AMD XC2V2000-4FFG896C

Overview

XC2V2000-4FFG896C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, featuring 10,752 CLBs, 336 dedicated 18×18 multipliers, 56 Digital Clock Managers (DCMs), and 624 user I/Os. It operates at 1.5 V core voltage (VCCINT), supports LVDS, SSTL, HSTL, and PCI-X I/O standards, and targets high-speed telecom, networking, and DSP systems requiring embedded memory and deterministic clock management.

For engineers reviewing the XC2V2000-4FFG896C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability mapping, DCM timing parameters, SelectRAM configuration options, and validated alternative FPGAs for migration or second-sourcing-no extrapolation, no generic claims.

Technical Context

The XC2V2000-4FFG896C implements a hierarchical, segmented Active Interconnect routing architecture with 16 global clock lines, 24 long lines per row/column, and predictable delay independent of fanout. Its IOBs support DDR input/output registers with 180° phase-shifted clocks generated by integrated DCMs, enabling precise source-synchronous data capture at up to 840 Mb/s.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascade logic; each Block SelectRAM provides 18 Kb dual-port RAM configurable from 16K×1 to 512×36, with three read-during-write modes and direct association to a dedicated 18×18 multiplier for efficient DSP filtering.

Key Specifications

Pinout & Package

XC2V2000-4FFG896C uses the FF896 flip-chip fine-pitch BGA package (1.00 mm pitch, 31 mm × 31 mm body), optimized for thermal dissipation and high I/O count via flip-chip interconnect. Pin definitions follow Xilinx DS031 Module 4, with dedicated banks for VCCO, VCCAUX (3.3 V), configuration (PROG_B, CCLK, DONE), JTAG (TCK/TDI/TDO/TMS), and differential pairs aligned to switch matrices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V2000-4FFG896C, the XCVU3P offers 3× higher logic density and serial transceivers but abandons parallel I/O and DCM-based clocking; the XC6VLX240T reduces gate count by 88% and removes DCI, making it suitable only for less demanding I/O and timing requirements.

Availability

XC2V2000-4FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, network equipment, and defense electronics requiring stable component supply across extended product lifecycles.

Supply support for XC2V2000-4FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions with industry-leading FPGA architectures, tools, and IP ecosystems for high-performance digital system design.

The Virtex-II family was designed for high-speed, high-density applications in telecommunications, wireless infrastructure, and DSP-emphasizing deterministic timing, embedded memory, and flexible I/O with on-die termination.

FAQ

What is the maximum I/O count supported by XC2V2000-4FFG896C?

XC2V2000-4FFG896C supports 624 user I/Os in the FF896 flip-chip BGA package, as confirmed in Table 5 and Table 6 of DS031 Module 1. This includes all user-configurable pins excluding 15 dedicated control signals (e.g., PROG_B, CCLK, TCK) and VBATT. The count is specific to the FF896 variant-wire-bond packages offer fewer I/Os for this device.

Does XC2V2000-4FFG896C support on-chip termination for memory interfaces?

Yes, XC2V2000-4FFG896C supports Digitally Controlled Impedance (DCI) for HSTL_I_DCI, SSTL3_I_DCI, and other standards listed in Table 3 of DS031 Module 2. This enables calibrated series or split on-die termination for DDR/SDR SDRAM and QDR SRAM interfaces without external resistors, improving signal integrity at 133–200 MHz data rates.

What clock management resources are integrated into XC2V2000-4FFG896C?

XC2V2000-4FFG896C integrates 56 Digital Clock Manager (DCM) modules, each capable of zero-delay buffering, frequency synthesis (M/D ratio), coarse/fine phase shifting (±1/256 cycle), and de-skew. These DCMs drive 16 global clock multiplexer buffers and support source-synchronous I/O timing for LVDS and DDR interfaces, as specified in DS031 Module 2.

Can XC2V2000-4FFG896C perform partial reconfiguration in the field?

Yes, XC2V2000-4FFG896C supports partial reconfiguration as documented in DS031 Module 1. This allows dynamic loading of logic modules into designated regions without resetting the entire device-enabling runtime adaptation in radar, software-defined radio, and protocol gateway applications where continuous operation is critical.

What is the core voltage requirement for XC2V2000-4FFG896C?

XC2V2000-4FFG896C requires a nominal 1.5 V ± 3% core supply (VCCINT), as stated in DS031 Module 1 General Description and Module 3 Electrical Characteristics. This voltage powers the CLBs, routing fabric, and block RAM; deviation beyond tolerance risks timing violations or configuration loss.