AMD XC2V250-4FGG456C

Overview

XC2V250-4FGG456C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, operating at commercial temperature range (0°C to +85°C) with -4 speed grade. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 3 Mb RAM), and 8 Digital Clock Managers (DCMs). It is used in high-speed telecommunication line cards requiring PCI-X 133 MHz I/O and DDR memory interfaces.

For engineers reviewing the XC2V250-4FGG456C datasheet, XC2V256-4FGG456C pinout, XC2V250-4FGG456C application, or XC2V250-4FGG456C equivalent, key selection criteria include I/O count (200 user pins), DCM phase-shifting resolution (1/256 clock period), DCI-enabled on-die termination for HSTL/SSTL, and support for LVDS at 840 Mb/s - all confirmed for this exact FGG456-packaged variant.

Technical Context

The XC2V250-4FGG456C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, driven by DCM-generated complementary clocks with precise 180° phase alignment.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascading logic; each Block SelectRAM provides true dual-port 18 Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes and dedicated multiplier coupling.

Key Specifications

Pinout & Package

XC2V250-4FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.00 mm pitch, Pb-free construction, and 200 user I/O pins plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK–TDO, TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-4FGG456C, the -5 variant offers guaranteed higher clock rates at same voltage/temperature, while the FG256 variant trades I/O count and thermal capacity for compactness - neither is pin-compatible, and both require PCB redesign.

Availability

XC2V250-4FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and video bridge applications requiring stable component supply across extended production lifecycles.

Supply support for XC2V250-4FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022, specializing in FPGA, adaptive SoC, and ACAP technologies for high-performance computing and signal processing.

The Virtex-II family was designed for high-bandwidth, low-latency applications in telecommunications, networking, and DSP - delivering platform-level integration of logic, memory, arithmetic, and clock management in a single SRAM-based device.

FAQ

What is the maximum number of user I/O pins supported by XC2V250-4FGG456C?

XC2V250-4FGG456C supports exactly 200 user I/O pins in its FGG456 package, as confirmed in Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The 200-pin count is specific to the XC2V250 in FG/FGG456 packages and is not shared with other Virtex-II densities in this footprint.

Does XC2V250-4FGG456C support LVDS signaling, and at what data rate?

Yes, XC2V250-4FGG456C supports LVDS signaling at up to 840 Mb/s, as stated in the "Summary of Virtex-II™ Features" section of DS031-1. This capability is implemented in its IOBs and is verified for the FGG456 package variant. The device also supports Bus LVDS, ULVDS, and LVPECL, with differential pairs requiring adjacent pads and shared switch matrix access.

What clock management resources are integrated into XC2V250-4FGG456C?

XC2V250-4FGG456C integrates 8 Digital Clock Manager (DCM) modules, each providing digital clock deskew, frequency synthesis (M/D ratio), and coarse/fine phase shifting (down to 1/256 of the input clock period). These DCMs drive up to 16 global clock multiplexer buffers and support DDR register clocking with precise 180° phase alignment - all confirmed for this specific speed-grade and package combination.

Is XC2V250-4FGG456C compatible with 5V-tolerant I/O standards?

No, XC2V250-4FGG456C is not 5V-tolerant. Its IOBs lack internal 5V-compatible clamping and are specified only for VCCO = 1.5V, 1.8V, 2.5V, or 3.3V operation. As an input, it can interface with 5V signals only when external current-limiting resistors are used - a design constraint explicitly noted in DS031-2 and applicable to the XC2V250-4FGG456C variant.

What memory resources does XC2V250-4FGG456C provide for embedded applications?

XC2V250-4FGG456C provides 24 × 18-Kb Block SelectRAM modules (432 Kb total) and up to 1.5 Mb of distributed RAM. Each block supports true dual-port operation, configurable widths (16K×1 to 512×36), and three read-during-write modes. These resources are directly accessible by CLBs and multipliers, enabling efficient FIFOs, coefficient tables, and frame buffers in embedded DSP and imaging applications.