AMD XC2V2000-4BGG575C

Overview

XC2V2000-4BGG575C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 10,752 CLBs, 336 dedicated 18×18 multipliers, 56 Digital Clock Managers (DCMs), and supports up to 408 user I/Os. It is used in high-speed telecom and networking systems requiring DDR memory interfaces, LVDS I/O, and PCI-X compliance.

For engineers reviewing the XC2V2000-4BGG575C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (408), DCM count (56), multiplier density (336), SelectRAM capacity (624 Kb), and support for DCI-terminated single-ended standards (LVDCI_33, HSTL_I_DCI) and differential protocols (LVDS_33, LVPECL_33).

Technical Context

The XC2V2000-4BGG575C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-data-rate (DDR) input/output paths using two phase-opposed clocks generated by integrated DCMs, enabling precise timing alignment for source-synchronous interfaces.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), carry chains, and horizontal cascade logic; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, with three read-during-write modes and cascading capability for larger memory blocks.

Key Specifications

Pinout & Package

XC2V2000-4BGG575C uses a 575-ball standard BGA (BGG575) package with 1.27 mm pitch, 31 mm × 31 mm body size, and Pb-free construction. Pin definitions follow Xilinx's standardized Virtex-II ball map with dedicated power (VCCINT, VCCAUX, VCCO), configuration (CCLK, DONE, M0–M2, PROG_B), JTAG (TCK/TMS/TDI/TDO), and user I/O banks grouped by voltage domain.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2V2000-4BGG575C, the -5 speed grade offers improved timing margin without changing logic or I/O count, while the XC2V3000-4FG676C increases gate count and I/Os at the cost of incompatible packaging and increased power consumption.

Availability

XC2V2000-4BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and high-speed test equipment requiring stable component supply over extended production lifecycles.

Supply support for XC2V2000-4BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and software-defined platforms.

The Virtex-II family was designed for high-performance, high-density system integration in wireline/wireless infrastructure, where deterministic timing, multi-standard I/O, and embedded memory/multiplier resources are critical.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-4BGG575C?

XC2V2000-4BGG575C supports 408 user I/Os in the BGG575 package, as confirmed in Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The device does not support flip-chip packages, so its I/O count is fixed at 408 for this Pb-free standard BGA variant.

Does XC2V2000-4BGG575C support on-chip termination for I/O standards?

Yes, XC2V2000-4BGG575C supports Digitally Controlled Impedance (DCI) for multiple I/O standards including LVDCI_33, HSTL_I_DCI, SSTL3_II_DCI, and GTL_DCI. This feature provides programmable on-chip series or split termination, eliminating the need for external resistors and improving signal integrity for high-speed interfaces like DDR and PCI-X.

What clock management resources are integrated into XC2V2000-4BGG575C?

XC2V2000-4BGG575C integrates 56 Digital Clock Manager (DCM) modules. Each DCM provides de-skew, frequency synthesis (M/D ratio), coarse/fine phase shifting (down to 1/256 clock period), and jitter reduction. These DCMs drive up to 16 global clock multiplexer buffers, enabling robust multi-domain clocking for complex synchronous systems.

Is XC2V2000-4BGG575C compatible with DDR memory interfaces?

Yes, XC2V2000-4BGG575C supports DDR memory interfaces through dedicated DDR input/output registers in its IOBs, programmable I/O standards (SSTL2_I, SSTL2_II, SSTL3_I, SSTL3_II), and DCI termination. Its 408 I/Os allow implementation of full 64-bit DDR2/SDR SDRAM buses with address/control strobes and on-die termination control.

What configuration modes does XC2V2000-4BGG575C support?

XC2V2000-4BGG575C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. It also includes an on-chip DES decryptor for bitstream encryption, supporting one or two triple-DES key sets to secure configuration data against unauthorized access or cloning.