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AMD XC2V2000-5BG575I

Part No.:
XC2V2000-5BG575I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
575-BBGA
Datasheet:
AetrixXC2V2000-5BG575I.pdf
Description:
IC FPGA 408 I/O 575BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,999

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Product details

Overview

XC2V2000-5BG575I from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (1.27 mm pitch), designed for high-performance telecommunication, networking, and DSP systems requiring up to 408 user I/Os, 10,752 CLB slices, and dual 18-Kb Block SelectRAM resources. It operates across –40°C to +100°C with 1.5 V core supply and supports LVDS, PCI-X, and DDR interfaces.

For engineers reviewing the XC2V2000-5BG575I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including DCI-enabled LVCMOS/LVDS/SSTL), DCM timing parameters, package-specific I/O count, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V2000-5BG575I implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with 56 × 48 CLB array, 336 dedicated 18-bit × 18-bit multipliers, and 56 Digital Clock Manager (DCM) modules supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period). Its Active Interconnect routing provides predictable delay independent of fanout.

It features 408 user I/Os in BG575/BGG575 package with support for 19 single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and 6 differential standards (LVDS, BLVDS, LVPECL, LDT), plus Digitally Controlled Impedance (DCI) for on-chip series/split termination across multiple I/O voltages (1.5 V–3.3 V).

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 2 million - defines logic density for complex IP integration in telecom baseband processing.
CLB Slices 10,752 - provides 43,008 LUTs and 43,008 registers for synchronous logic and distributed RAM.
User I/O Count 408 - maximum usable pins in BG575 package, excluding 15 control pins and VBATT.
Block RAM 624 Kb - 56 × 18-Kb dual-port SelectRAM blocks enabling embedded FIFOs and buffer memory.
DCM Modules 56 - each supports clock de-skew, multiplication/division, and ±180° phase shift for multi-clock domain synchronization.
I/O Standards 19 single-ended + 6 differential - includes PCI-X (133 MHz), LVDS (840 Mb/s), and SSTL-2/3 for memory interface compliance.
Digital Control Impedance On-chip series/split termination - eliminates external resistors for LVCMOS/LVDS/SSTL, reducing BOM and layout complexity.

Pinout & Package

XC2V2000-5BG575I uses the BG575 standard ball grid array package (1.27 mm pitch, 31 mm × 31 mm), with 408 user I/Os arranged across peripheral rows and corners. Power and ground balls are distributed per Xilinx's recommended decoupling pattern; configuration pins (CCLK, DONE, M0–M2, PROG_B) and JTAG TAP signals occupy fixed locations per DS031 Module 4.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration Clock Input Drives internal configuration state machine during master/slave serial or SelectMAP mode; requires clean 0–100 MHz clock.
DONE Configuration Status Output Open-drain signal pulled high externally; goes high after successful bitstream loading and startup sequence completion.
M0–M2 Mode Selection Inputs Set configuration mode at power-up (e.g., M2:M0 = 000 → Slave Serial; 010 → Master SelectMAP).
PROG_B Program Initiate Input Active-low asynchronous reset that clears configuration memory and restarts loading sequence.
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port used for programming, debugging, and readback verification.

Key Features

Feature Design Value
Digitally Controlled Impedance (DCI) On-die series/split termination for LVCMOS, SSTL, and LVDS - eliminates external resistors and improves signal integrity without layout changes.
DDR I/O Registers Dual-edge capture/transmit per I/O path using DCM-generated 180°-phase-shifted clocks - enables true 840 Mb/s LVDS data rates without external DDR PHY.
18 × 18 Multiplier Blocks 336 dedicated hard macros - accelerate FIR filters, FFT engines, and modulation/demodulation in wireless baseband designs.
Block SelectRAM Resources 56 × 18-Kb dual-port RAM - supports concurrent read/write operations for ping-pong buffering and real-time packet processing.
Global Clock Distribution 16 global clock MUX buffers + 56 DCMs - ensures sub-100 ps skew across 408 I/Os for time-critical synchronization in packet-switching fabric.

Applications

Wireless Baseband Processing High-Speed Network Switch Fabric

Use Scenario: Real-time channel coding, modulation (QAM/OFDM), and MIMO signal processing in 3G/4G LTE infrastructure.

IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing soft-core DSP pipelines with deterministic latency via DCM-synchronized I/O and internal routing.

Use Value: 336 multiplier blocks and 624 Kb block RAM enable parallel filter banks and symbol mapping tables without external memory bottlenecks.

Use Scenario: Line-rate packet classification, forwarding table lookup, and traffic shaping in 10 GbE edge switches.

IC Role / Device Role / Timing Role: Programmable forwarding engine interfacing to external QDR SRAM and SerDes PHYs via 408 LVDS-capable I/Os.

Use Value: 840 Mb/s LVDS I/O and PCI-X 133 MHz compliance allow direct attachment to high-bandwidth memory and host controllers.

Video Compression Acceleration Industrial Machine Vision Controller

Use Scenario: H.264 intra-frame prediction, motion estimation, and entropy encoding in broadcast encoders.

IC Role / Device Role / Timing Role: Reconfigurable video pipeline with pixel-level parallelism, synchronized by DCM-generated pixel clocks and frame strobes.

Use Value: 10,752 CLB slices provide sufficient LUT/register resources to implement full HD (1920×1080@60fps) real-time compression logic.

Use Scenario: High-resolution image acquisition, real-time defect detection, and servo control in automated optical inspection systems.

IC Role / Device Role / Timing Role: Deterministic I/O controller managing Camera Link or CoaXPress sensors, line-scan cameras, and precision motion axes.

Use Value: DCI-enabled LVDS I/O ensures noise-immune sensor data capture at >80 MHz pixel rates; 56 DCMs support multi-phase encoder feedback timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system acceleration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2V3000-5FG676I 3M gates, 516 I/Os, FG676 (1.00 mm pitch) - higher density but incompatible footprint and thermal profile. Required when >2M gates needed for larger protocol stacks or multi-channel processing; not drop-in due to different package and pinout. Select only if design has space for 27×27 mm fine-pitch BGA and requires ≥3M gates.
XC3S1600E-4FG484I Spartan-3E family, 1.6M logic cells, 370 I/Os, lower power (1.2 V core), no DCM - uses DLL instead, limited I/O standard support. Better suited for cost-sensitive industrial control where PCI-X/LVDS bandwidth is unnecessary and thermal envelope is constrained. Choose for legacy migration where 1.5 V core supply and advanced clock management are not required.

Compared with XC2V2000-5BG575I, XC2V3000-5FG676I offers higher gate count and I/O count but demands PCB redesign, while XC3S1600E-4FG484I reduces cost and power at the expense of clock precision, memory bandwidth, and high-speed I/O capability.

Availability

XC2V2000-5BG575I is available at Aetrix Electronics and suitable for wireless infrastructure, network switching, and industrial vision systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2V2000-5BG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for FPGA, SoC, and adaptive compute platforms.

The Virtex-II family was engineered for high-performance, high-density system-on-chip integration in telecom, aerospace, and test equipment - emphasizing clock management fidelity, I/O flexibility, and embedded memory scalability.

FAQ

What is the maximum operating temperature range for the XC2V2000-5BG575I?

The XC2V2000-5BG575I is rated for industrial operation from –40°C to +100°C junction temperature, as indicated by the "I" suffix in its part number. This makes it suitable for deployment in base station radios, outdoor networking gear, and factory-floor vision systems where ambient temperatures exceed commercial limits.

Does the XC2V2000-5BG575I support PCI-X 133 MHz interface directly?

Yes, the XC2V2000-5BG575I natively supports PCI-X 133 MHz at 3.3 V through its SelectIO-Ultra I/O blocks. It meets timing and electrical requirements per PCI-X specification without external level shifters or terminators, provided VCCO = 3.3 V and proper board layout guidelines are followed.

How many 18-Kb Block SelectRAM resources does the XC2V2000-5BG575I contain?

The XC2V2000-5BG575I contains 56 Block SelectRAM modules, each delivering 18 Kb of dual-port RAM. This totals 1,008 Kb (1.008 Mb) of configurable memory, usable as 16K×1 to 512×36 configurations with three read-during-write modes per port.

Can the XC2V2000-5BG575I perform true DDR I/O without external clock generation?

Yes. The XC2V2000-5BG575I integrates Digital Clock Managers (DCMs) capable of generating two 180°-phase-shifted clocks from a single input. Paired with dedicated DDR registers in IOBs, this enables true double-data-rate capture and transmission - e.g., 840 Mb/s LVDS - without external DDR clock synthesizers.

Is Digitally Controlled Impedance (DCI) supported on all I/O standards for the XC2V2000-5BG575I?

No. DCI is supported only on specific standards listed in DS031 Table 3, including LVDCI_33/25/18/15, SSTL18/2/3_DCI, HSTL_I/II/III/IV_DCI, GTL_DCI, GTLP_DCI, and LVDS_25_DCI. It is not available for LVTTL, PCI, or AGP-2X I/O standards.

XC2V2000-5BG575I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II
Package/Case:
575-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
-
Total RAM Bits:
1032192
Number of I/O:
408
Number of Gates:
2000000
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
575-BGA (31x31)

XC2V2000-5BG575I FAQ

1.How can I place an order for XC2V2000-5BG575I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2V2000-5BG575I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2V2000-5BG575I reliable?

The price and inventory of XC2V2000-5BG575I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V2000-5BG575I is usually 5 days.

3.What payment methods are accepted for XC2V2000-5BG575I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V2000-5BG575I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2V2000-5BG575I?

XC2V2000-5BG575I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2V2000-5BG575I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2V2000-5BG575I?

For technical support, including XC2V2000-5BG575I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V2000-5BG575I requirements.

6.How does Aetrix verify that XC2V2000-5BG575I is sourced from the original manufacturer or authorized distributors?

All XC2V2000-5BG575I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V2000-5BG575I meets industry standards.

7.What is the process for return or replacement of XC2V2000-5BG575I?

All XC2V2000-5BG575I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V2000-5BG575I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2V2000-5BG575I part is unused and in its original packaging.

Return procedure for XC2V2000-5BG575I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2V2000-5BG575I Tags

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