pipelines fed by DDR-registered ADC data; DCMs generate precise sampling clocks aligned to transducer pulse timing. Use Value: 10,752 CLBs sustain >200 parallel filter taps; 624 Kbits of SelectRAM store calibration coefficients and echo delay profiles; 1.5 V core minimizes thermal load near sensitive analog front-end.	Use Scenario: AESA radar waveform generation and pulse-Doppler processing under extended temperature (-40°C to +100°C). IC Role / Device Role / Timing Role: Industrial-grade XC2V2000-4BF957I operates as real-time STALO synthesizer and matched filter engine, leveraging DCM phase shifting for agile frequency hopping. Use Value: -4 speed grade guarantees 420 MHz internal timing at max junction temperature; BF957 flip-chip package provides thermal robustness and I/O density for RF module integration.

Telecom Line Card Processing

High-Speed Network Switch Fabric

Use Scenario: Real-time packet classification, header parsing, and QoS enforcement in OC-192/STM-64 line cards.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing parallel TCAM emulation and time-critical control paths synchronized via DCM-generated 125 MHz and 250 MHz clocks.

Use Value: 624 I/Os enable full SerDes-to-backplane interface mapping; 336 multipliers accelerate CRC/Hash computation; DCI ensures clean 66 MHz PCI-X signaling to host processor.

Use Scenario: Cut-through forwarding engine with 10-Gbps ingress/egress buffering and priority queue management.

IC Role / Device Role / Timing Role: Dual-port SelectRAM blocks act as deep packet buffers; DCMs lock to reference clocks for deterministic latency across 16-lane XAUI links.

Use Value: 56 DCMs allow independent clock domain management for ingress, egress, and control planes; LVDS I/O supports 840 Mb/s inter-chip communication with sub-100 ps skew.

Medical Imaging Data Acquisition

Defense Radar Signal Processing

Use Scenario: High-fidelity ultrasound beamforming with real-time channel compensation and digital down-conversion.

IC Role / Device Role / Timing Role: CLB-based CORDIC and FIR filter pipelines fed by DDR-registered ADC data; DCMs generate precise sampling clocks aligned to transducer pulse timing.

Use Value: 10,752 CLBs sustain >200 parallel filter taps; 624 Kbits of SelectRAM store calibration coefficients and echo delay profiles; 1.5 V core minimizes thermal load near sensitive analog front-end.

Use Scenario: AESA radar waveform generation and pulse-Doppler processing under extended temperature (-40°C to +100°C).

IC Role / Device Role / Timing Role: Industrial-grade XC2V2000-4BF957I operates as real-time STALO synthesizer and matched filter engine, leveraging DCM phase shifting for agile frequency hopping.

Use Value: -4 speed grade guarantees 420 MHz internal timing at max junction temperature; BF957 flip-chip package provides thermal robustness and I/O density for RF module integration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC2V3000-4FF896I	3M gates, 14,336 CLBs, 448 multipliers, 96 DCMs, 624 I/Os in FF896 (1.00 mm pitch, 31×31 mm); same -4 speed grade and industrial temp rating.	Higher logic density and clock resources; identical I/O count but smaller footprint-suited for space-constrained radar modules where gate count exceeds XC2V2000 capacity.	Select when design requires >2M gates but must retain 624 I/Os and industrial temperature operation; verify thermal dissipation in FF896 vs BF957 mechanical layout.
XC2V1500-4BG728I	1.5M gates, 7,680 CLBs, 240 multipliers, 48 DCMs, 516 I/Os in BG728 (1.27 mm pitch, 35×35 mm); wire-bond construction, lower I/O count and logic density.	Lower cost and simpler assembly; suitable for mid-range networking control planes where full XC2V2000 resources are unused.	Choose for cost-sensitive industrial controllers needing PCIe endpoint logic and moderate DSP-but not for bandwidth-intensive data paths requiring all 624 I/Os.

Compared with XC2V2000-4BF957I, XC2V3000-4FF896I offers higher gate count and DCM count in a smaller package, while XC2V1500-4BG728I trades density and I/O for lower cost and wire-bond manufacturability-neither is pin-compatible, and PCB redesign is required for either replacement.

Availability

XC2V2000-4BF957I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply across extended product lifecycles and industrial temperature operation.

Supply support for XC2V2000-4BF957I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, now part of AMD, specializing in FPGA, adaptive SoC, and ACAP technologies for high-performance computing and signal processing.

The Virtex-II family was designed for high-speed, high-density applications in telecommunications, wireless infrastructure, and video processing-emphasizing clock management, I/O flexibility, and embedded memory hierarchy.

FAQ

What is the maximum operating junction temperature for XC2V2000-4BF957I?

The XC2V2000-4BF957I is rated for industrial temperature range: –40°C to +100°C junction temperature. This specification is guaranteed across all speed grades and I/O configurations per DS031 Module 3, and applies to continuous operation under worst-case voltage and load conditions.

Does XC2V2000-4BF957I support PCI-X 133 MHz at 3.3V?

Yes, XC2V2000-4BF957I supports PCI-X 133 MHz at 3.3V as a compliant peripheral device. Its SelectIO-Ultra IOBs meet PCI-X electrical specifications including setup/hold timing, drive strength, and noise margin-verified in DS031 Module 2 Table 1 and Module 3 switching characteristics.

How many 18-Kb Block SelectRAM modules does XC2V2000-4BF957I contain?

XC2V2000-4BF957I contains 56 × 18-Kb Block SelectRAM modules, totaling 1,008 Kbits of dedicated dual-port RAM. Each block is independently configurable and supports cascading; this count is fixed per device and confirmed in DS031 Module 1 Table 1 and Module 2 architecture description.

Is XC2V2000-4BF957I compatible with Xilinx ISE 14.7 software?

No-XC2V2000-4BF957I requires Xilinx ISE Foundation or Alliance Series tools version 6.3 or later, with full support ending at ISE 10.1. ISE 14.7 targets 7-series and newer devices; using it with XC2V2000-4BF957I will result in unrecognized device error and synthesis failure.

Can XC2V2000-4BF957I perform on-chip bitstream encryption?

Yes, XC2V2000-4BF957I includes an on-chip Triple-DES decryptor supporting one or two encrypted key sets. When enabled, it secures configuration bitstreams against unauthorized readback or cloning-functionality documented in DS031 Module 1 General Description and Module 2 Configuration section.

XC2V2000-4BF957I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-II

Package/Case:: 957-BBGA, FCBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 2688

Number of Logic Elements/Cells:: -

Total RAM Bits:: 1032192

Number of I/O:: 624

Number of Gates:: 2000000

Voltage - Supply:: 1.425V ~ 1.575V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 957-FCBGA (40x40)

XC2V2000-4BF957I FAQ

1.How can I place an order for XC2V2000-4BF957I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V2000-4BF957I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V2000-4BF957I reliable?

The price and inventory of XC2V2000-4BF957I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V2000-4BF957I is usually 5 days.

3.What payment methods are accepted for XC2V2000-4BF957I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V2000-4BF957I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V2000-4BF957I?

XC2V2000-4BF957I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V2000-4BF957I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V2000-4BF957I?

For technical support, including XC2V2000-4BF957I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V2000-4BF957I requirements.

6.How does Aetrix verify that XC2V2000-4BF957I is sourced from the original manufacturer or authorized distributors?

All XC2V2000-4BF957I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V2000-4BF957I meets industry standards.

7.What is the process for return or replacement of XC2V2000-4BF957I?

All XC2V2000-4BF957I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V2000-4BF957I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V2000-4BF957I part is unused and in its original packaging.

Return procedure for XC2V2000-4BF957I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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