AMD XC2V2000-4FGG676C

Overview

XC2V2000-4FGG676C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 10,752 CLB slices, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os. It delivers high-speed logic, embedded memory, and advanced clock management for telecom infrastructure and high-bandwidth data processing.

For engineers reviewing the XC2V2000-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (624), DCM count (56), multiplier density (336), SelectRAM capacity (624 Kb block RAM), and support for LVDS/DDR/HSTL/SSTL I/O standards with Digitally Controlled Impedance (DCI).

Technical Context

The XC2V2000-4FGG676C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic. Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, while dedicated 18×18 multipliers enable efficient DSP filtering and read-multiply-accumulate operations.

Key Specifications

Pinout & Package

XC2V2000-4FGG676C uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, Pb-free construction, and flip-chip interconnect delivering 624 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V3000-4FF896C, XC2V2000-4FGG676C offers identical speed grade and DCI/LVDS capability in a smaller, wire-bond-compatible FGG676 package; versus XC3S1500-4FGG456C, it delivers superior clock precision, higher I/O count, and production-proven telecom interface compliance at higher power and cost.

Availability

XC2V2000-4FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging back-end processing, defense radar signal processing, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2V2000-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, historically focused on FPGA, SoC, and adaptive compute solutions for high-performance systems.

The Virtex-II family was designed for demanding applications including telecommunications, wireless infrastructure, video processing, and DSP - emphasizing high-speed I/O, deterministic clocking, and scalable logic density with silicon-proven reliability.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-4FGG676C?

XC2V2000-4FGG676C supports 624 user I/Os, as confirmed in Table 6 of DS031-1 (v3.5) for the FGG676 package variant. This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, etc.) and VBATT. All 624 I/Os are fully programmable for single-ended or differential signaling, including LVDS, SSTL, and HSTL standards with Digitally Controlled Impedance (DCI) support.

Does XC2V2000-4FGG676C include on-chip clock management resources?

Yes, XC2V2000-4FGG676C integrates 56 Digital Clock Manager (DCM) modules. Each DCM provides fully digital clock de-skew, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to ±1/256 of clock period), and jitter reduction. These DCMs drive up to 16 global clock multiplexer buffers and support multiple independent clock domains essential for high-speed interface synchronization in the XC2V2000-4FGG676C.

What I/O standards are supported by XC2V2000-4FGG676C with Digitally Controlled Impedance (DCI)?

XC2V2000-4FGG676C supports DCI for LVDCI (1.5V–3.3V), HSTL_I/II/III/IV_DCI, SSTL18/2/3_DCI, GTL_DCI, GTLP_DCI, and LVDS_25_DCI. DCI provides on-die series, split, or single termination matching board trace impedance - eliminating external resistors and improving signal integrity for high-speed parallel buses and memory interfaces in the XC2V2000-4FGG676C.

Is XC2V2000-4FGG676C compatible with boundary-scan testing per IEEE 1149.1?

Yes, XC2V2000-4FGG676C includes full IEEE 1149.1 (JTAG) boundary-scan logic with BYPASS, SAMPLE, EXTEST, INTEST, and HIGHZ instructions. The Test Access Port (TAP) supports configuration, debug, and production test via TCK/TMS/TDI/TDO pins. Boundary-scan operates concurrently with normal device operation in system mode, enabling in-circuit verification and fault isolation for the XC2V2000-4FGG676C.

What configuration modes does XC2V2000-4FGG676C support?

XC2V2000-4FGG676C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Configuration is SRAM-based and in-system reprogrammable. Fast SelectMAP enables high-speed parallel loading, while triple-DES bitstream encryption ensures IP protection during configuration of the XC2V2000-4FGG676C.