AMD XC2V2000-6FFG896C

Overview

XC2V2000-6FFG896C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in an 896-pin flip-chip fine-pitch BGA (FF896) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 10,752 CLB slices, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os supporting LVDS, SSTL, HSTL, PCI-X, and DCI-terminated interfaces. It is deployed in high-speed telecom line cards requiring deterministic clock deskew and DDR memory interfacing.

For engineers reviewing the XC2V2000-6FFG896C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (624), DCM count (56), multiplier density (336), SelectRAM capacity (624 Kb block RAM), and FF896 package thermal/mechanical compatibility with high-pin-count PCB layouts.

Technical Context

The XC2V2000-6FFG896C implements Xilinx's IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, 1.5 V core supply (VCCINT), and dual 3.3 V auxiliary supplies (VCCAUX, VCCO). Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and differential (LVDS, BLVDS, LVPECL, LDT) signaling, with Digitally Controlled Impedance (DCI) enabling on-die series or split termination for 19 I/O standards. Dual-register DDR paths per I/O are clocked by phase-opposed DCM outputs for precise timing control.

Key Specifications

Pinout & Package

XC2V2000-6FFG896C uses the FF896 flip-chip fine-pitch BGA package (1.00 mm pitch, 31 mm × 31 mm body), optimized for high I/O count and thermal dissipation in telecom infrastructure applications. Pin definitions follow Xilinx DS031 Module 4, with dedicated power/ground banks, programmable I/O banks (VCCO per bank), and hierarchical clock routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V2000-6FFG896C, XC2V3000-6FF896C offers higher gate count and DCM count in identical packaging for scalability, while XC2V2000-5FF896C trades 10% clock speed for lower power and cost - both require no PCB changes but differ in timing closure and thermal envelope.

Availability

XC2V2000-6FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed data acquisition, PCI-X server adapters, and video processing applications requiring stable component supply across extended production lifecycles.

Supply support for XC2V2000-6FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance, system-level integration.

The Virtex-II family was designed for high-bandwidth, low-latency applications including telecommunications, wireless infrastructure, and DSP-intensive systems - emphasizing clock management, I/O flexibility, and embedded memory/multiplier resources.

FAQ

What is the maximum operating frequency of the XC2V2000-6FFG896C?

The XC2V2000-6FFG896C has a -6 speed grade, guaranteeing internal clock operation up to 420 MHz and I/O data rates exceeding 840 Mb/s. This is validated under worst-case commercial temperature (0°C to +85°C) and voltage conditions per DS031 Module 3 timing parameters.

Does the XC2V2000-6FFG896C support DDR2 memory interfaces?

Yes, the XC2V2000-6FFG896C supports DDR2 interfaces through its SelectIO-Ultra I/O banks configured for SSTL_18_I/II standards, combined with dedicated DDR input/output registers and DCM-controlled phase-aligned clocks - verified in Xilinx application notes xapp466 and xapp690.

How many block RAM resources does the XC2V2000-6FFG896C provide?

The XC2V2000-6FFG896C contains 56 Block SelectRAM modules, each 18 Kb, totaling 624 Kb of dual-port RAM. These are configurable from 16K×1 to 512×36 and support three read-during-write modes for efficient FIFO and buffer implementation.

Is the XC2V2000-6FFG896C pin-compatible with other Virtex-II devices in FF896 packaging?

Yes, all Virtex-II devices offered in the FF896 package - including XC2V1000-5FF896C, XC2V1500-6FF896C, and XC2V2000-6FFG896C - share identical pinouts and footprint. This enables scalable design reuse across density tiers without PCB redesign.

What configuration modes are supported by the XC2V2000-6FFG896C?

The XC2V2000-6FFG896C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is SRAM-based, enabling unlimited reprogramming and partial reconfiguration capabilities.