AMD XC2V250-5FGG256I

Overview

XC2V250-5FGG256I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating at -5 speed grade and rated for industrial temperature range (–40°C to +100°C). It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (18 Kb each), 8 Digital Clock Managers (DCMs), and supports up to 200 user I/Os with SelectIO™-Ultra technology including LVDS, SSTL, HSTL, and PCI-compliant interfaces. It is used in high-speed telecom line cards requiring deterministic clock management and DDR memory interfacing.

For engineers reviewing the XC2V250-5FGG256I datasheet, XC2V250-5FGG256I pinout, XC2V250-5FGG256I application, or XC2V256I equivalent, this page delivers verified architecture details, I/O standard support, DCM timing parameters, CLB resource mapping, and industrial-grade thermal/power specifications - all confirmed against DS031 (v3.5) November 2007 official Xilinx documentation.

Technical Context

The XC2V250-5FGG256I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Its architecture includes 24×16 CLB array, 24 DCMs (8 active in this density), and 24 Block SelectRAM modules supporting dual-port configurations from 512×36 to 16K×1 bits with read-during-write capability.

It features Digitally Controlled Impedance (DCI) for on-chip series termination across LVCMOS, SSTL, HSTL, and GTL standards, plus DDR-capable IOBs with independent input/output/3-state registers clocked by phase-shifted DCM outputs. Routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2V256I is housed in a 256-ball Fine-Pitch BGA (FGG256) package with 1.00 mm ball pitch, Pb-free finish, and wire-bond interconnect. The package supports 200 maximum user I/Os, excluding 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-5FGG256I, the -4 variant trades timing margin for lower power and cost in thermally constrained environments, while the -5FG456C offers I/O scalability and simplified thermal validation at the expense of mechanical footprint and ruggedness.

Availability

XC2V250-5FGG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and medical imaging systems requiring stable component supply across extended lifecycle programs.

Supply support for XC2V250-5FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as high-performance FPGA platforms for demanding signal processing and connectivity applications.

The Virtex-II product line was engineered for high-bandwidth, low-latency digital systems in telecom, video, and DSP markets - emphasizing clock management precision, memory integration, and I/O flexibility across industrial temperature ranges.

FAQ

What is the maximum supported I/O standard voltage for XC2V250-5FGG256I?

XC2V250-5FGG256I supports single-ended I/O standards with VCCO ranging from 1.5 V (LVCMOS15, HSTL_I) to 3.3 V (LVTTL, PCI-X, SSTL3_II), and differential standards including LVDS_25 (2.5 V) and LVDS_33 (3.3 V). It does not support 5 V I/O; external current-limiting resistors are required for 5 V-tolerant input operation per Xilinx Tech Topic documentation.

Does XC2V250-5FGG256I include on-chip memory for configuration security?

Yes, XC2V250-5FGG256I integrates an on-chip DES decryptor supporting one or two triple-DES key sets to secure configuration bitstreams. This enables encrypted bitstream loading via SelectMAP or JTAG, preventing unauthorized cloning or reverse engineering of the programmed logic design.

How many Digital Clock Managers (DCMs) are available in XC2V250-5FGG256I?

XC2V250-5FGG256I contains 8 Digital Clock Managers (DCMs), as confirmed in Table 1 of DS031-1 (v3.5). Each DCM provides clock de-skew, frequency synthesis (M/D ratio), and coarse/fine phase shifting - sufficient to manage multiple synchronous domains such as DDR memory, PCI-X bus, and video pixel clocks within a single device.

What is the role of Digitally Controlled Impedance (DCI) in XC2V250-5FGG256I?

Digitally Controlled Impedance (DCI) in XC2V250-5FGG256I provides programmable on-chip series termination for single-ended I/O standards like LVCMOS, SSTL, and HSTL. It eliminates the need for external termination resistors, reduces PCB routing complexity, and maintains consistent signal integrity across voltage/temperature variations without manual calibration.

Can XC2V250-5FGG256I support DDR2 memory interfaces?

XC2V250-5FGG256I supports DDR SDRAM interfaces up to 200 MHz clock rate (400 Mb/s data rate) using its DDR-capable IOBs and DCM-generated phase-aligned clocks. While DDR2-specific timing parameters (e.g., tRCD, tRP) are not guaranteed in the -5 grade, designs targeting 200 MHz DDR2 operation have been validated in reference designs using this device and appropriate PCB layout practices.