AMD XC2V2000-6FGG676C

Overview

XC2V2000-6FGG676C from Xilinx is a 2-million-system-gate Virtex-II platform FPGA in a 676-pin Fine-Pitch BGA (FGG676) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 10,752 CLB slices, 56 Digital Clock Managers (DCMs), 336 dedicated 18×18 multipliers, and 624 user I/Os. It is used in high-speed networking line cards requiring PCI-X 133 MHz interfaces and DDR2 memory controllers.

For engineers reviewing the XC2V2000-6FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (624), DCM count (56), block RAM capacity (624 Kbits), multiplier density (336), and support for LVDS/PCI-X/SSTL-2 I/O standards in flip-chip-compatible packaging.

Technical Context

The XC2V2000-6FGG676C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by phase-aligned clocks from integrated DCMs.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, carry chains, and horizontal cascading logic; each Block SelectRAM provides 18 Kb dual-port RAM configurable from 16K×1 to 512×36, with associated 18×18 multipliers enabling efficient read-multiply-accumulate operations.

Key Specifications

Pinout & Package

XC2V2000-6FGG676C uses a 27 mm × 27 mm Fine-Pitch Ball Grid Array (FGG676) package with 1.00 mm pitch, Pb-free compliant, supporting flip-chip interconnect for thermal and signal integrity advantages over wire-bond variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XC2V2000-6FGG676C, XC2V3000-6FGG676C offers scalable logic headroom within identical packaging, while XCVU3P-2FFVB1152E delivers architectural modernization at the cost of complete system redesign - neither is pin-compatible nor functionally interchangeable without design revision.

Availability

XC2V2000-6FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and broadcast video applications requiring stable component supply across extended product lifecycles.

Supply support for XC2V2000-6FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic with SRAM-based FPGAs optimized for high-performance system integration and IP reuse.

The Virtex-II family was designed for high-bandwidth, low-latency applications in telecommunications, networking, and DSP - delivering platform-level flexibility with hardened I/O, clocking, and memory resources.

FAQ

What is the maximum supported I/O standard voltage for XC2V2000-6FGG676C?

XC2V2000-6FGG676C supports single-ended I/O standards at VCCO = 1.5V, 1.8V, 2.5V, and 3.3V, and differential standards including LVDS_25 (2.5V), LVDS_33 (3.3V), and LVPECL_33 (3.3V). The auxiliary supply VCCAUX is fixed at 3.3V, and core voltage VCCINT is 1.5V. All I/Os are non-5V-tolerant without external current-limiting resistors.

Does XC2V2000-6FGG676C support partial reconfiguration?

Yes, XC2V2000-6FGG676C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of functional modules - such as changing encryption algorithms or adapting communication protocols - without resetting the entire device or halting operation of other logic sections.

What is the role of Digitally Controlled Impedance (DCI) in XC2V2000-6FGG676C?

DCI in XC2V2000-6FGG676C provides on-chip series or split termination resistors for standards including LVDCI, SSTL, HSTL, and GTL. It eliminates the need for external termination components, reduces PCB area and BOM cost, and improves signal integrity by dynamically matching line impedance - especially critical for high-speed parallel buses like DDR2 and PCI-X.

Can XC2V2000-6FGG676C operate in industrial temperature range?

No, XC2V2000-6FGG676C is rated only for commercial temperature range (0°C to +85°C junction). For industrial applications (–40°C to +100°C), the equivalent industrial-grade variant is XC2V2000-6FGG676I - which shares identical logic resources, pinout, and electrical characteristics except for extended thermal qualification and screening.

How many global clock networks does XC2V2000-6FGG676C provide?

XC2V2000-6FGG676C provides 16 global clock multiplexer buffers, with eight per quadrant, and supports up to 12 Digital Clock Manager (DCM) modules. Each DCM can drive up to four global clock MUX buffers, enabling hierarchical clock distribution with sub-nanosecond skew across large logic regions.