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AMD XC2V250-4FGG256C
- Part No.:
- XC2V250-4FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V250-4FGG256C.pdf
- Description:
- IC FPGA 172 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,516
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Product details
Overview
XC2V250-4FGG256C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, featuring 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, and 8 Digital Clock Managers (DCMs). It operates at commercial temperature range (0°C to +85°C) with -4 speed grade, supporting high-speed interfaces including LVDS, PCI-X, and DDR I/O for telecom and video processing systems.
For engineers reviewing the XC2V256C datasheet, XC2V250-4FGG256C pinout, XC2V250-4FGG256C application, or XC2V250-4FGG256C equivalent, this page delivers verified architecture details, I/O standard support (LVDCI, SSTL, HSTL), DCM timing parameters, CLB resource mapping, and validated alternative FPGAs for migration or second-sourcing in legacy Virtex-II designs.
Technical Context
The XC2V250-4FGG256C implements a SRAM-based, reprogrammable logic array built on a 0.15 µm/0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture integrates IOBs with dual-edge DDR registers, CLBs containing four slices each (with dual 4-LUTs and flip-flops), 24 Block SelectRAM™ modules (18 Kb dual-port RAM), and eight DCMs for de-skew, phase shifting, and frequency synthesis.
Routing uses Active Interconnect Technology with hierarchical segmented resources - 24 long lines per row/column, 120 hex lines, and 40 double lines - ensuring predictable delay independent of fanout. Digitally Controlled Impedance (DCI) provides on-chip series or split termination for LVCMOS, SSTL, HSTL, and GTL standards without external resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 250,000 - defines logic capacity for complex RTL synthesis and IP integration |
| Configurable Logic Blocks (CLBs) | 1,536 - each contains 4 slices with dual 4-input LUTs and storage elements for combinatorial + synchronous logic |
| Block SelectRAM™ Modules | 24 × 18 Kb - supports dual-port configurations (e.g., 512 × 36 bits) for embedded FIFOs and memory buffers |
| Digital Clock Managers (DCMs) | 8 - provide zero-delay clock buffering, ±1/256-cycle phase shift, and M/D ratio frequency synthesis |
| User I/O Pins | 172 - available in FGG256 package; supports 19 single-ended and 6 differential I/O standards |
| Speed Grade | -4 - guarantees maximum internal clock frequency of 420 MHz and I/O toggle rate up to 840 Mb/s |
| Core Voltage (VCCINT) | 1.5 V ± 3% - low-voltage operation enabling reduced dynamic power in high-density logic |
Pinout & Package
XC2V250-4FGG256C is housed in a Pb-free wire-bond Fine-Pitch Ball Grid Array (FGG256) package with 256 balls, 1.00 mm pitch, and 17 × 17 mm body size. The package supports 172 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or slave serial configuration; must be stable before PROG_B deassertion |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream loading and initialization |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, SelectMAP, boundary-scan) at power-up |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts loading sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port for programming, debugging, and verification |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series/split termination for LVCMOS, SSTL, HSTL, and GTL I/O standards eliminates external resistors and improves signal integrity |
| DDR I/O Registers | Dual-edge capture/output registers per IOB enable true double-data-rate signaling without external PHY, reducing board-level timing complexity |
| 18×18 Multiplier Blocks | 48 dedicated hard multipliers accelerate DSP functions (FIR, FFT) with deterministic latency and no LUT resource consumption |
| Block SelectRAM™ Memory | 24 × 18 Kb dual-port RAM blocks support simultaneous read/write with three "read-during-write" modes for pipeline buffering and data coalescing |
| Digital Clock Manager (DCM) | 8 fully digital DCMs provide jitter-free clock multiplication/division, fine-grained phase adjustment (1/256 period), and input-to-output de-skew within ±100 ps |
Applications
| Telecom Line Card Processing | Video Frame Buffering |
|---|---|
Use Scenario: Real-time packet classification and header modification in OC-48/STM-16 line cards using parallel TCAM-like logic. IC Role / Device Role / Timing Role: Programmable logic fabric implementing custom forwarding engines with synchronized DDR I/O interfacing to external QDR SRAM. Use Value: 172 user I/Os and 8 DCMs enable concurrent high-speed SerDes framing, memory interface, and control plane logic on a single die. |
Use Scenario: HD video capture and display pipeline with 1080p60 input, frame-rate conversion, and HDMI output. IC Role / Device Role / Timing Role: Video processing hub managing pixel data flow between image sensors, SDRAM controllers, and display serializers. Use Value: 24 × 18 Kb Block SelectRAM enables dual-frame buffering with zero external memory latency for real-time scaling and color space conversion. |
| PCI-X Bridge Logic | Industrial Motion Control |
Use Scenario: Host-to-peripheral bridge converting PCIe/PCIe Gen1 signals to legacy PCI-X 133 MHz bus for legacy instrumentation backplanes. IC Role / Device Role / Timing Role: Protocol translation engine with timing-critical setup/hold compliance across 64-bit 133 MHz synchronous bus. Use Value: PCI-X 133 MHz compliance at 3.3 V and DCI termination ensure signal integrity without external bus terminators or timing margin penalties. |
Use Scenario: Closed-loop servo controller synchronizing encoder feedback, PWM generation, and safety monitoring in CNC machines. IC Role / Device Role / Timing Role: Deterministic real-time logic executing PID loops at 20 kHz with sub-microsecond I/O response via dedicated CLB routing. Use Value: 420 MHz internal clock speed and fast carry chains deliver <100 ns logic propagation for jitter-sensitive motion trajectory updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V250-5FGG256C | Same architecture and package, but -5 speed grade (higher max frequency: 470 MHz vs. 420 MHz) | Required for designs needing tighter timing closure at >420 MHz internal clocks or >840 Mb/s I/O toggle rates | Select only if timing analysis confirms marginal slack with -4 grade; otherwise -4 offers lower power and cost |
| XC2V3000-4FGG676C | Larger device (3M gates, 676-pin FGG package), same -4 speed grade and Virtex-II architecture | Suitable for design scalability paths requiring >2× logic resources, additional DCMs, or more I/Os (484 pins) | Use when XC2V250-4FGG256C resource utilization exceeds 85% or future expansion requires headroom |
Compared with XC2V250-4FGG256C, the -5 speed grade variant improves timing margin at higher frequencies but increases static power; the XC2V3000-4FGG676C offers architectural continuity for scale-up but demands PCB redesign due to larger footprint and pin count.
Availability
XC2V250-4FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, video processing, and legacy PCI-X system upgrades requiring stable component supply and long-term obsolescence management.
Supply support for XC2V250-4FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and historically known for SRAM-based FPGAs, EDA tools, and IP cores.
The Virtex-II family was designed for high-performance, high-density logic implementations in telecom, networking, and video systems - emphasizing I/O flexibility, embedded memory, and deterministic clock management.
FAQ
What is the maximum operating junction temperature for XC2V250-4FGG256C?
The XC2V250-4FGG256C is rated for commercial temperature range: junction temperature (Tj) from 0°C to +85°C. This specification is defined in DS031 Module 1 and applies to all Virtex-II devices with 'C' suffix. Operation beyond +85°C may cause configuration loss or timing violations and is not supported.
Does XC2V250-4FGG256C support IEEE 1532 boundary-scan configuration?
Yes, XC2V250-4FGG256C supports IEEE 1532 boundary-scan configuration via its JTAG TAP controller. The device implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions, enabling in-system programming and verification without external configuration PROMs.
Can XC2V250-4FGG256C interface directly with 5V TTL logic?
No, XC2V250-4FGG256C IOBs are not 5V-tolerant. As outputs, they are incompatible with 5V standards; as inputs, they require external current-limiting resistors to safely interface with 5V signals. Supported I/O standards include LVTTL (3.3V), LVCMOS (1.5–3.3V), and PCI-X (3.3V), all referenced to VCCO.
How many Block SelectRAM™ modules does XC2V250-4FGG256C contain?
XC2V250-4FGG256C contains 24 Block SelectRAM™ modules, each providing 18 Kb of dual-port RAM. These modules support configurable depths (16K×1 to 512×36) and widths, with independent read/write ports and three read-during-write modes for flexible memory architectures.
Is XC2V250-4FGG256C compatible with Xilinx ISE 14.7 software?
XC2V250-4FGG256C is fully supported in Xilinx ISE Design Suite versions up to 14.7, including synthesis, place-and-route, and bitstream generation. Device files, primitives, and DCM wizards for XC2V250 are included in ISE 10.1 through 14.7; later versions (Vivado) do not support Virtex-II architecture.
XC2V250-4FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 442368
- Number of I/O:
- 172
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V250-4FGG256C FAQ
1.How can I place an order for XC2V250-4FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V250-4FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V250-4FGG256C reliable?
The price and inventory of XC2V250-4FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V250-4FGG256C is usually 5 days.
3.What payment methods are accepted for XC2V250-4FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V250-4FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V250-4FGG256C?
XC2V250-4FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V250-4FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V250-4FGG256C?
For technical support, including XC2V250-4FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V250-4FGG256C requirements.
6.How does Aetrix verify that XC2V250-4FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2V250-4FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V250-4FGG256C meets industry standards.
7.What is the process for return or replacement of XC2V250-4FGG256C?
All XC2V250-4FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V250-4FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V250-4FGG256C part is unused and in its original packaging.
Return procedure for XC2V250-4FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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