AMD XC2V250-4FG456I
- Part No.:
- XC2V250-4FG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2V250-4FG456I.pdf
- Description:
- IC FPGA 200 I/O 456FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,155
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Product details
Overview
XC2V250-4FG456I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FG456) package, operating across –40°C to +100°C industrial temperature range. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs). It supports high-speed I/O standards including LVDS, SSTL, HSTL, and PCI-X for telecom and DSP applications.
For engineers reviewing the XC2V250-4FG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O capability (200 user I/Os), DCM timing parameters, DCI termination support, and validated alternatives - all aligned with DS031 (v3.5) November 2007 specification.
Technical Context
The XC2V250-4FG456I implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-data-rate (DDR) input/output paths using two phase-opposed clocks generated by integrated DCMs.
Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascading logic. Block SelectRAM resources provide true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes and direct association to adjacent 18×18 multipliers for efficient DSP filtering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 250,000 - defines logic density for complex digital system integration |
| User I/O Pins | 200 - maximum routable signal interfaces in FG456 package |
| Configurable Logic Blocks (CLBs) | 1,536 - each contains 4 slices with dual LUTs and storage for combinatorial + synchronous logic |
| Block RAM (SelectRAM) | 432 Kb - 24 × 18-Kb dual-port blocks supporting independent read/write ports and cascading |
| Digital Clock Managers (DCMs) | 8 - provide de-skew, frequency synthesis (M/D ratio), and ±1/256-cycle phase shift per output |
| 18×18 Multiplier Blocks | 48 - hardwired arithmetic units enabling high-throughput MAC operations without LUT consumption |
| Core Voltage (VCCINT) | 1.5 V - low-voltage operation enabling reduced dynamic power in high-clock-frequency designs |
| Temperature Range | –40°C to +100°C - industrial-grade thermal qualification for embedded and infrastructure equipment |
Pinout & Package
XC2V256-4FG456I uses the FG456 (Fine-Pitch BGA, 1.00 mm pitch, 23 mm × 23 mm) wire-bond package with 456 balls. Pin assignments are defined in Module 4 (Pinout Information) of DS031, covering ball-grid mapping, I/O bank voltage domains (VCCO), auxiliary supply (VCCAUX = 3.3 V), and dedicated configuration/control pins (e.g., CCLK, DONE, M0–M2, PROG_B).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master/slave serial or SelectMAP mode |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream loading and device initialization |
| M0–M2 | Mode Selection Inputs | Three-pin encoding selects one of five configuration modes (e.g., Slave Serial, Master SelectMAP) |
| PROG_B | Program Initiate Input | Active-low signal triggering full reconfiguration and clearing of configuration memory |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and verification |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for LVDCI, HSTL_DCI, SSTL_DCI, and LVDS_DCI standards - eliminates external resistors and improves signal integrity |
| SelectIO-Ultra I/O Technology | Support for 19 single-ended (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and 8 differential (LVDS, BLVDS, LVPECL, LDT) standards - enables direct interfacing to DDR SDRAM, QDR SRAM, and network PHYs |
| Integrated Logic Analyzer (ILA) Core | Embedded debug capability allowing real-time capture of internal signals and block RAM contents - reduces FPGA validation cycle time |
| Triple-DES Bitstream Encryption | On-chip hardware decryptor supporting one or two key sets - protects intellectual property against unauthorized readback or cloning |
| Partial Reconfiguration Support | Runtime replacement of logic modules without resetting the entire device - enables adaptive computing and field-upgradable functionality |
Applications
| Telecom Line Card Processing | Industrial Motion Control |
|---|---|
|
Use Scenario: Real-time packet classification and traffic shaping in edge routers with multi-gigabit backplane interfaces. IC Role / Device Role / Timing Role: XC2V250-4FG456I serves as the programmable datapath engine, implementing custom MAC-layer logic, CRC engines, and SERDES interface glue logic. Use Value: 200 user I/Os and LVDS-capable banks enable direct connection to 10-Gbps PHYs; DCMs synchronize multiple clock domains (e.g., 125 MHz Ethernet, 200 MHz packet buffer). |
Use Scenario: Closed-loop servo control in CNC machines requiring deterministic jitter < 50 ps and sub-microsecond response latency. IC Role / Device Role / Timing Role: XC2V250-4FG456I hosts PID controllers, encoder interpolation logic, and isolated I/O interface state machines. Use Value: 8 DCMs provide precise phase-aligned clocks for PWM generation and ADC sampling; industrial temperature rating ensures reliability in motor-drive enclosures. |
| Medical Imaging Data Acquisition | Avionics Sensor Fusion Hub |
|
Use Scenario: High-fidelity digitization and preprocessing of ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: XC2V250-4FG456I implements beamforming coefficients, FIR filtering, and DDR2 memory controller for frame buffering. Use Value: 48 dedicated multipliers accelerate real-time convolution; 432 Kb Block RAM stores 2D image tiles with zero external memory latency. |
Use Scenario: Aggregation and timestamp alignment of inertial measurement unit (IMU), GPS, and radar inputs in flight control systems. IC Role / Device Role / Timing Role: XC2V250-4FG456I acts as deterministic time-synchronization hub, running IEEE 1588 PTP slave logic and ARINC 429 protocol engines. Use Value: DCI-enabled HSTL I/Os interface directly to avionics bus transceivers; triple-DES encryption secures firmware updates per DO-254 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V250-5FG456C | Commercial temperature grade (0°C to +85°C); faster -5 speed grade (vs. -4); identical logic resources and pinout | Suitable for non-industrial environments where ambient temperature remains controlled | Select when thermal margin allows relaxed grading and higher clock frequencies are required |
| XC2V3000-4FG676I | Higher density (3M gates), 484-user-I/O FG676 package, 1728 Kb RAM, 96 multipliers - not pin-compatible | Required for designs scaling beyond 250K gates or needing >200 I/Os or >432 Kb on-chip RAM | Choose only if logic capacity or I/O count exceeds XC2V250-4FG456I limits; requires PCB redesign |
Compared with XC2V250-4FG456I, the XC2V250-5FG456C offers higher timing performance at lower thermal stress, while the XC2V3000-4FG676I provides scalable logic and memory for next-generation implementations - neither is pin-compatible, but both share Virtex-II architectural continuity for IP reuse.
Availability
XC2V250-4FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and avionics applications requiring stable component supply, long-term lifecycle management, and traceable sourcing.
Supply support for XC2V250-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.
The Virtex-II family was designed for high-density, high-speed applications in telecommunications, networking, video processing, and DSP - emphasizing I/O flexibility, embedded memory, and clock management for system-on-chip integration.
FAQ
What is the maximum number of user I/Os supported by XC2V250-4FG456I?
The XC2V250-4FG456I supports 200 user I/O pins in the FG456 package, as confirmed in Table 6 of DS031 (v3.5). This count excludes 15 dedicated configuration and boundary-scan pins (e.g., CCLK, DONE, TCK, TMS) and VBATT. I/O banks are grouped by VCCO voltage domains to support mixed-standard interfaces.
Does XC2V250-4FG456I support DDR memory interfaces?
Yes, XC2V250-4FG456I supports DDR SDRAM interfaces via its SelectIO-Ultra I/O banks, which include built-in DDR input and output registers. The device complies with SSTL2_I/II and SSTL3_I/II standards, and its DCMs generate precisely phased clocks required for DDR timing closure.
What clock management resources does XC2V250-4FG456I include?
XC2V250-4FG456I integrates 8 Digital Clock Managers (DCMs), each capable of clock de-skew, frequency synthesis (M/D integer ratios), and fine-grained phase shifting (±1/256 of period). These feed 16 global clock multiplexer buffers, enabling robust multi-domain clock distribution in high-speed designs.
Is XC2V250-4FG456I compatible with JTAG boundary-scan testing?
Yes, XC2V250-4FG456I fully supports IEEE 1149.1 boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. It implements EXTEST, INTEST, and HIGHZ instructions, and supports IEEE 1532 for in-system configuration - enabling standardized test, debug, and programming workflows.
What is the core voltage requirement for XC2V250-4FG456I?
XC2V250-4FG456I requires a 1.5 V ±3% core supply (VCCINT) for its 0.15 µm/0.12 µm CMOS logic fabric. It also mandates a dedicated 3.3 V auxiliary supply (VCCAUX) for configuration logic and I/O bank supplies (VCCO) scaled per standard - e.g., 3.3 V for LVTTL, 1.8 V for LVCMOS18.
XC2V250-4FG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 442368
- Number of I/O:
- 200
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2V250-4FG456I FAQ
1.How can I place an order for XC2V250-4FG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V250-4FG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V250-4FG456I reliable?
The price and inventory of XC2V250-4FG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V250-4FG456I is usually 5 days.
3.What payment methods are accepted for XC2V250-4FG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V250-4FG456I transactions.
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XC2V250-4FG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V250-4FG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V250-4FG456I?
For technical support, including XC2V250-4FG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V250-4FG456I requirements.
6.How does Aetrix verify that XC2V250-4FG456I is sourced from the original manufacturer or authorized distributors?
All XC2V250-4FG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V250-4FG456I meets industry standards.
7.What is the process for return or replacement of XC2V250-4FG456I?
All XC2V250-4FG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V250-4FG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V250-4FG456I part is unused and in its original packaging.
Return procedure for XC2V250-4FG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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