AMD XC2V250-4CSG144C

Overview

XC2V250-4CSG144C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 144-ball chip-scale BGA (CSG144) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (18 Kb each), and 8 Digital Clock Managers (DCMs). It supports high-speed I/O standards including LVDS, SSTL, HSTL, and PCI-X for telecom and DSP applications.

For engineers reviewing the XC2V250-4CSG144C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability (200 user I/Os), DCI termination support, DCM timing parameters, and real-world FPGA integration context - all grounded in DS031 (v3.5) November 2007 official specification.

Technical Context

The XC2V250-4CSG144C implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its IOBs support DDR input/output registers per pin, dual-edge clocking via phase-shifted DCM outputs, and Digitally Controlled Impedance (DCI) for on-die series or split termination across 19 single-ended and 6 differential I/O standards.

Internally, it features hierarchical Active Interconnect routing with 24 long lines per row/column, shared timing models across CLBs/SelectRAM/multipliers/DCMs, and full IEEE 1149.1 boundary-scan compliance. Configuration uses SRAM-based bitstream loading via Slave/Master SelectMAP or JTAG (IEEE 1532), with optional Triple-DES encryption.

Key Specifications

Pinout & Package

XC2V250-4CSG144C uses a 144-ball chip-scale BGA (CSG144) package with 0.80 mm pitch, 12 mm × 12 mm body size, and Pb-free construction. It provides 200 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V250-4CSG144C, the -5 variant trades speed for margin and robustness, while the Spartan-3 alternative sacrifices clock precision, I/O flexibility, and termination integration for lower unit cost - making XC2V250-4CSG144C the only option meeting full Virtex-II feature set requirements in CSG144 form factor.

Availability

XC2V250-4CSG144C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, PCI-X controller development, and reconfigurable DSP acceleration requiring stable component supply and long-term lifecycle support.

Supply support for XC2V250-4CSG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and historically known for FPGA innovation, EDA tool leadership (Vivado, ISE), and silicon architecture differentiation.

The Virtex-II family was designed for high-performance, IP-centric system integration in telecom, networking, and DSP - delivering scalable logic density, hardened I/O, and deterministic clocking before mainstream adoption of transceivers and SoC-FPGAs.

FAQ

What is the maximum number of user I/O pins supported by XC2V250-4CSG144C?

XC2V250-4CSG144C supports 200 user I/O pins in its CSG144 package, as confirmed in Table 6 of DS031 (v3.5). This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The 200 I/Os are fully programmable for single-ended or differential signaling, with DCI support for on-die termination.

Does XC2V250-4CSG144C include on-chip clock management resources?

Yes, XC2V250-4CSG144C integrates 8 Digital Clock Manager (DCM) modules. Each DCM provides de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 cycle resolution), enabling precise clock domain crossing and jitter reduction - critical for LVDS, DDR, and PCI-X interface timing integrity.

What I/O standards are supported by XC2V250-4CSG144C with Digitally Controlled Impedance (DCI)?

XC2V250-4CSG144C supports DCI for LVCMOS (1.5V–3.3V), SSTL (1.8V/2.5V/3.3V), HSTL (Class I–IV), GTL/GTLP, and LVDS_25/LVDSEXT_25. DCI provides auto-calibrated series or split termination using an external reference resistor, eliminating discrete termination components on PCBs.

Is XC2V250-4CSG144C compatible with IEEE 1149.1 boundary-scan testing?

Yes, XC2V250-4CSG144C fully complies with IEEE 1149.1 (JTAG) and IEEE 1532 (in-system configuration). Its Test Access Port (TAP) supports EXTEST, INTEST, HIGHZ, SAMPLE, IDCODE, and USERCODE instructions, enabling board-level interconnect testing and secure bitstream programming.

What configuration modes does XC2V250-4CSG144C support?

XC2V250-4CSG144C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Configuration data can be encrypted using on-chip Triple-DES, and readback capability allows verification of both configuration bits and register/memory contents.