AMD XC2V2000-5FFG896C

Overview

XC2V2000-5FFG896C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 10,752 CLB slices, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os supporting LVDS, SSTL, HSTL, PCI-X, and DCI termination - deployed in high-speed networking line cards requiring deterministic clock management and DDR memory interfacing.

For engineers reviewing the XC2V2000-5FFG896C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (624), DCM count (56), block RAM capacity (624 Kbits), multiplier density (336), and FF896 package thermal/mechanical compatibility with high-density PCB layouts.

Technical Context

The XC2V2000-5FFG896C implements Xilinx's IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, 1.5 V core supply (VCCINT), and dual 3.3 V auxiliary supplies (VCCAUX, VCCO). Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL, LDT) standards, with Digitally Controlled Impedance (DCI) enabling on-die series or split termination. The device includes 56 DCMs for de-skew, phase shifting (1/256 period resolution), and M/D frequency synthesis, plus 16 global clock MUX buffers.

Key Specifications

Pinout & Package

XC2V2000-5FFG896C is housed in a 31 mm × 31 mm flip-chip fine-pitch BGA (FF896) package with 1.00 mm ball pitch, optimized for thermal dissipation and signal integrity in high-pin-count applications. Pin definitions follow Xilinx DS031 Module 4 (Pinout Information), with 624 user I/Os distributed across 32 banks, plus dedicated configuration, clock, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V2000-5FFG896C, XC2V3000-5FF896C offers higher gate count and clock resources at identical package size, while XC2V2000-4FF896C trades performance margin for lower power and cost - both require no PCB layout changes due to pin-to-pin compatibility within the FF896 footprint.

Availability

XC2V2000-5FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging systems, and high-speed test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC2V2000-5FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance digital system design.

The Virtex-II family was designed for demanding applications in telecommunications, networking, and DSP - delivering platform-level integration of logic, memory, arithmetic, and clock management in a single chip.

FAQ

What is the maximum operating frequency of the XC2V2000-5FFG896C?

The XC2V2000-5FFG896C has a -5 speed grade, guaranteeing internal clock speeds up to 420 MHz and I/O data rates up to 840 Mb/s under specified conditions. Actual achievable frequency depends on design placement, routing, and temperature; timing analysis using Xilinx ISE must confirm closure for the target application. The XC2V2000-5FFG896C DCMs support fine-grained phase shifting and M/D synthesis to meet precise clocking requirements.

Does the XC2V2000-5FFG896C support DDR2 memory interfaces?

Yes, the XC2V2000-5FFG896C supports DDR2 interfaces through its SelectIO-Ultra I/O blocks, which include dedicated DDR input and output registers, programmable drive strength (2–24 mA), and on-die termination via Digitally Controlled Impedance (DCI) for SSTL_18 and SSTL_2 standards. The 56 DCMs provide precise phase alignment and deskew necessary for DDR2 timing budgets.

How many block RAM resources does the XC2V2000-5FFG896C contain?

The XC2V2000-5FFG896C contains 34 × 18-Kb Block SelectRAM modules, totaling 612 Kbits of dedicated dual-port RAM. Each block is configurable from 16K × 1 to 512 × 36 bits and supports three read-during-write modes. These resources are essential for FIFOs, frame buffers, and coefficient storage in DSP-intensive applications using the XC2V2000-5FFG896C.

Is the XC2V2000-5FFG896C pin-compatible with other Virtex-II devices in FF896 packaging?

Yes, all Virtex-II devices offered in the FF896 package - including XC2V1000-5FF896C, XC2V1500-5FF896C, and XC2V2000-5FFG896C - share identical pinouts and mechanical footprints. This enables scalable design reuse: a board designed for XC2V2000-5FFG896C can be populated with lower-density variants without layout changes, provided power and thermal constraints are met.

What configuration modes does the XC2V2000-5FFG896C support?

The XC2V2000-5FFG896C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is SRAM-based and in-system reprogrammable. The XC2V2000-5FFG896C also includes optional Triple-DES bitstream encryption and readback capability for verification and debugging.