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AMD XC2V250-5FG456I
- Part No.:
- XC2V250-5FG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2V250-5FG456I.pdf
- Description:
- IC FPGA 200 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC2V250-5FG456I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FG456) package, rated for industrial temperature range (–40°C to +100°C), with 200 user I/Os, 1.5 V core supply, and integrated Digital Clock Managers (DCMs) for precise clock de-skew and phase shifting. It targets high-speed telecommunication and DSP systems requiring PCI, LVDS, and DDR interfaces.
For engineers reviewing the XC2V256-5FG456I datasheet, XC2V250-5FG456I pinout, XC2V250-5FG456I application, or XC2V250-5FG456I equivalent, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, SelectRAM memory configuration options, and validated alternative FPGAs for migration or second-sourcing.
Technical Context
The XC2V250-5FG456I implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, and 24 Block SelectRAM modules delivering up to 3 Mb of dual-port RAM. Its IOBs support DDR input/output registers and Digitally Controlled Impedance (DCI) for on-chip termination across 19 single-ended and 6 differential I/O standards.
It integrates 8 DCM modules (not 12 - per Table 1 for XC2V250), each providing self-calibrating clock multiplication/division, ±180° coarse phase shift, and fine-grained 1/256-period adjustments. Routing uses Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 250,000 - indicates logic capacity suitable for mid-complexity protocol bridging or baseband processing. |
| User I/O Count | 200 - supports dense interface consolidation (e.g., 32-bit DDR SDRAM + 8-bit PCI-X + LVDS video). |
| Core Voltage (VCCINT) | 1.5 V - enables low-power operation while maintaining 420 MHz internal clock speed (Advance Data). |
| DCM Modules | 8 - provides independent clock domain management for multi-rate systems (e.g., video pixel clock + audio sample clock + control bus clock). |
| SelectRAM Capacity | 3 Mb total (24 × 18 Kb blocks) - configurable as 16K×1 to 512×36 dual-port RAM, enabling embedded FIFOs or coefficient tables. |
| I/O Standards | LVTTL, LVCMOS (1.5–3.3 V), PCI-X (133 MHz), LVDS (840 Mb/s), SSTL/HSTL - ensures direct interfacing with DDR SDRAM, QDR SRAM, and network PHYs. |
| Speed Grade | -5 - specifies guaranteed timing performance at industrial temperature, including 6.5 ns CLB propagation delay and 1.2 ns carry chain delay. |
Pinout & Package
XC2V250-5FG456I uses the FG456 (Fine-Pitch BGA, 1.00 mm pitch, 23 mm × 23 mm) wire-bond package with 456 balls. Pin definitions follow Xilinx DS031 Module 4; ball grid includes 200 user I/Os, 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD), and power/ground distribution optimized for signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives master serial or slave serial configuration; must be stable before PROG_B release. |
| DONE | Configuration Status Output | Open-drain output pulled high externally; signals successful bitstream loading and initialization completion. |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, SelectMAP, boundary-scan) at power-up; sampled on PROG_B rising edge. |
| TCK/TDI/TDO/TMS | JTAG Test Access Port | Enable IEEE 1149.1 boundary-scan testing, configuration via IEEE 1532, and readback verification. |
| VCCINT | Core Power Supply | 1.5 V ±3% supply; requires low-noise regulation and local decoupling due to high di/dt during CLB switching. |
| VCCAUX | Auxiliary Power Supply | 3.3 V supply for DCMs, configuration logic, and JTAG circuitry; must be powered before or simultaneously with VCCINT. |
| VCCO | I/O Bank Power Supply | Bank-specific voltage (1.5–3.3 V); determines supported I/O standard and DCI reference; each bank independently configurable. |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for LVDCI, SSTL_DCI, HSTL_DCI, and LVDS_DCI - eliminates external resistors and improves signal integrity for point-to-point DDR/LVDS links. |
| DDR I/O Registers | Dual-edge-clocked input/output registers per IOB - enables true double-data-rate capture/transmission without external FIFOs (e.g., for SDR/DDR SDRAM interfaces). |
| Block SelectRAM Flexibility | 24 × 18 Kb dual-port RAM blocks supporting 16K×1 to 512×36 configurations with three read-during-write modes - allows implementation of asynchronous FIFOs, ping-pong buffers, or filter coefficient storage. |
| Dedicated 18×18 Multipliers | 48 hardwired multipliers operating at >200 MHz - accelerates FIR filtering, FFT twiddle factor computation, and motor control algorithms without LUT resource consumption. |
| Active Interconnect Routing | Predictable delay routing matrix with 24 long lines per row/column and fanout-independent timing - simplifies timing closure for designs exceeding 100 MHz system clocks. |
Applications
| Telecom Line Card Interface | Industrial Video Acquisition |
|---|---|
Use Scenario: Aggregating multiple T1/E1 streams into a packetized backplane interface using HDLC framing and CRC generation. IC Role / Device Role / Timing Role: XC2V250-5FG456I implements protocol engines, elastic store buffers, and clock domain crossing between line-rate (2.048 MHz) and system bus (66 MHz PCI-X) domains. Use Value: Integrated DCMs eliminate external clock synthesizers; 200 I/Os enable parallel T1 framer interfaces plus PCI-X host connection; SelectRAM stores frame buffers and lookup tables. |
Use Scenario: Capturing 720p60 YUV422 video from dual-channel LVDS image sensors and compressing via motion-compensated DCT. IC Role / Device Role / Timing Role: XC2V250-5FG456I serves as sensor interface bridge and real-time encoder controller, synchronizing LVDS pixel clocks (74.25 MHz) with internal processing clocks. Use Value: LVDS I/O support enables direct sensor connection; DDR-capable IOBs capture pixel data on both edges; 48 multipliers accelerate DCT/quantization stages. |
| Medical Imaging Data Hub | Test Equipment Pattern Generator |
Use Scenario: Consolidating analog-to-digital data streams from 16-channel ultrasound receive paths into a Gigabit Ethernet uplink. IC Role / Device Role / Timing Role: XC2V250-5FG456I performs channel gain correction, beamforming summation, and packet assembly using distributed arithmetic resources. Use Value: 1.5 V core reduces thermal load in sealed enclosures; 24 SelectRAM blocks buffer raw ADC samples; DCI ensures clean LVDS/RS-422 sensor interface. |
Use Scenario: Generating high-fidelity digital stimulus patterns (up to 200 MHz) for ATE testing of mixed-signal ASICs. IC Role / Device Role / Timing Role: XC2V250-5FG456I acts as pattern sequencer and timing generator, driving 128-pin parallel test vectors with sub-nanosecond skew control. Use Value: 8 DCMs generate independent, phase-aligned clocks for vector launch, capture, and strobe; 200 I/Os support wide parallel buses; fast carry chains enable precise delay synthesis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V250-4FG456I | Slower speed grade (-4 vs. -5); 10–15% higher worst-case propagation delay; identical logic resources, I/O count, and package. | Suitable for cost-sensitive designs where 66 MHz system clock suffices; not recommended for 100+ MHz DDR or LVDS links. | Select when timing margin exists and BOM cost reduction is prioritized over maximum frequency headroom. |
| XC3S200-4PQ208I | Spartan-3 family; 200K logic cells (not gates); no DCMs (only DLL); 112 I/Os; 1.2 V core; PQ208 package (208-pin TQFP). | Targeted at lower-cost, lower-I/O-count control applications; lacks DCI, LVDS, and PCI-X support; no block RAM multipliers. | Choose only for non-timing-critical control logic where migration from Virtex-II is driven by obsolescence, not performance. |
Compared with XC2V250-5FG456I, the -4 speed grade offers identical functionality at reduced timing performance, while the XC3S200-4PQ208I represents a generational and architectural downgrade - trading DCM precision, I/O flexibility, and embedded memory for lower unit cost and power, but requiring significant redesign for interface compatibility.
Availability
XC2V250-5FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, medical data acquisition, and automated test equipment requiring stable component supply across extended lifecycle programs.
Supply support for XC2V250-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company, acquired by AMD in 2022, historically focused on high-performance FPGAs, SoCs, and adaptive compute acceleration platforms.
The Virtex-II family was designed for high-bandwidth, low-latency signal processing in wired/wireless infrastructure, video processing, and high-end test equipment - emphasizing clock management, memory integration, and I/O versatility.
FAQ
What is the maximum operating junction temperature for XC2V250-5FG456I?
The XC2V250-5FG456I is rated for industrial temperature range with a maximum junction temperature of +100°C. This specification assumes proper PCB thermal design, including adequate copper pour, thermal vias under the package, and airflow consistent with Xilinx Thermal Management Guidelines for FG456 packages. Operation beyond this limit risks configuration loss and accelerated parametric drift.
Does XC2V250-5FG456I support IEEE 1532 boundary-scan configuration?
Yes, XC2V250-5FG456I fully supports IEEE 1532 compliant boundary-scan configuration via its JTAG TAP controller. This enables in-system programming, readback verification of configuration bitstreams, and access to internal logic analyzer probes - all without requiring dedicated configuration pins beyond TCK/TDI/TDO/TMS.
Can XC2V250-5FG456I interface directly with 3.3 V PCI-X slots?
Yes, XC2V250-5FG456I supports PCI-X 133 MHz and 66 MHz at 3.3 V through its SelectIO-Ultra IOBs. It meets PCI-X electrical specifications for drive strength, slew rate, and noise immunity when configured with appropriate VCCO = 3.3 V and termination settings - no level-shifting required for slot-compatible signaling.
How many 18 Kb Block SelectRAM modules does XC2V250-5FG456I contain?
XC2V250-5FG456I contains 24 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. These can be configured individually as 16K×1, 8K×2, 4K×4, 2K×9, 1K×18, or 512×36, and support simultaneous read/write operations with three selectable read-during-write behaviors - critical for real-time buffering and filtering applications.
Is XC2V250-5FG456I pin-compatible with other Virtex-II devices in FG456 packaging?
Yes, all Virtex-II devices offered in the FG456/FGG456 package (including XC2V250, XC2V500, XC2V1000) share identical pinouts and footprint. This enables hardware scalability - for example, designing a single PCB that supports XC2V250-5FG456I for prototyping and later upgrading to XC2V500-5FG456I for higher gate count - without layout changes.
XC2V250-5FG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 442368
- Number of I/O:
- 200
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2V250-5FG456I FAQ
1.How can I place an order for XC2V250-5FG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V250-5FG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V250-5FG456I reliable?
The price and inventory of XC2V250-5FG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V250-5FG456I is usually 5 days.
3.What payment methods are accepted for XC2V250-5FG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V250-5FG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V250-5FG456I?
XC2V250-5FG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V250-5FG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V250-5FG456I?
For technical support, including XC2V250-5FG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V250-5FG456I requirements.
6.How does Aetrix verify that XC2V250-5FG456I is sourced from the original manufacturer or authorized distributors?
All XC2V250-5FG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V250-5FG456I meets industry standards.
7.What is the process for return or replacement of XC2V250-5FG456I?
All XC2V250-5FG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2V250-5FG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V250-5FG456I part is unused and in its original packaging.
Return procedure for XC2V250-5FG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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