AMD XC2V2000-5BGG575I

Overview

XC2V2000-5BGG575I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 2 million system gates, 10,752 CLBs, 56 Digital Clock Managers (DCMs), and 624 user I/Os in a 575-pin standard BGA (BGG575) package. It supports LVDS, DDR, PCI-X, and SSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and DSP applications.

For engineers reviewing the XC2V2000-5BGG575I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O capability mapping, DCM timing parameters, DCI termination support, and industrial-temperature (-40°C to +100°C) operation context - all specific to the BGG575 wire-bond package variant.

Technical Context

The XC2V2000-5BGG575I implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with 56 Configurable Logic Blocks (CLBs) per column × 48 rows, delivering 10,752 total CLBs and 336 dedicated 18×18 multipliers. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

It integrates 56 DCM modules supporting precise de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution), alongside 16 global clock MUX buffers. The device uses 1.5V VCCINT, 3.3V VCCAUX, and programmable VCCO per bank (1.5V–3.3V) with Digitally Controlled Impedance (DCI) for on-chip series/split termination across 19 single-ended and 6 differential I/O standards.

Key Specifications

Pinout & Package

XC2V2000-5BGG575I is housed in a Pb-free, wire-bond, standard-pitch (1.27 mm) Ball Grid Array package designated BGG575, measuring 31 mm × 31 mm with 575 balls. Of these, 408 are user-configurable I/Os; the remaining include 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V3000-5FG676I and XC2V1500-5BG575I, the XC2V2000-5BGG575I uniquely balances 2M gate capacity, 408 I/Os in a standard-pitch BGA, full DCI support, and industrial temperature operation - making it optimal for space-constrained, mixed-signal embedded systems requiring verified signal integrity and long-term availability.

Availability

XC2V2000-5BGG575I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and medical imaging systems requiring stable component supply, long-lifecycle support, and industrial-temperature qualification.

Supply support for XC2V2000-5BGG575I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as high-performance, system-level FPGAs for demanding compute and interface applications.

The Virtex-II product line was engineered for high-speed, high-density logic implementation in telecommunications, networking, and DSP systems - emphasizing clock management, I/O flexibility, and embedded memory integration.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-5BGG575I?

The XC2V2000-5BGG575I supports 408 user I/O pins in the BGG575 package, as confirmed in Table 6 of DS031 Module 1. This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The value is fixed for this device/package combination and does not vary with speed grade or temperature range.

Does XC2V2000-5BGG575I support LVDS signaling with internal termination?

Yes, XC2V2000-5BGG575I supports LVDS_25_DCI and LVDS_33_DCI I/O standards with built-in digitally controlled impedance for split termination. This capability is documented in Table 3 of DS031 Module 2 and eliminates the need for external 100Ω differential termination resistors on the PCB.

What clock management resources are integrated into XC2V2000-5BGG575I?

The XC2V2000-5BGG575I integrates 56 Digital Clock Manager (DCM) modules, each providing de-skew, frequency synthesis (M/D ratio), and coarse/fine phase shifting. These DCMs drive 16 global clock MUX buffers and support up to 420 MHz internal logic speed, as specified in DS031 Module 1 and Module 3.

Is XC2V2000-5BGG575I compatible with Pb-free soldering processes?

Yes, XC2V2000-5BGG575I uses a Pb-free BGG575 package compliant with JEDEC J-STD-020 moisture sensitivity level (MSL) 3 and RoHS Directive 2011/65/EU. Reflow profiles must follow Xilinx's recommended Pb-free thermal cycle (peak 260°C, 20–40 sec above 217°C), per DS031 Module 1 footnote.

Can XC2V2000-5BGG575I perform partial reconfiguration in-system?

Yes, XC2V2000-5BGG575I supports partial reconfiguration as stated in DS031 Module 1. This allows dynamic loading of logic modules into defined regions without resetting the entire device - enabling adaptive computing in telecom and instrumentation applications where continuous operation is critical.