AMD XC2V2000-4FG676I

Overview

XC2V2000-4FG676I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 2 million system gates, 10,752 CLB slices, 336 dedicated 18×18 multipliers, 56 Digital Clock Managers (DCMs), and 624 user I/Os in a 676-pin Fine-Pitch BGA (FG676) package. It delivers up to 420 MHz internal logic performance and supports 840 Mb/s LVDS I/O for telecom, video processing, and high-speed DSP applications.

For engineers reviewing the XC2V2000-4FG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, DCI termination capability, and industrial temperature operation (–40°C to +100°C).

Technical Context

The XC2V2000-4FG676I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates Configurable Logic Blocks (CLBs), 18 Kb dual-port Block SelectRAM™, dedicated 18×18 multipliers, and 56 fully digital DCMs supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period).

It features SelectIO™-Ultra I/O with 19 single-ended and 6 differential standards-including LVDS, BLVDS, LVPECL, and SSTL-plus Digitally Controlled Impedance (DCI) for on-chip series/split termination. Routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout, supported by 16 global clock lines and 24 long lines per row/column.

Key Specifications

Pinout & Package

XC2V2000-4FG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 1.00 mm pitch, 27 mm × 27 mm body size, and flip-chip interconnect optimized for thermal dissipation and high I/O count. The package supports industrial temperature range (–40°C to +100°C) and Pb-free (FGG676) variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2V2000-4FG676I, XCV2000E-6FG676I offers reduced feature set and older architecture, while XC3S1600E-4FG456C trades industrial reliability and I/O flexibility for lower unit cost and power-neither matches the XC2V2000-4FG676I's combination of 624 I/Os, 56 DCMs, and DCI-enabled signal integrity.

Availability

XC2V2000-4FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial motion controllers, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC2V2000-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-bandwidth, low-latency applications in telecom, video, and DSP-delivering scalable logic density, integrated clock management, and advanced I/O to replace ASICs in rapidly evolving protocols.

FAQ

What is the maximum operating temperature range for XC2V2000-4FG676I?

The XC2V2000-4FG676I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is guaranteed per DS031 (v3.5) Module 1 and applies to all functional blocks including CLBs, DCMs, SelectRAM, and I/O banks when powered within specified VCCINT, VCCAUX, and VCCO limits.

Does XC2V2000-4FG676I support LVDS I/O at full speed?

Yes, XC2V2000-4FG676I supports LVDS signaling at up to 840 Mb/s per differential pair, as confirmed in the "SelectIO™-Ultra Technology" section of DS031. It includes current-mode drivers, on-chip termination via DCI, and dedicated input/output registers for source-synchronous capture aligned to DCM-generated clocks.

How many Digital Clock Managers (DCMs) does XC2V2000-4FG676I contain?

XC2V2000-4FG676I contains exactly 56 Digital Clock Managers (DCMs), as documented in Table 1 ("Virtex-II Family Members") of DS031. Each DCM provides independent clock synthesis, de-skew, and phase-shifting capabilities, with up to four DCMs able to drive the 16 global clock MUX buffers.

Is XC2V2000-4FG676I pin-compatible with other Virtex-II devices in FG676 packaging?

All Virtex-II devices offered in FG676/FGG676 packages-including XC2V1500, XC2V2000, and XC2V3000-are pinout compatible per DS031 Table 6. However, I/O bank voltage assignments, DCM availability, and logic resource counts differ; design migration requires functional validation and constraint file updates.

What configuration modes are supported by XC2V2000-4FG676I?

XC2V2000-4FG676I supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Configuration is SRAM-based and reprogrammable; optional Triple-DES encryption secures bitstreams against unauthorized readback or cloning.