AMD XC2V2000-5FG676I

Overview

XC2V2000-5FG676I from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FG676) package, rated for industrial temperature range (–40°C to +100°C), with 10,752 CLB slices, 56 Digital Clock Managers (DCMs), and 624 user I/Os. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring deterministic clock management and multi-standard I/O.

For engineers reviewing the XC2V2000-5FG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture-level specifications, confirmed I/O count and package mapping, DCM timing parameters, SelectRAM memory configurations, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V2000-5FG676I implements a hierarchical SRAM-based programmable architecture with 56 independent DCM blocks enabling precise clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution). Its IOBs support 19 single-ended and 6 differential I/O standards-including LVDS, LVPECL, SSTL, and HSTL-with Digitally Controlled Impedance (DCI) for on-chip termination.

Logic resources include 10,752 CLB slices (each with dual 4-LUTs, dual registers, carry chains, and cascade paths), 336 dedicated 18×18 multipliers, and 624 user I/Os routed via Active Interconnect Technology-featuring 24 long lines per row/column, predictable delay independent of fanout, and IEEE 1149.1 boundary-scan compliance.

Key Specifications

Pinout & Package

XC2V2000-5FG676I uses the FG676 (Fine-Pitch Ball Grid Array) package: 27 mm × 27 mm body, 1.00 mm pitch, 676 solder balls arranged in 26×26 array with corner pads omitted. Package supports wire-bond interconnect and Pb-free (FGG676) variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V2000-5FG676I, XC2V3000-5FF896I offers scalable I/O and gate count in a thermally superior package but requires PCB redesign, while XC3S1600E-4FG456C reduces cost and power at the expense of clock management fidelity and environmental robustness.

Availability

XC2V2000-5FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, video processing, DSP acceleration, and PCI-X bridge applications requiring stable component supply across extended lifecycle programs.

Supply support for XC2V2000-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-II family was designed for high-bandwidth, low-latency applications in telecommunications, wireless base stations, and video infrastructure-emphasizing clock precision, I/O flexibility, and large embedded memory.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-5FG676I?

XC2V2000-5FG676I supports 624 user I/Os in the FG676 package, as confirmed in Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The FG676 footprint is wire-bond compatible and does not support flip-chip variants.

Does XC2V2000-5FG676I support LVDS signaling, and what are the electrical requirements?

Yes, XC2V2000-5FG676I supports LVDS signaling with 840 Mb/s data rates using dedicated current-mode drivers. It requires VCCO = 2.5 V or 3.3 V per I/O bank, no input VREF, and output differential voltage (VOD) of 0.25–0.40 V. External 100 Ω termination is recommended unless DCI is enabled for on-chip split termination.

How many Digital Clock Managers (DCMs) are integrated into XC2V2000-5FG676I?

XC2V2000-5FG676I integrates 56 Digital Clock Managers (DCMs), as specified in Table 1 of DS031-1 (v3.5). Each DCM provides fully digital clock deskewing, frequency synthesis (M/D ratio), coarse/fine phase shifting, and jitter reduction-enabling precise timing control across large synchronous domains.

Is XC2V2000-5FG676I compatible with Pb-free assembly processes?

XC2V2000-5FG676I is a wire-bond device in the FG676 package and is not itself Pb-free; however, its Pb-free counterpart is the FGG676 variant (e.g., XC2V2000-5FGG676I). The FG676 package uses SnPb solder spheres, while FGG676 uses 100% matte Sn balls compliant with JEDEC J-STD-020.

What configuration modes does XC2V2000-5FG676I support, and how are they selected?

XC2V2000-5FG676I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and Boundary Scan (IEEE 1532). Mode selection is controlled by the M0, M1, and M2 pins during power-up, as defined in Figure 2 of DS031-1 (v3.5). Configuration can be performed via JTAG, serial PROM, or parallel microprocessor interface.