AMD XC2V2000-5FF896I

Overview

XC2V2000-5FF896I from Xilinx is a high-density, industrial-grade Virtex-II platform FPGA with 2 million system gates, 10,752 configurable logic blocks (CLBs), 56 Digital Clock Managers (DCMs), and 624 user I/Os in an FF896 flip-chip fine-pitch BGA package. It supports LVDS, DDR, PCI-X, and HSTL I/O standards and delivers up to 420 MHz internal clock speed for telecom, networking, and DSP applications.

For engineers reviewing the XC2V2000-5FF896I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O capability per standard, DCM timing parameters, SelectRAM memory configurations, and confirmed flip-chip package constraints - all extracted from DS031 (v3.5) November 2007 official specification.

Technical Context

The XC2V2000-5FF896I implements Xilinx's IP-Immersion architecture with 56 independent DCMs enabling precise clock de-skew, frequency synthesis (M/D ratio), and ±1/256-cycle phase shifting. Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements (DFF/latch), carry chains, and horizontal cascade logic. Block SelectRAM resources provide 18-Kb dual-port RAM configurable from 16K×1 to 512×36, while dedicated 18×18 multipliers support efficient read/multiply/accumulate operations.

Key Specifications

Pinout & Package

XC2V2000-5FF896I is housed in an FF896 flip-chip fine-pitch BGA package with 896 balls, 1.00 mm pitch, and 31 mm × 31 mm body size. The package supports 624 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V2000-5FF896I, XC2V3000-5FF896I offers higher gate count and DCM count within identical packaging - enabling scalability without PCB redesign - while XC2V2000-4FF896I trades speed for lower static/dynamic power and simpler timing closure, retaining full functional equivalence.

Availability

XC2V2000-5FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and high-speed network switch applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XC2V2000-5FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercial FPGA and continues to lead in adaptive computing architectures.

The Virtex-II family was designed for high-performance, high-density logic implementation in telecom, wireless, and DSP systems - delivering ASIC-like performance with SRAM-based reprogrammability and comprehensive I/O flexibility.

FAQ

What is the maximum operating junction temperature for XC2V2000-5FF896I?

The XC2V2000-5FF896I is rated for industrial temperature range: –40°C to +100°C junction temperature (Tj). This rating is defined by the "I" suffix in the part number and validated across all DC and switching characteristics in DS031 Module 3. Operation outside this range may result in timing violations or configuration loss. Thermal design must ensure sustained Tj ≤ 100°C under worst-case power dissipation conditions.

Does XC2V2000-5FF896I support IEEE 1532 boundary-scan configuration?

Yes, XC2V2000-5FF896I fully supports IEEE 1532 boundary-scan configuration via its JTAG TAP controller. The device implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions as specified in DS031 Module 2. This enables in-system programming, verification, and debug without requiring external configuration PROMs.

How many 18-Kb Block SelectRAM resources does XC2V2000-5FF896I contain?

XC2V2000-5FF896I contains 56 × 18-Kb Block SelectRAM resources, totaling 1,008 Kb of dedicated dual-port RAM. Each block is independently configurable from 16K×1 to 512×36 bits and supports three read-during-write modes. These resources are physically distributed across the array and accessible via four switch matrices per block, as confirmed in Table 1 of DS031 Module 1.

Is XC2V2000-5FF896I pin-compatible with other Virtex-II devices in FF896 packages?

No - XC2V2000-5FF896I is not pin-compatible with other Virtex-II devices in FF896 packages. While FF896 is a shared package type, DS031 Table 6 explicitly lists FF896 as available only for XC2V1000, XC2V1500, and XC2V2000. Pin assignments differ between densities due to internal routing and I/O bank allocation; no cross-density pin-to-pin compatibility is guaranteed or documented.

What I/O standards with Digitally Controlled Impedance (DCI) are supported by XC2V2000-5FF896I?

XC2V2000-5FF896I supports DCI for LVDCI (LVCMOS), HSTL_I/II/III/IV_DCI, SSTL18/2/3_DCI, GTL_DCI, GTLP_DCI, and LVDS_25_DCI/LVDSEXT_25_DCI, as listed in DS031 Module 2 Table 3. DCI provides on-die series or split termination matching reference resistors - eliminating external components and improving signal integrity for point-to-point and multidrop topologies.