AMD XC2V2000-6BGG575C

Overview

XC2V2000-6BGG575C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 575-pin standard BGA (BGG575) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 10,752 CLBs, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os - enabling high-bandwidth telecommunication line cards, DSP-accelerated video processing, and PCI-X 133 MHz interface bridging.

For engineers reviewing the XC2V2000-6BGG575C datasheet, pinout, applications, or equivalent options, key selection criteria include its 1.5 V core supply, dual-port 18-Kb Block SelectRAM resources (up to 624 Kbits), LVDS/BLVDS/LVPECL differential I/O support, DCI on-chip termination, and IEEE 1149.1 boundary-scan compliance for production testability.

Technical Context

The XC2V2000-6BGG575C implements Xilinx's IP-Immersion architecture with fourth-generation Active Interconnect routing, delivering predictable timing independent of fanout. Its 56 DCMs provide fully digital clock de-skew, fine-grained phase shifting (1/256 period resolution), and flexible M/D frequency synthesis across up to 16 global clock networks.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, GTL/TP, PCI-X) and differential standards (LVDS, BLVDS, LDT, LVPECL) with programmable drive strength (2–24 mA) and Digitally Controlled Impedance (DCI) for on-die series or split termination. The device uses a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V VCCINT, 3.3 V VCCAUX, and configurable VCCO per bank.

Key Specifications

Pinout & Package

XC2V2000-6BGG575C is housed in a Pb-free 575-ball standard BGA package (BGG575) with 1.27 mm pitch and 31 mm × 31 mm body size. Pin definitions follow Xilinx DS031 Module 4, where balls are organized into I/O banks (Bank 0–7), configuration pins (CCLK, DONE, PROG_B, M0–M2), JTAG TAP signals (TCK/TMS/TDI/TDO), and dedicated power/ground rails (VCCINT, VCCAUX, VCCO, GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC2V2000-6BGG575C, XC2V3000-6FG676C offers higher gate count but requires PCB redesign, while XC2V1500-6BG575C provides direct drop-in replacement with 26% fewer CLBs and 14% fewer I/Os - ideal for design downscaling without layout change.

Availability

XC2V2000-6BGG575C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial PCIe/PCI-X peripheral development requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XC2V2000-6BGG575C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II family was designed for high-performance, system-level integration in telecommunications, wireless base stations, networking switches, and DSP-intensive applications - emphasizing clock management, memory hierarchy, and I/O flexibility over raw gate count.

FAQ

What is the maximum number of user I/Os supported by XC2V2000-6BGG575C?

XC2V2000-6BGG575C supports 408 user I/Os, as confirmed in Table 6 of DS031 Module 1 for the BG575/BGG575 wire-bond package. This count excludes 15 dedicated configuration and JTAG pins (CCLK, DONE, PROG_B, M0–M2, TCK/TMS/TDI/TDO, HSWAP_EN, DXN/DXP, RSVD, PWRDWN_B) and VBATT.

Does XC2V2000-6BGG575C support LVDS signaling, and what are the electrical requirements?

Yes, XC2V2000-6BGG575C supports LVDS_25 and LVDS_33 standards with 250–400 mV differential output voltage (VOD). It requires VCCO = 2.5 V or 3.3 V per I/O bank and does not require external termination - internal current-mode drivers meet ANSI/TIA/EIA-644 specifications.

Can XC2V2000-6BGG575C be configured via JTAG, and what IEEE standard does it comply with?

Yes, XC2V2000-6BGG575C supports IEEE 1149.1-compliant boundary-scan configuration and test through its dedicated TCK/TMS/TDI/TDO pins. It implements EXTEST, INTEST, HIGHZ, SAMPLE, and IDCODE instructions, enabling in-system programming and structural testing without additional hardware.

What clock management resources are integrated into XC2V2000-6BGG575C?

XC2V2000-6BGG575C integrates 56 Digital Clock Manager (DCM) modules, each supporting precise de-skew, frequency synthesis (M/D ratio), and coarse/fine phase shifting. Up to 16 global clock multiplexer buffers distribute synchronized clocks across quadrants with glitch-free switching between sources.

Is XC2V2000-6BGG575C compatible with Pb-free assembly processes?

Yes, XC2V2000-6BGG575C uses the BGG575 package designation, indicating RoHS-compliant Pb-free solder ball composition and compatible with standard lead-free reflow profiles per IPC/JEDEC J-STD-020.