AMD XC2V2000-5FGG676C

Overview

XC2V2000-5FGG676C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 10,752 CLB slices, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os - enabling high-speed telecommunication line cards requiring PCI-X 133 MHz interfaces and LVDS 840 Mb/s serial links.

For engineers reviewing the XC2V2000-5FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include verified DCM timing parameters, DCI-enabled single-ended termination support (LVDCI_25/LVDCI_33), dual-port Block SelectRAM configuration (up to 16K × 1 bit), and compatibility with Xilinx Foundation/Alliance design tools for 10M-gate compilation.

Technical Context

The XC2V2000-5FGG676C implements a 0.15 µm / 0.12 µm 8-layer metal CMOS architecture with Active Interconnect routing, delivering predictable delay independent of fanout. Its IOBs support DDR input/output registers clocked by phase-opposed DCM outputs, while CLBs provide cascadable 16-bit shift registers and distributed SelectRAM.

Each of the 56 DCMs provides precise de-skew, integer/non-integer frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution). The device uses separate 1.5 V VCCINT, 3.3 V VCCAUX, and programmable VCCO (1.5 V–3.3 V) supplies - with Digitally Controlled Impedance (DCI) enabling on-die series termination for LVCMOS and split termination for HSTL/SSTL standards.

Key Specifications

Pinout & Package

XC2V2000-5FGG676C is housed in a 27 mm × 27 mm Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch and Pb-free finish. The package supports flip-chip interconnect, enabling higher I/O density and thermal performance than wire-bond alternatives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V2000-5FGG676C, XC2V3000-5FGG676C offers headroom for future feature expansion without layout change, while XC2V2000-4FGG676C reduces dynamic power by ~12% at the expense of worst-case timing margin - both retain identical pinout and DCI/DCM architecture.

Availability

XC2V2000-5FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, PCI-X peripheral development, and high-resolution video processing requiring stable component supply across extended production lifecycles.

Supply support for XC2V2000-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II family was designed for high-performance, IP-core-based systems in telecommunications, networking, and DSP - emphasizing clock management, memory hierarchy, and I/O flexibility over raw gate count.

FAQ

What is the maximum guaranteed I/O count for XC2V2000-5FGG676C?

XC2V2000-5FGG676C supports 624 user I/Os in the FGG676 package, as confirmed in Table 2 and Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK–TDO, HSWAP_EN, DXN/DXP, RSVD) and VBATT. All 624 I/Os are configurable per bank with independent VCCO and IOSTANDARD attributes.

Does XC2V2000-5FGG676C support 5V-tolerant inputs?

No, XC2V2000-5FGG676C does not support native 5V-tolerant inputs. Its IOBs include fixed-clamp diodes to VCCO and ground, making them incompatible with 5V signaling without external current-limiting resistors. Per DS031-2 (v3.5), 5V operation requires external series resistors and is not guaranteed - LVTTL/LVCMOS33 I/Os operate at 3.3 V VCCO with 3.3 V input tolerance only.

How many Digital Clock Managers (DCMs) are available in XC2V2000-5FGG676C?

XC2V2000-5FGG676C contains 56 Digital Clock Managers (DCMs), as specified in Table 1 of DS031-1 (v3.5). Each DCM provides independent clock de-skew, frequency synthesis (M/D ratio), and phase shifting (coarse ±90°/±180°/±270° and fine 1/256-cycle resolution), supporting simultaneous multi-domain clocking without external PLLs.

What memory resources does XC2V2000-5FGG676C provide beyond distributed RAM?

XC2V2000-5FGG676C provides 56 × 18 Kb Block SelectRAM modules - totaling 1,008 Kb of dedicated dual-port RAM. Each block supports configurations from 16K × 1 to 512 × 36 bits, three read-during-write modes, and cascading. This is distinct from distributed RAM (implemented in CLB LUTs), offering higher density, true dual-port access, and deterministic timing for FIFOs and frame buffers.

Is XC2V2000-5FGG676C compatible with Xilinx ISE Foundation and Alliance tools?

Yes, XC2V2000-5FGG676C is fully supported by Xilinx Foundation Series and Alliance Series development tools, including synthesis, place-and-route, and timing analysis for designs up to 10M system gates. The device is also compatible with IEEE 1532 boundary-scan configuration and Triple DES bitstream encryption as documented in DS031-1 (v3.5) Module 1.