AMD XC2V250-4FG256I

Overview

XC2V250-4FG256I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FG256) package, operating across –40°C to +100°C industrial temperature range. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kbits), and 8 Digital Clock Managers (DCMs). It supports high-speed I/O standards including LVDS, SSTL, HSTL, PCI-X, and DDR interfaces for telecom and networking equipment.

For engineers reviewing the XC2V250-4FG256I datasheet, XC2V250-4FG256I pinout, XC2V256I application, or XC2V250-4FG256I equivalent, this page delivers verified architecture details, I/O capability per package, DCM timing parameters, DCI termination support, and industrial-grade thermal performance - all confirmed from Xilinx DS031 (v3.5) November 2007.

Technical Context

The XC2V250-4FG256I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS architecture with SRAM-based configuration, 1.5V core (VCCINT), 3.3V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its IOBs support single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) for on-chip series or split termination.

Internally, it features hierarchical Active Interconnect routing with 24 long lines per row/column, fast carry chains, horizontal cascade logic, and dual-port 18-Kb Block SelectRAM configurable from 512×36 to 16K×1. Each DCM provides de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 clock period resolution).

Key Specifications

Pinout & Package

XC2V256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FG256) package with 1.00 mm pitch, 17 mm × 17 mm body size, and wire-bond interconnect. Pin definitions follow Xilinx's standardized IOB tile layout with dedicated global clock, configuration, and boundary-scan pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-4FG256I, the -5 speed grade improves timing margin without changing footprint, while the FG456 variant trades compactness for I/O scalability and thermal performance - both retain identical CLB count, RAM, multiplier, and DCM resources.

Availability

XC2V250-4FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XC2V250-4FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGAs, adaptive SoCs, and AI inference platforms.

The Virtex-II family was designed for high-performance, IP-centric system integration in telecom, wireless, and video applications - delivering scalable logic density, hardened memory/multiplier blocks, and advanced clock management in a 0.15 µm process.

FAQ

What is the maximum number of user I/O pins supported by XC2V250-4FG256I?

XC2V250-4FG256I supports 172 user I/O pins, as confirmed in Table 6 of Xilinx DS031 (v3.5) for the FG256/FGG256 package. This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The I/O bank structure allows mixed-voltage operation across LVTTL, LVCMOS, SSTL, and HSTL standards.

Does XC2V250-4FG256I support on-chip termination for high-speed I/O standards?

Yes, XC2V250-4FG256I includes Digitally Controlled Impedance (DCI) circuitry supporting series and split termination for LVDCI, SSTL_DCI, HSTL_DCI, GTL_DCI, and GTLP_DCI standards. This eliminates the need for external termination resistors and improves signal integrity for DDR, PCI-X, and LVDS interfaces.

What clock management resources are integrated into XC2V250-4FG256I?

XC2V250-4FG256I integrates 8 Digital Clock Manager (DCM) modules. Each DCM provides de-skew, frequency synthesis (M/D ratio), coarse and fine phase shifting (down to 1/256 clock period), and duty-cycle correction - enabling robust clock distribution for synchronous designs with multiple clock domains.

Is XC2V250-4FG256I compatible with DDR memory interfaces?

Yes, XC2V250-4FG256I supports DDR SDRAM interfaces via dedicated DDR input/output registers in its IOBs and SSTL-compatible I/O standards (SSTL2_I, SSTL2_II, SSTL3_I, SSTL3_II). Its 172 I/Os and programmable VCCO per bank allow direct connection to DDR1 memory subsystems with controlled impedance routing.

What configuration modes does XC2V250-4FG256I support?

XC2V250-4FG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. It also includes on-chip Triple-DES decryption for secure bitstream loading and readback capability for real-time debugging of configuration and register states.