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AMD XC2V250-5FGG256C
- Part No.:
- XC2V250-5FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2V250-5FGG256C.pdf
- Description:
- IC FPGA 172 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,298
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Product details
Overview
XC2V250-5FGG256C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating at -5 speed grade with commercial temperature range (0°C to +85°C). It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs), enabling high-speed telecommunication and DSP applications requiring LVDS, DDR, and PCI interfaces.
For engineers reviewing the XC2V256-5FGG256C datasheet, XC2V250-5FGG256C pinout, XC2V250-5FGG256C application, or XC2V250-5FGG256C equivalent, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DC/switching characteristics, and validated alternative FPGAs for migration or second-sourcing - all grounded in DS031 (v3.5) November 2007 specification data.
Technical Context
The XC2V250-5FGG256C implements a hierarchical SRAM-based architecture with four core resources: IOBs supporting 19 single-ended and 6 differential I/O standards (including LVDS at 840 Mb/s and PCI-X at 133 MHz), CLBs containing dual 4-input LUTs and flip-flops per slice, 18-Kb dual-port Block SelectRAM with read-during-write capability, and DCMs offering precise de-skew, ±180° phase shift, and M/D frequency synthesis. Its Active Interconnect routing provides predictable delay independent of fanout.
It uses a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO) ranging from 1.5 V to 3.3 V. Digitally Controlled Impedance (DCI) enables on-chip series or split termination for LVDCI, SSTL, and HSTL standards without external resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 250,000 - defines logic capacity for complex digital systems including protocol stacks and control planes |
| Configurable Logic Blocks (CLBs) | 1,536 - each contains 4 slices with dual LUTs and registers; supports synchronous logic, distributed RAM, and shift registers |
| Block RAM (SelectRAM) | 24 × 18-Kb blocks = 432 Kb total - configurable as dual-port memory (e.g., 512 × 36) with three read-during-write modes |
| Digital Clock Managers (DCMs) | 8 - provide jitter-free clock multiplication/division, fine-grained phase shift (1/256 period), and input-to-output de-skew |
| User I/O Pins | 172 - supports up to 19 single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and 6 differential (LVDS, BLVDS, LVPECL) standards |
| Speed Grade | -5 - guarantees timing performance meeting worst-case setup/hold and propagation delays per DS031 Module 3 |
| Package | FGG256 - 256-ball Fine-Pitch BGA, 1.00 mm pitch, Pb-free, wire-bond construction with 172 user I/Os |
Pinout & Package
XC2V256-5FGG256C is housed in a 256-ball Fine-Pitch BGA (FGG256) package with 1.00 mm pitch, Pb-free finish, and wire-bond interconnect. The package provides 172 user I/O pins plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master/slave serial or SelectMAP mode; must be stable before PROG_B release |
| DONE | Configuration Status Output | Open-drain signal pulled high externally; goes high when configuration completes successfully and device enters user mode |
| M0–M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, slave SelectMAP, master SelectMAP, boundary-scan) at power-up |
| PROG_B | Program Initiate Input | Active-low signal that resets configuration logic and clears internal memory; initiates reconfiguration when released |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port; enables configuration, verification, and debug via JTAG chain |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO-Ultra I/O Technology | Supports 19 single-ended (LVTTL, SSTL-2/3, HSTL-I/II/III/IV, PCI-X) and 6 differential (LVDS, BLVDS, LVPECL) standards with programmable drive strength (2–24 mA) and on-die termination |
| Digitally Controlled Impedance (DCI) | On-chip series or split termination for LVDCI, SSTL_DCI, and HSTL_DCI standards eliminates external resistors and improves signal integrity for point-to-point links |
| Embedded Multiplier Blocks | 48 dedicated 18×18-bit two's complement multipliers enable efficient FIR filtering, FFT, and arithmetic-intensive DSP functions without consuming CLB resources |
| Triple-DES Bitstream Encryption | On-chip DES decryptor secures configuration bitstream using one or two triple-DES key sets, preventing IP theft during field programming |
| Integrated Logic Analyzer (ILA) | Hardware debug core allows real-time capture of internal signals (flip-flops, RAM contents) via JTAG, accelerating system validation and fault isolation |
Applications
| Telecom Line Card | Industrial Video Encoder |
|---|---|
Use Scenario: High-density aggregation of multiple T1/E1 or STM-1 interfaces with protocol conversion and packet buffering. IC Role / Device Role / Timing Role: FPGA serves as line interface unit (LIU), implementing HDLC framing, CRC generation, and clock recovery via DCM-based PLL emulation. Use Value: 8 DCMs enable simultaneous de-skew of multiple recovered clocks; 172 I/Os support parallel bus interfaces to multiple PHYs; LVDS I/O handles backplane data at 840 Mb/s. |
Use Scenario: Real-time compression of HD-SDI video streams using motion estimation and entropy coding before transmission over Gigabit Ethernet. IC Role / Device Role / Timing Role: Programmable logic fabric executes custom video pipeline stages; Block RAM buffers frame lines; multipliers accelerate DCT/IDCT computation. Use Value: 432 Kb embedded RAM eliminates external SDRAM for line buffering; 48 multipliers deliver >2 GOPS peak throughput for 1080p encoding at 60 fps. |
| PCI-X Embedded Controller | High-Speed Test Equipment |
Use Scenario: Host adapter for legacy PCI-X peripherals in industrial automation controllers requiring deterministic latency and hot-plug support. IC Role / Device Role / Timing Role: Implements PCI-X 133 MHz physical layer, transaction layer, and DMA engine using hard-wired and soft logic resources. Use Value: Native PCI-X compliance at 3.3 V eliminates level-shifting; DCI termination ensures signal integrity on long backplane traces; 172 I/Os accommodate address/data multiplexing and sideband signals. |
Use Scenario: Pattern generator and analyzer in automated test equipment (ATE) for validating high-speed SerDes and memory interfaces. IC Role / Device Role / Timing Role: Generates precise stimulus waveforms and captures response data with sub-nanosecond timestamping using DCM-controlled sampling clocks. Use Value: DCM fine-phase shift (1/256 period) enables <10 ps timing resolution; LVDS I/O achieves 840 Mb/s pattern rates; readback capability verifies internal state post-capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2V250-4FGG256C | Slower -4 speed grade; lower maximum clock frequency and longer propagation delays than -5 grade | Suitable for cost-sensitive designs where timing margin is sufficient; not recommended for 133 MHz PCI-X or 840 Mb/s LVDS links | Select only if design meets timing closure at -4 grade; verify DCM lock range and I/O setup/hold margins under worst-case voltage/temperature |
| XC3S200-4PQG240C | Spartan-3 family; 200K logic cells, no DCMs (only DLL), no Block RAM (only distributed RAM), 173 I/Os, 0.13 µm process | Targeted at low-cost, non-timing-critical control logic; lacks PCI-X/LVDS support and embedded memory for buffering | Use only for simple glue logic or replacement where no high-speed I/O, clock management, or block memory is required |
Compared with XC2V250-5FGG256C, the -4 variant trades performance for cost while retaining identical architecture and pinout; the Spartan-3 alternative sacrifices clock precision, memory depth, and I/O flexibility for lower price and power - making it unsuitable for telecom or video applications requiring deterministic timing or large on-chip storage.
Availability
XC2V250-5FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, PCI-X embedded controllers, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for XC2V250-5FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.
The Virtex-II family was designed for demanding applications in telecommunications, networking, and DSP - delivering platform-level integration of logic, memory, arithmetic, and clock management in a single chip.
FAQ
What is the maximum supported I/O standard speed for XC2V250-5FGG256C?
XC2V250-5FGG256C supports LVDS signaling at up to 840 Mb/s, PCI-X at 133 MHz (3.3 V), and DDR SDRAM interfaces with built-in DDR input/output registers. These speeds are guaranteed under -5 speed grade conditions per DS031 Module 3 switching characteristics, assuming proper PCB layout and termination.
Does XC2V250-5FGG256C support on-chip termination for differential I/O standards?
XC2V250-5FGG256C does not support Digitally Controlled Impedance (DCI) for differential standards like LVDS or LVPECL. DCI is only available for single-ended I/Os (e.g., LVDCI_33, SSTL3_I_DCI, HSTL_I_DCI). Differential pairs require external termination resistors per JEDEC specifications.
How many Block SelectRAM modules does XC2V250-5FGG256C contain, and what configurations are supported?
XC2V250-5FGG256C contains 24 Block SelectRAM modules, each providing 18 Kb of dual-port RAM. Supported configurations include 16K × 1, 8K × 2, 4K × 4, 2K × 9, 1K × 18, and 512 × 36 bits per block, with three read-during-write modes and independent synchronous ports.
Is XC2V250-5FGG256C compatible with JTAG boundary-scan testing?
Yes, XC2V250-5FGG256C fully complies with IEEE 1149.1 (JTAG) and supports BYPASS, SAMPLE, EXTEST, INTEST, and HIGHZ instructions. Its Test Access Port (TAP) enables configuration, readback, and real-time debugging via standard JTAG chains without requiring additional hardware.
What configuration modes are supported by XC2V250-5FGG256C?
XC2V250-5FGG256C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Configuration is initiated via PROG_B and controlled by M0–M2 pins, with CCLK driving the process and DONE indicating completion.
XC2V250-5FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 442368
- Number of I/O:
- 172
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2V250-5FGG256C FAQ
1.How can I place an order for XC2V250-5FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2V250-5FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2V250-5FGG256C reliable?
The price and inventory of XC2V250-5FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2V250-5FGG256C is usually 5 days.
3.What payment methods are accepted for XC2V250-5FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2V250-5FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2V250-5FGG256C?
XC2V250-5FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2V250-5FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2V250-5FGG256C?
For technical support, including XC2V250-5FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2V250-5FGG256C requirements.
6.How does Aetrix verify that XC2V250-5FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2V250-5FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2V250-5FGG256C meets industry standards.
7.What is the process for return or replacement of XC2V250-5FGG256C?
All XC2V250-5FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2V250-5FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2V250-5FGG256C part is unused and in its original packaging.
Return procedure for XC2V250-5FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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