AMD XC2V2000-4FGG676I

Overview

XC2V2000-4FGG676I from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, rated for industrial temperature range (–40°C to +100°C), with 56 Configurable Logic Blocks (CLBs), 336 dedicated 18×18 multipliers, and 624 user I/Os. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring deterministic clock management and DDR I/O support.

For engineers reviewing the XC2V2000-4FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include its 12 Digital Clock Managers (DCMs), dual-port 18-Kb Block SelectRAM resources, LVDS/BLVDS/LVPECL differential I/O capability, and compatibility with PCI-X 133 MHz and DDR SDRAM interfaces.

Technical Context

The XC2V2000-4FGG676I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support single-ended standards including LVTTL, LVCMOS (1.5V–3.3V), SSTL, HSTL, and PCI-X, plus differential standards such as LVDS, BLVDS, LVPECL, and LDT - all with programmable drive strength and Digitally Controlled Impedance (DCI) termination.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; block memory supports 16K×1 to 512×36 configurations with three read-during-write modes; and DCMs provide precise de-skew, ±1/256-cycle phase shift resolution, and M/D frequency synthesis across up to 12 independent clock domains.

Key Specifications

Pinout & Package

XC2V2000-4FGG676I uses the FGG676 package: 676-ball fine-pitch BGA (1.00 mm pitch), Pb-free, industrial temperature grade. Pin definitions follow Xilinx DS031 Module 4; I/O banks are grouped into 8 regions (Bank 0–7), each supporting independent VCCO and VREF settings. Dedicated configuration pins (CCLK, DONE, PROG_B, M[0:2]) and JTAG TAP signals (TCK/TMS/TDI/TDO) are fixed-location.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V2000-4FGG676I, the –5 speed grade offers tighter timing margins without layout changes, while the XC2V3000-4FF896I provides gate expansion at the cost of non-interchangeable packaging and increased power delivery complexity.

Availability

XC2V2000-4FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, avionics data concentrators, and industrial motion controllers requiring stable component supply across extended product lifecycles.

Supply support for XC2V2000-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed industry-standard FPGA architectures and design toolchains.

The Virtex-II family was engineered for high-performance, system-level integration in bandwidth-intensive applications - delivering hardened arithmetic, memory, and clock resources alongside flexible I/O to replace ASICs in telecom, video, and DSP markets.

FAQ

What is the maximum operating junction temperature for XC2V2000-4FGG676I?

The XC2V2000-4FGG676I is specified for industrial temperature operation with a junction temperature range of –40°C to +100°C. This rating is validated per Xilinx DS031 specifications and applies under defined power dissipation and PCB thermal management conditions. The "I" suffix explicitly denotes industrial-grade thermal qualification for XC2V2000-4FGG676I.

Does XC2V2000-4FGG676I support DDR2 SDRAM interfaces?

XC2V2000-4FGG676I supports DDR SDRAM interfaces through its SelectIO-Ultra I/O architecture with built-in DDR input and output registers, but does not natively support DDR2-specific timing or command protocols. Implementation of DDR2 requires external logic or soft-core controllers; the device's 624 I/Os and DCMs enable robust clock forwarding and strobe alignment essential for DDR2 PHY layer design.

How many global clock lines are available in XC2V2000-4FGG676I?

XC2V2000-4FGG676I provides 16 global clock multiplexer buffers, with eight available per quadrant, and supports up to 12 Digital Clock Manager (DCM) modules. Each DCM can drive up to four of the 16 global clock MUX buffers, enabling hierarchical, low-skew clock distribution across large logic partitions in XC2V2000-4FGG676I designs.

Is XC2V2000-4FGG676I pin-compatible with other Virtex-II devices in FGG676 packaging?

Yes - all Virtex-II devices offered in the FGG676 package (including XC2V1000, XC2V1500, XC2V2000, and XC2V3000) share identical pinouts and mechanical footprints. This allows direct substitution within the same package family for density scaling, provided I/O banking constraints and voltage requirements are verified per design. XC2V2000-4FGG676I maintains full physical compatibility with these variants.

What configuration modes does XC2V2000-4FGG676I support?

XC2V2000-4FGG676I supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). These modes enable flexible programming via microcontroller, PROM, or JTAG interface. The XC2V2000-4FGG676I also includes on-chip DES decryption for secure bitstream loading in all modes except boundary-scan.