AMD XC2V250-4FGG456I

Overview

XC2V250-4FGG456I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, rated for industrial temperature range (–40°C to +100°C), with 200 user I/Os, 1.5 V core supply, and integrated Digital Clock Managers (DCMs) for precise clock de-skew and phase shifting. It supports LVDS, SSTL, HSTL, and PCI-X interfaces for high-speed telecom and networking applications.

For engineers reviewing the XC2V256-4FGG456I datasheet, XC2V250-4FGG456I pinout, XC2V250-4FGG456I application, or XC2V250-4FGG456I equivalent, this page delivers verified architecture details, I/O standard compatibility, DCM timing parameters, SelectRAM memory configurations, and industrial-grade thermal and electrical specifications directly extracted from DS031 (v3.5).

Technical Context

The XC2V250-4FGG456I implements a hierarchical SRAM-based programmable logic architecture with 1,536 Configurable Logic Blocks (CLBs), each containing four slices with dual 4-input LUTs, distributed RAM, and flip-flops. It integrates 24 dedicated 18×18-bit multipliers and 24 Block SelectRAM modules totaling 432 Kbits of dual-port RAM.

Its clocking subsystem includes eight Digital Clock Manager (DCM) modules supporting 90°/180°/270° phase shifts, fine-grained ±1/256-cycle adjustment, and M/D frequency synthesis. I/O subsystem features Digitally Controlled Impedance (DCI) for on-die termination across 19 single-ended and 6 differential standards including LVDS, SSTL-2/3, and PCI-X 133 MHz.

Key Specifications

Pinout & Package

XC2V250-4FGG456I uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.00 mm pitch, Pb-free construction, and industrial temperature rating. The package supports 200 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-4FGG456I, the –5 speed grade delivers measurable timing margin for high-frequency I/O while maintaining identical pinout and power profile; the XC2V3000-4FGG676I enables substantial logic growth but mandates new layout and thermal validation due to increased power and package size.

Availability

XC2V250-4FGG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial Ethernet, medical imaging, and avionics applications requiring stable component supply, long-term lifecycle support, and industrial-temperature-rated programmable logic.

Supply support for XC2V250-4FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022, with decades of leadership in programmable logic architecture and EDA toolchains.

The Virtex-II family was designed for high-performance, system-level integration in wireline/wireless infrastructure and digital signal processing, emphasizing I/O flexibility, clock precision, and embedded memory scalability.

FAQ

What is the maximum operating frequency of the XC2V250-4FGG456I core logic?

The XC2V250-4FGG456I supports an internal clock speed up to 375 MHz under industrial conditions, as specified in DS031 Module 3 for the –4 speed grade. This value reflects worst-case timing across voltage, temperature, and process corners and is validated for CLB-to-CLB paths using Xilinx ISE timing analysis tools. The actual achievable frequency depends on design topology and placement constraints, but the XC2V250-4FGG456I consistently meets this spec in production silicon.

Does the XC2V250-4FGG456I support 5V-tolerant I/Os?

No, the XC2V250-4FGG456I does not support native 5V-tolerant I/Os. Its IOBs are designed for 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards only. When interfacing with 5V systems, external current-limiting resistors must be used on input pins, and level-shifting buffers are required for bidirectional or output-only connections. This limitation is explicitly stated in DS031 Module 2 regarding I/O voltage compliance.

How many DCM modules are available in the XC2V250-4FGG456I?

The XC2V250-4FGG456I contains eight Digital Clock Manager (DCM) modules, as confirmed in Table 1 of DS031 Module 1. Each DCM provides independent clock de-skew, multiplication/division, and phase shifting capabilities. These eight DCMs are fully accessible in the XC2V250-4FGG456I and are sufficient to manage multiple asynchronous clock domains in complex systems such as multi-standard communication processors.

What is the purpose of the VCCAUX supply pin on the XC2V250-4FGG456I?

The VCCAUX supply pin on the XC2V250-4FGG456I delivers 3.3 V ±5% power to auxiliary circuitry including Digital Clock Managers (DCMs), configuration logic (e.g., JTAG TAP controller), and boundary-scan circuitry. Unlike VCCO (I/O supply) or VCCINT (core supply), VCCAUX is mandatory for device initialization and cannot be omitted-even if no DCMs are used-because it powers essential startup and test infrastructure within the XC2V250-4FGG456I.

Can the XC2V250-4FGG456I perform partial reconfiguration?

Yes, the XC2V250-4FGG456I supports partial reconfiguration as documented in DS031 Module 1 under "SRAM-Based In-System Configuration." This capability allows dynamic modification of specific logic regions while the rest of the design remains operational-a key feature for adaptive systems like software-defined radios or field-upgradable industrial controllers. Implementation requires Xilinx ISE 8.2i or later and adherence to module boundary constraints defined in the Virtex-II Partial Reconfiguration User Guide.