AMD XC2V2000-4BG575I

Overview

XC2V2000-4BG575I from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (1.27 mm pitch), designed for high-performance telecommunication, networking, and DSP applications requiring up to 408 user I/Os, 10,752 CLB slices, and dual 18-Kb Block SelectRAM resources. It operates across –40°C to +100°C with 1.5 V core supply and supports LVDS, PCI-X, and DDR interfaces.

For engineers reviewing the XC2V2000-4BG575I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including DCI-enabled LVCMOS/LVDS/HSTL/SSTL), DCM-based clock management, and wire-bond BGA package constraints - all specific to the BG575 footprint and Industrial temperature grade.

Technical Context

The XC2V2000-4BG575I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS architecture with 56 × 48 CLB array, 336 dedicated 18-bit × 18-bit multipliers, and 56 Digital Clock Manager (DCM) modules supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution). Its Active Interconnect routing provides predictable delay independent of fanout.

It features Digitally Controlled Impedance (DCI) for on-chip series/split termination across 19 single-ended and 6 differential I/O standards, including LVDCI_33, HSTL_I_DCI, SSTL3_II_DCI, and LVDS_25_DCI, with programmable drive strength (2–24 mA) and dual DDR register paths per I/O. Configuration uses SRAM-based bitstream loading via SelectMAP or JTAG (IEEE 1532).

Key Specifications

Pinout & Package

XC2V2000-4BG575I uses a 575-ball standard BGA (BG575) with 1.27 mm pitch, 31 mm × 31 mm body size, and 408 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC2V2000-4BG575I, XC2V2000-5FG676I offers higher I/O count and speed at the cost of package compatibility, while XC2V3000-4FF896I delivers gate density and I/O scalability for evolving system requirements - both require layout changes and thermal reassessment.

Availability

XC2V2000-4BG575I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial test equipment, broadcast video systems, and PCI-X peripheral acceleration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2V2000-4BG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance reconfigurable computing.

The Virtex-II family was engineered for wireline/wireless infrastructure and high-end DSP, delivering scalable logic density, hardened I/O standards, and deterministic clock management - all implemented in a 0.15 µm process with dual-voltage operation.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-4BG575I?

XC2V2000-4BG575I supports 408 user I/Os in the BG575 package. This count excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT. The I/Os are organized into banks with independent VCCO voltage settings, enabling mixed-standard interfacing.

Does XC2V2000-4BG575I support LVDS signaling with on-chip termination?

Yes, XC2V2000-4BG575I supports LVDS_25_DCI and LVDS_33_DCI I/O standards with built-in digitally controlled impedance. This provides split-termination matching to 100 Ω differential pairs directly on-die, eliminating external resistors and improving signal integrity for 840 Mb/s links without layout compromises.

What clock management resources are integrated into XC2V2000-4BG575I?

XC2V2000-4BG575I integrates 56 Digital Clock Manager (DCM) modules. Each DCM provides jitter-free clock multiplication/division (M/D ratio), precise phase shifting (90°/180°/270° coarse and 1/256-period fine), and self-calibrating de-skew. These feed 16 global clock multiplexer buffers for glitch-free clock domain switching.

Can XC2V2000-4BG575I be configured via JTAG, and what standards does it comply with?

Yes, XC2V2000-4BG575I supports IEEE 1149.1 boundary scan and IEEE 1532 in-system configuration via its TCK/TMS/TDI/TDO pins. It enables full readback of configuration memory, flip-flop states, and Block SelectRAM contents - critical for field debugging and secure bitstream verification.

What is the core voltage requirement for XC2V2000-4BG575I, and how is I/O voltage managed?

XC2V2000-4BG575I requires a 1.5 V ±3% core supply (VCCINT) and a 3.3 V auxiliary supply (VCCAUX). I/O voltage (VCCO) is bank-selectable from 1.5 V to 3.3 V, allowing concurrent operation of LVCMOS15, LVCMOS33, SSTL3, and HSTL interfaces without level shifters - each bank's VCCO must match its assigned I/O standard.