AMD XC2V250-4FGG256I

Overview

XC2V250-4FGG256I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating over –40°C to +100°C industrial temperature range. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs) - enabling high-speed telecommunication and DSP applications requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V256-4FGG256I datasheet, XC2V250-4FGG256I pinout, XC2V250-4FGG256I application, or XC2V250-4FGG256I equivalent, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, DCI), timing parameters for -4 speed grade, and validated alternatives for migration or second-sourcing in industrial embedded systems.

Technical Context

The XC2V250-4FGG256I implements a SRAM-based, reprogrammable logic array with 1.5 V core supply (VCCINT), 3.3 V auxiliary supply (VCCAUX), and configurable I/O voltage (VCCO) supporting 19 single-ended and 6 differential standards. Its architecture includes distributed SelectRAM, horizontal cascade chains, and fast carry logic for arithmetic-intensive designs.

Each IOB supports DDR input/output registers clocked by phase-opposed DCM outputs, enabling true double-data-rate signaling up to 840 Mb/s. Digitally Controlled Impedance (DCI) provides on-chip series or split termination for LVDCI, SSTL, and HSTL standards without external resistors - critical for impedance-matched high-speed PCB routing.

Key Specifications

Pinout & Package

XC2V250-4FGG256I uses a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.00 mm pitch, Pb-free finish, and 172 user I/Os arranged across 16 banks. The package supports wire-bond interconnect and thermal dissipation suitable for industrial ambient operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-4FGG256I, the -5 variant offers guaranteed higher speed without package or pinout changes, while XC3S200-4PQ208I trades clock management, DCI, and I/O bandwidth for lower unit cost and simpler toolchain support.

Availability

XC2V250-4FGG256I is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and telecom infrastructure projects requiring stable component supply across extended product lifecycles.

Supply support for XC2V250-4FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was engineered for demanding applications in telecommunications, networking, and DSP - delivering scalable logic density, hardened I/O, and integrated clock management in a single platform.

FAQ

What is the maximum supported I/O standard voltage for XC2V250-4FGG256I?

XC2V250-4FGG256I supports VCCO voltages of 1.5 V, 1.8 V, 2.5 V, and 3.3 V per I/O bank - enabling direct interfacing with LVTTL, LVCMOS, SSTL, HSTL, and PCI-X components. Each bank's VCCO must be externally supplied at the selected voltage; mixing voltages across banks is permitted, but not within the same bank.

Does XC2V250-4FGG256I support on-chip termination for differential I/O standards?

Yes, XC2V250-4FGG256I supports LVDS_25_DCI and LVDSEXT_25_DCI modes, providing on-chip split termination for 2.5 V LVDS signaling. This eliminates the need for external 100 Ω differential termination resistors and reduces board space and signal reflections in high-speed links.

How many Digital Clock Managers (DCMs) are available in XC2V250-4FGG256I?

XC2V250-4FGG256I contains 8 fully functional Digital Clock Managers (DCMs). Each DCM supports zero-delay buffering, frequency synthesis (M/D ratios), and fine-grained phase shifting (1/256 clock period resolution), enabling precise clock domain crossing and jitter reduction in multi-clock systems.

Is XC2V250-4FGG256I compatible with Xilinx ISE 14.7 design tools?

No - XC2V250-4FGG256I requires Xilinx ISE 6.3 through ISE 10.1 for full synthesis, place-and-route, and bitstream generation. ISE 14.7 does not support Virtex-II devices; attempting to use it will result in unrecognized part errors and toolchain failure.

What is the configuration method supported by XC2V250-4FGG256I?

XC2V250-4FGG256I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration data is loaded into internal SRAM cells; the device loses its configuration upon power loss and requires reprogramming at startup.