AMD XC2V2000-4BGG575I

Overview

XC2V2000-4BGG575I from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating across –40°C to +100°C industrial temperature range. It integrates 10,752 CLBs, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os with SelectIO-Ultra support for LVDS, SSTL, HSTL, and PCI-X interfaces - deployed in high-speed telecom baseband processing and reconfigurable DSP subsystems.

For engineers reviewing the XC2V2000-4BGG575I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, validated I/O capability per BGG575 footprint, confirmed DCM timing behavior, and direct alternative part comparisons - all grounded in DS031 (v3.5) November 2007 official documentation.

Technical Context

The XC2V2000-4BGG575I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS architecture with SRAM-based configuration, 1.5 V core supply (VCCINT), and dual 3.3 V auxiliary supplies (VCCAUX and VCCO). Its logic fabric comprises 10,752 Configurable Logic Blocks (CLBs), each containing four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascading.

It features 56 independent Digital Clock Manager (DCM) modules supporting precise de-skew, integer/non-integer frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution), alongside 16 global clock multiplexer buffers - enabling deterministic clock distribution for multi-clock domain systems requiring sub-nanosecond skew control.

Key Specifications

Pinout & Package

XC2V2000-4BGG575I uses the BGG575 package: a Pb-free, 1.27 mm pitch, 31 mm × 31 mm standard ball grid array with 575 balls. Of these, 408 are user-configurable I/Os; 15 are dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD); and remaining balls serve VCCINT, VCCAUX, VCCO, GND, and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC2V2000-4BGG575I, XC2V3000-4FF896I offers scalable logic and I/O but demands PCB redesign, while XC3S1600E-4FG484I reduces cost and power at the expense of DCM precision, DCI, and system-gate capacity - making it suitable only for less demanding timing and signal integrity requirements.

Availability

XC2V2000-4BGG575I is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed networking, and industrial motion control applications requiring stable component supply across extended lifecycle planning.

Supply support for XC2V2000-4BGG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA platforms enable customizable digital logic implementation without mask costs.

The Virtex-II family - including XC2V2000-4BGG575I - was engineered for high-performance, high-density reconfigurable computing in telecom, DSP, and networking, emphasizing clock integrity, I/O flexibility, and embedded memory.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-4BGG575I?

XC2V2000-4BGG575I supports 408 user I/Os, as confirmed in Table 6 of DS031 (v3.5) for the BG575/BGG575 package. This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, etc.) and power/ground balls. The I/Os are organized into banks with independent VCCO supplies, enabling mixed-voltage operation across different signaling standards on a single device.

Does XC2V2000-4BGG575I support LVDS I/O at 840 Mb/s?

Yes, XC2V2000-4BGG575I supports LVDS I/O at up to 840 Mb/s, as stated in the "Summary of Virtex-II™ Features" section of DS031 (v3.5). This performance is achievable using the SelectIO-Ultra architecture with proper PCB layout (controlled impedance, matched trace lengths) and termination - and is validated for both point-to-point and Bus-LVDS configurations within the BGG575 package's electrical limits.

What clock management resources does XC2V2000-4BGG575I include?

XC2V2000-4BGG575I includes 56 Digital Clock Manager (DCM) modules and 16 global clock multiplexer buffers. Each DCM provides de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution). These resources enable deterministic multi-clock domain designs - for example, independently managing ADC sampling clocks, DSP processing clocks, and SERDES reference clocks - all within a single XC2V2000-4BGG575I device.

Is XC2V2000-4BGG575I compatible with Pb-free assembly processes?

Yes, XC2V2000-4BGG575I uses the BGG575 package, which is explicitly defined as Pb-free in DS031 (v3.5) Module 1. The "BGG" prefix denotes Pb-free standard BGA construction, compliant with JEDEC J-STD-020 moisture sensitivity level (MSL) 3 and RoHS Directive 2011/65/EU. Reflow profiles must follow Xilinx's recommended Pb-free soldering guidelines in UG079.

Can XC2V2000-4BGG575I perform partial reconfiguration?

Yes, XC2V2000-4BGG575I supports partial reconfiguration as documented in DS031 (v3.5) Module 1. This capability allows dynamic loading of new logic into designated regions while the rest of the design remains operational - critical for adaptive systems like cognitive radios or fault-tolerant controllers. Implementation requires Xilinx ISE 8.2i or later tools and careful floorplanning to isolate reconfigurable modules.