AMD XC2V2000-4FF896I

Overview

XC2V2000-4FF896I from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, operating over –40°C to +100°C industrial temperature range. It integrates 10,752 CLB slices, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os with SelectIO-Ultra support for LVDS, SSTL, HSTL, PCI-X, and DCI termination - deployed in high-speed telecom and DSP infrastructure.

For engineers reviewing the XC2V2000-4FF896I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, I/O standard compatibility, DCM timing behavior, CLB resource mapping, and industrial-grade thermal/power characteristics - all confirmed against DS031 (v3.5) November 2007.

Technical Context

The XC2V2000-4FF896I implements a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture features hierarchical Active Interconnect routing, 16 global clock MUX buffers, and 24 long lines per row/column - enabling predictable timing independent of fanout.

Each IOB supports DDR input/output registers clocked by phase-opposed DCM outputs; CLBs contain dual 4-LUTs with carry chains and distributed RAM; block SelectRAM provides 18 Kb dual-port RAM configurable from 16K×1 to 512×36; and DCI enables on-die series/split termination for 19 single-ended and 8 differential I/O standards.

Key Specifications

Pinout & Package

XC2V2000-4FF896I uses a 31 mm × 31 mm flip-chip fine-pitch BGA (FF896) package with 1.00 mm ball pitch and 896 solder balls. The package supports 624 user I/Os plus 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V2000-4FF896I, XC2V3000-4FF896I offers higher gate count and I/O count within identical mechanical constraints, while XC2V1500-4FF896I reduces static/dynamic power and unit cost at the expense of logic and multiplier resources - enabling scalable migration paths without PCB redesign.

Availability

XC2V2000-4FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and aerospace DSP applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2V2000-4FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as high-performance, SRAM-based FPGAs targeting demanding system-level integration.

The Virtex-II product line was engineered for high-speed, high-density logic implementation in telecom, networking, and DSP systems - emphasizing clock management precision, I/O flexibility, and embedded memory/multiplier resources.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-4FF896I?

XC2V2000-4FF896I supports 624 user I/Os, exclusively in the FF896 flip-chip BGA package. This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The wire-bond packages for XC2V2000 do not support I/Os - only flip-chip variants deliver this I/O count per DS031 Table 2 and Table 5.

Does XC2V2000-4FF896I support DDR memory interfaces?

Yes, XC2V2000-4FF896I supports DDR SDRAM interfaces through its SelectIO-Ultra I/O banks, which include dedicated DDR input and output registers per IOB. When paired with DCM-generated phase-opposed clocks, it achieves source-synchronous timing alignment required for DDR-400 operation, as validated in DS031 Module 3 switching characteristics.

What clock management resources does XC2V2000-4FF896I include?

XC2V2000-4FF896I integrates 56 Digital Clock Manager (DCM) modules. Each DCM provides fully digital clock deskew, integer/non-integer frequency synthesis (M/D ratio), coarse (90°/180°/270°) and fine-grained (±1/256 cycle) phase shifting, and jitter performance under ±150 ps - enabling precise timing control for multi-clock domain designs.

Is XC2V2000-4FF896I compatible with PCI-X 133 MHz?

Yes, XC2V2000-4FF896I is PCI-X 133 MHz compliant at 3.3 V, as specified in DS031 Module 1 Summary of Features and Table 1. Its SelectIO-Ultra I/O banks meet timing and electrical requirements for PCI-X signaling, including setup/hold margins and driver strength, when configured with appropriate VCCO and termination.

What is the core voltage requirement for XC2V2000-4FF896I?

XC2V2000-4FF896I requires a 1.5 V ±3% core supply (VCCINT) for the FPGA logic array, a 3.3 V ±5% auxiliary supply (VCCAUX) for configuration and DCM circuitry, and programmable I/O supply voltages (VCCO) ranging from 1.5 V to 3.3 V depending on selected I/O standard - all defined in DS031 Module 3 DC Characteristics.