AMD XC2V2000-5FGG676I

Overview

XC2V2000-5FGG676I from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, rated for industrial temperature range (–40°C to +100°C), with 10,752 CLB slices, 56 Digital Clock Managers (DCMs), and 624 user I/Os. It delivers high-speed logic implementation for telecom infrastructure, video processing, and DSP-intensive embedded systems requiring deterministic clock management and multi-standard I/O interfacing.

For engineers reviewing the XC2V2000-5FGG676I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource mapping, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V2000-5FGG676I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, two flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM provides 18 Kb dual-port RAM configurable from 16K×1 to 512×36, paired with a dedicated 18×18 multiplier for efficient MAC operations.

Key Specifications

Pinout & Package

XC2V2000-5FGG676I uses the FGG676 package - a 27 mm × 27 mm, 1.00 mm pitch, Pb-free wire-bond fine-pitch BGA with 676 balls arranged in a 27×27 array (edge rows A/B/Y/Z reserved for power/ground/control). The package supports 624 user I/Os plus dedicated configuration, clock, and boundary-scan pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V2000-5FGG676I, XCV2000E-6FG676I offers pin-compatible migration with relaxed timing but reduced signal integrity features, while XC3S4000-4FGG676C provides higher gate count at lower cost but lacks critical telecom-grade I/O and clock management capabilities.

Availability

XC2V2000-5FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, industrial video encoders, and avionics data concentrators requiring stable component supply across extended lifecycle programs.

Supply support for XC2V2000-5FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-II family was designed for high-speed, high-density applications in telecommunications, networking, and DSP-emphasizing clock precision, I/O flexibility, and embedded memory/multiplier resources.

FAQ

What is the maximum operating frequency of the XC2V2000-5FGG676I core logic?

The XC2V2000-5FGG676I is rated for 420 MHz internal clock speed under advance data conditions. This performance is achievable with proper placement, routing, and timing closure using Xilinx ISE tools. Actual system-level frequency depends on design complexity, I/O constraints, and thermal management, but the -5 speed grade guarantees timing closure for designs meeting the published DC and switching characteristics in Module 3 of DS031.

Does the XC2V2000-5FGG676I support JTAG boundary-scan testing?

Yes, the XC2V2000-5FGG676I fully complies with IEEE 1149.1 and supports boundary-scan testing via its dedicated TCK, TMS, TDI, and TDO pins. It implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect testing and in-system programming without requiring additional test fixtures.

Can the XC2V2000-5FGG676I interface directly with DDR2 SDRAM?

No, the XC2V2000-5FGG676I does not natively support DDR2 SDRAM interfaces. Its SelectIO-Ultra technology supports DDR SDRAM (not DDR2), QDR SRAM, and RLDRAM, but lacks the fly-by topology support, on-die termination calibration, and 2T/3T timing models required for DDR2. External PHY or controller IP is required for DDR2 compatibility.

What power supplies are required for the XC2V2000-5FGG676I?

The XC2V2000-5FGG676I requires three independent supplies: 1.5 V ±3% for VCCINT (core logic), 3.3 V ±5% for VCCAUX (auxiliary circuits including DCMs and JTAG), and programmable VCCO (1.5 V to 3.3 V) per I/O bank to match selected I/O standards. Each VCCO bank must be decoupled with ≥10 µF bulk and 0.1 µF ceramic capacitors near the package edge.

Is bitstream encryption supported on the XC2V2000-5FGG676I?

Yes, the XC2V2000-5FGG676I includes an on-chip Triple-DES decryptor that secures configuration bitstreams. It supports one or two DES key sets stored in non-volatile memory, enabling encrypted configuration via Master SelectMAP or JTAG. This feature prevents reverse engineering and unauthorized duplication of the programmed logic design.