AMD XC2V250-5FG256I

Overview

XC2V250-5FG256I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FG256) package, operating at -5 speed grade with industrial temperature range (–40°C to +100°C). It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (18 Kb each), and 8 Digital Clock Managers (DCMs), enabling high-performance telecommunication and DSP applications requiring PCI, LVDS, and DDR interfaces.

For engineers reviewing the XC2V256I datasheet, XC2V250-5FG256I pinout, XC2V250-5FG256I application, or XC2V250-5FG256I equivalent, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, DCM timing parameters, and wire-bond BGA package constraints - all specific to the FG256 footprint and industrial-grade operation.

Technical Context

The XC2V250-5FG256I implements a SRAM-based, reprogrammable logic array built on a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture includes distributed SelectRAM™ (up to 1.5 Mb), horizontal cascade chains, fast carry logic, and Active Interconnect routing for predictable timing independent of fanout.

Each IOB supports single-ended (LVTTL, LVCMOS, PCI-X, SSTL, HSTL) and differential (LVDS, BLVDS, LVPECL) signaling, with Digitally Controlled Impedance (DCI) providing on-chip series or split termination. The -5 speed grade guarantees 420 MHz internal clock speed and 840+ Mb/s I/O performance under industrial thermal conditions.

Key Specifications

Pinout & Package

XC2V250-5FG256I uses the FG256 (Fine-Pitch BGA, 1.00 mm pitch, 17 mm × 17 mm) wire-bond package with 256 balls arranged in a 16×16 array. This package supports 172 user I/Os plus 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-5FG256I, the -4 variant trades performance margin for cost, while the -5FG456C offers more I/Os and smaller timing margin but excludes industrial temperature qualification - making the original part uniquely suited for thermally demanding, space-constrained embedded systems requiring guaranteed 420 MHz operation.

Availability

XC2V250-5FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, PCI-X embedded controllers, and high-speed test equipment requiring stable component supply across extended lifecycle programs.

Supply support for XC2V250-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as high-performance, scalable FPGA platforms for mission-critical systems.

The Virtex-II product line was engineered for high-bandwidth, low-latency applications in telecommunications, networking, and video processing - delivering integrated clock management, memory, and I/O to replace ASICs in rapidly evolving protocols.

FAQ

What is the maximum number of user I/Os supported by XC2V250-5FG256I?

XC2V250-5FG256I supports 172 user I/Os in the FG256 package, as confirmed in Table 6 of DS031 Module 1. This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The I/Os are fully configurable for single-ended or differential standards including LVDS, SSTL, and PCI-X, with programmable drive strength and DCI termination.

Does XC2V250-5FG256I support DDR memory interfaces?

Yes, XC2V250-5FG256I natively supports DDR SDRAM and DDR SRAM interfaces through its SelectIO™-Ultra I/O blocks, which include dedicated DDR input and output registers. The device's 172 I/Os and programmable VCCO per bank allow implementation of 16-bit or 32-bit DDR2 interfaces with precise timing control via its eight Digital Clock Managers (DCMs).

What clocking resources are available in XC2V250-5FG256I?

XC2V250-5FG256I integrates eight Digital Clock Managers (DCMs), each capable of zero-delay buffering, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period). It also provides 16 global clock multiplexer buffers, with up to eight per quadrant, enabling glitch-free clock switching and robust clock distribution across the 1,536 CLB array.

Is XC2V250-5FG256I compatible with Pb-free assembly processes?

Yes, XC2V256I is available in Pb-free packaging variants - specifically the FGG256 (Pb-free FG256) - as documented in Xilinx DS031 Module 1. The FG256 package used in XC2V250-5FG256I is RoHS-compliant and qualified for lead-free reflow profiles, with identical mechanical and electrical specifications to the standard version.

Can XC2V250-5FG256I perform real-time configuration readback?

Yes, XC2V250-5FG256I supports full configuration readback per IEEE 1532, allowing verification of bitstream integrity and real-time debugging. Readback includes configuration memory contents, flip-flop/latch states, distributed SelectRAM, and block SelectRAM - accessible via JTAG or SelectMAP interface without halting operation.