AMD XC2V2000-5BGG575C

Overview

XC2V2000-5BGG575C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 10,752 CLBs, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os. It delivers high-speed logic, embedded memory, and advanced clock management for telecom infrastructure and high-bandwidth data processing.

For engineers reviewing the XC2V2000-5BGG575C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (624), DCM count (56), block RAM capacity (624 Kbits), multiplier density (336), and support for LVDS/DDR/SSTL/HSTL I/O standards - all critical for high-performance reconfigurable computing and protocol bridging designs.

Technical Context

The XC2V2000-5BGG575C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, programmable drive strength (2–24 mA), and Digitally Controlled Impedance (DCI) for on-chip termination across 19 single-ended and 6 differential I/O standards.

Internally, it features 56 fully digital DCMs enabling precise de-skew, fine-grained phase shifting (1/256 period resolution), and flexible M/D frequency synthesis. Each DCM drives up to four global clock MUX buffers, and the device provides 16 global clock nets - eight per quadrant - with glitch-free clock switching capability.

Key Specifications

Pinout & Package

XC2V2000-5BGG575C uses a 1.27 mm pitch, 31 mm × 31 mm standard BGA package (BGG575) with 575 balls, including 624 user I/Os (excluding 15 dedicated configuration/control pins: CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC2V3000-5FF896C, the XC2V2000-5BGG575C offers identical speed and architecture but trades I/O count and gate density for simpler PCB assembly and lower thermal load; versus XC3S1600E-4FG456C, it provides superior clock control, I/O flexibility, and signal integrity - essential for telecom and imaging applications demanding sub-nanosecond timing accuracy.

Availability

XC2V2000-5BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and industrial vision processing requiring stable component supply across extended production lifecycles.

Supply support for XC2V2000-5BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022. It developed industry-standard programmable logic architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for high-bandwidth, low-latency reconfigurable computing in telecom, wireless, video, and DSP applications - emphasizing clock precision, I/O versatility, and large-scale logic integration.

FAQ

What is the maximum supported I/O standard voltage for XC2V2000-5BGG575C?

The XC2V2000-5BGG575C supports VCCO voltages of 1.5 V, 1.8 V, 2.5 V, and 3.3 V depending on I/O standard selection. LVCMOS15, HSTL_I, and SSTL18_I require 1.5 V; LVCMOS18 and HSTL_I_18 require 1.8 V; LVCMOS25 and SSTL2 require 2.5 V; LVTTL, PCI-X, and SSTL3 require 3.3 V. VCCAUX is fixed at 3.3 V.

Does XC2V2000-5BGG575C support JTAG boundary-scan testing?

Yes, XC2V2000-5BGG575C fully complies with IEEE 1149.1 (JTAG) and IEEE 1532 standards. Its Test Access Port (TAP) supports BYPASS, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions for configuration, debugging, and production test.

How many 18-Kb Block SelectRAM modules does XC2V2000-5BGG575C contain?

XC2V2000-5BGG575C contains 56 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. This yields 1,008 Kb (1,032,192 bytes) of block RAM, configurable from 16K×1 to 512×36 bits with three read-during-write modes.

Can XC2V2000-5BGG575C perform partial reconfiguration?

Yes, XC2V2000-5BGG575C supports partial reconfiguration via SelectMAP interface. Specific CLB columns or RAM blocks can be reloaded while the rest of the device remains operational - enabling dynamic function swapping in real-time systems such as adaptive radio base stations.

What is the role of the HSWAP_EN pin on XC2V2000-5BGG575C?

The HSWAP_EN pin on XC2V2000-5BGG575C controls hot-swap I/O behavior. When asserted high, it enables weak pull-up/pull-down resistors on I/O pins during configuration, preventing bus contention when inserted into live backplanes. It must be tied high or low before configuration begins.