AMD XC2V250-5FGG456C

Overview

XC2V250-5FGG456C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, operating at commercial temperature range (0°C to +85°C) with -5 speed grade. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs). It targets high-speed telecommunication and DSP systems requiring PCI, LVDS, and DDR interfaces.

For engineers reviewing the XC2V250-5FGG456C datasheet, XC2V250-5FGG456C pinout, XC2V250-5FGG456C application, or XC2V256-5FGG456C equivalent, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, DCM timing parameters, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V250-5FGG456C implements a 0.15 µm / 0.12 µm 8-layer metal CMOS process with SRAM-based configuration, 1.5 V core supply (VCCINT), and dual I/O supplies (VCCAUX = 3.3 V, VCCO configurable per bank). Its architecture features hierarchical Active Interconnect routing, distributed carry chains, and horizontal cascade logic for high-fanout arithmetic.

Each IOB supports single-ended (LVTTL, LVCMOS, SSTL, HSTL, GTL/PECL-compatible) and differential standards (LVDS, BLVDS, LDT, LVPECL), with Digitally Controlled Impedance (DCI) enabling on-die series or split termination. All 200 user I/Os are banked and independently configurable for voltage and standard.

Key Specifications

Pinout & Package

XC2V250-5FGG456C uses the FGG456 package: a Pb-free, wire-bond, Fine-Pitch Ball Grid Array with 1.00 mm pitch, 23 mm × 23 mm body size, and 456 solder balls. Of these, 200 are user-configurable I/Os; 15 are dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK–TDO, TMS, HSWAP_EN, DXN/DXP, RSVD); remaining balls serve power (VCCINT, VCCAUX, VCCO), ground (GND), and no-connect (NC) functions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-5FGG456C, XCV300E-4PQ240C offers lower gate count and no DCMs-making it unsuitable for source-synchronous interfaces-while XC3S200-4PQ240C trades hard multipliers and DCM precision for lower cost and power, limiting its use in high-performance signal processing.

Availability

XC2V250-5FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial control systems, and defense electronics requiring stable component supply across extended production lifecycles.

Supply support for XC2V250-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022. It delivers programmable silicon platforms for high-performance, low-latency applications across aerospace, communications, and data center markets.

The Virtex-II family was engineered for high-bandwidth, low-jitter system integration-specifically targeting telecom line cards, video processing engines, and PCI-X peripheral bridges requiring deterministic timing and multi-standard I/O flexibility.

FAQ

What is the maximum operating frequency of the XC2V250-5FGG456C?

The XC2V250-5FGG456C has a -5 speed grade, guaranteeing a maximum internal clock frequency of 420 MHz under specified conditions. This rating applies to CLB-to-CLB paths; actual achievable frequency depends on design topology, placement, and routing. The device also supports 840 Mb/s I/O toggle rates for LVDS and other high-speed standards, validated in DS031 Module 3 switching characteristics tables.

Does the XC2V250-5FGG456C support DDR memory interfaces?

Yes, the XC2V250-5FGG456C supports DDR SDRAM interfaces through dedicated DDR-capable IOBs with built-in input and output registers, and through DCM-controlled clocking for precise timing alignment. It complies with JEDEC DDR-400 (200 MHz) specifications when used with appropriate VCCO and board-level termination, as documented in Module 2 functional description and Module 3 timing parameters.

How many block RAM resources does the XC2V250-5FGG456C provide?

The XC2V250-5FGG456C contains 24 Block SelectRAM™ modules, each delivering 18 Kb of dual-port RAM, for a total of 432 Kb. These blocks are configurable from 16K×1 to 512×36 bits, support three read-during-write modes, and can be cascaded to form larger memory structures-enabling robust frame buffering, FIFOs, and lookup tables in video and packet-processing designs.

Is the XC2V250-5FGG456C RoHS compliant?

Yes, the XC2V250-5FGG456C is Pb-free and RoHS compliant. The "G" in FGG456 denotes the Pb-free wire-bond fine-pitch BGA package, as confirmed in DS031 Module 1 ordering examples and packaging notes. Xilinx certifies compliance per EU Directive 2011/65/EU and provides material declarations upon request.

Can the XC2V250-5FGG456C perform bitstream encryption?

Yes, the XC2V250-5FGG456C includes an on-chip Triple-DES decryptor that secures configuration bitstreams using one or two independent 168-bit key sets. This feature prevents unauthorized cloning or reverse engineering of programmed logic, and is enabled during bitstream generation using Xilinx ISE tools with appropriate security options selected.