AMD XC2V250-4CSG144I

Overview

XC2V250-4CSG144I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a Pb-free 144-ball chip-scale BGA (CSG144) package, operating across –40°C to +100°C industrial temperature range. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs) - enabling high-speed telecommunication and DSP applications requiring DDR I/O, LVDS interfaces, and embedded memory.

For engineers reviewing the XC2V250-4CSG144I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (including DCI-enabled LVCMOS/LVDS/HSTL), timing parameters for -4 speed grade, and validated alternatives for migration or second-sourcing in industrial-grade FPGA designs.

Technical Context

The XC2V250-4CSG144I implements Xilinx's IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, 1.5 V core supply (VCCINT), and dual 3.3 V auxiliary supplies (VCCAUX and VCCO). Its routing uses fourth-generation Active Interconnect Technology, delivering predictable delay independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) for on-chip termination. The -4 speed grade guarantees 420 MHz internal clock performance and 840 Mb/s I/O data rates under industrial thermal conditions.

Key Specifications

Pinout & Package

XC2V250-4CSG144I uses a Pb-free 144-ball chip-scale BGA (CSG144) package with 0.80 mm pitch and 12 mm × 12 mm footprint. Pin definitions follow Xilinx DS031 Module 4, where balls are arranged in 13×13 array with corner balls omitted (A1, A13, M1, M13 unused); power/ground distribution includes 12 VCCINT, 12 VCCAUX, 12 VCCO, and 12 GND pins across banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-4CSG144I, the -5 variant trades speed for margin and power efficiency, while the Spartan-3 alternative sacrifices clock precision, I/O flexibility, and embedded memory depth for lower cost and simpler toolflow - neither offers pin or functional equivalence.

Availability

XC2V250-4CSG144I is available at Aetrix Electronics and suitable for industrial automation, telecom infrastructure, and medical imaging systems requiring stable component supply across extended lifecycle windows.

Supply support for XC2V250-4CSG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance reconfigurable computing.

The Virtex-II family was designed for demanding applications in telecommunications, wireless base stations, video processing, and DSP - emphasizing high-speed I/O, embedded memory, and precise clock management in a single die.

FAQ

What is the maximum operating junction temperature for XC2V250-4CSG144I?

The XC2V250-4CSG144I is rated for industrial temperature range: –40°C to +100°C junction temperature. This specification is guaranteed under specified voltage and loading conditions per DS031 Module 3. Thermal derating applies above 85°C ambient depending on airflow and PCB copper area. The XC2V250-4CSG144I datasheet defines thermal resistance (θJA) as 32.5°C/W for the CSG144 package.

Does XC2V250-4CSG144I support IEEE 1532 boundary-scan configuration?

Yes, XC2V250-4CSG144I fully supports IEEE 1532 boundary-scan configuration via its JTAG TAP controller. It implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions. The XC2V250-4CSG144I also enables in-system programming and readback of configuration memory using standard IEEE 1532-compliant tools.

Can XC2V250-4CSG144I operate with 5V-tolerant inputs?

No, XC2V250-4CSG144I IOBs are not 5V tolerant by design. Inputs exceed absolute maximum ratings if driven above VCCO + 0.5 V. For interfacing with 5V systems, external current-limiting resistors and clamping diodes are required - detailed guidance is provided in Xilinx Tech Topic "5V Tolerant I/Os". The XC2V250-4CSG144I supports only 1.5V, 1.8V, 2.5V, and 3.3V I/O standards.

How many global clock lines does XC2V250-4CSG144I provide?

The XC2V250-4CSG144I provides 16 global clock lines - eight per quadrant - routed through dedicated low-skew networks. Each of the 8 DCMs can drive up to four global clock multiplexer buffers, enabling hierarchical clock distribution with sub-100 ps skew across the device. This architecture is documented in DS031 Module 2, Section "Global Clocking".

Is XC2V250-4CSG144I compatible with Xilinx ISE 14.7 software?

No, XC2V250-4CSG144I requires Xilinx ISE Design Suite versions 6.3 through 10.1. Support ended with ISE 10.1 (2008), as later versions dropped Virtex-II device families. The final certified toolchain for XC2V250-4CSG144I is ISE 10.1 WebPACK or Foundation. No version of Vivado supports XC2V250-4CSG144I.