AMD XC2V250-5FGG456I

Overview

XC2V250-5FGG456I from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 456-pin Fine-Pitch BGA (FGG456) package, rated for industrial temperature range (–40°C to +100°C), with 200 user I/Os, eight Digital Clock Managers (DCMs), and 1.5 V core supply. It implements configurable logic blocks (CLBs), 18-Kb Block SelectRAM™, 18×18 multipliers, and SelectIO™-Ultra I/O for high-speed telecommunication and DSP systems.

For engineers reviewing the XC2V250-5FGG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource count (1,536 slices), and industrial-grade thermal/power specifications - all confirmed against DS031 (v3.5) November 2007.

Technical Context

The XC2V250-5FGG456I implements a 0.15 µm / 0.12 µm 8-layer metal CMOS architecture with active interconnect routing, supporting up to 432 CLB slices, 48 dedicated 18×18 multipliers, and 24 Block SelectRAM™ modules (each 18 Kb dual-port). Its eight DCMs provide fully digital clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution).

It features Digitally Controlled Impedance (DCI) for on-chip termination across 19 single-ended and six differential I/O standards including LVDS, BLVDS, LVPECL, and SSTL-2/3, with programmable drive strength (2–24 mA) and support for DDR input/output registers per IOB - all operating under 1.5 V VCCINT, 3.3 V VCCAUX, and I/O-supply-dependent VCCO.

Key Specifications

Pinout & Package

XC2V250-5FGG456I uses the FGG456 package: a Pb-free, wire-bond, fine-pitch ball grid array with 1.00 mm pitch, 23 mm × 23 mm body size, and 456 balls arranged in a 23×23 array (with corner balls omitted). The package supports 200 user I/Os plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system-on-module applications.

Compared with XC2V250-4FGG456I and XC2V250-5FG456C, the XC2V250-5FGG456I uniquely combines industrial temperature qualification, Pb-free compliance, and -5 speed grade - making it the sole option for deployed telecom infrastructure and certified avionics where both reliability and timing margin are mandatory.

Availability

XC2V250-5FGG456I is available at Aetrix Electronics and suitable for baseband wireless transceivers, industrial motion controllers, medical imaging pipelines, and avionics display interfaces requiring stable component supply across extended product lifecycles.

Supply support for XC2V250-5FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures for high-performance, system-level integration.

The Virtex-II family was designed for high-density, high-speed applications in telecommunications, networking, and DSP - delivering platform-level features including DCMs, SelectIO™-Ultra, and embedded memory to replace ASICs in rapidly evolving protocols.

FAQ

What is the maximum I/O count supported by XC2V250-5FGG456I?

The XC2V250-5FGG456I supports exactly 200 user I/Os, as confirmed in Table 6 of DS031 (v3.5) for the XC2V250 device in the FGG456 package. This excludes 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The count is fixed for this device/package combination and does not scale with speed grade or temperature variant.

Does XC2V250-5FGG456I support LVDS signaling?

Yes, XC2V250-5FGG456I supports LVDS signaling at up to 840 Mb/s, with dedicated current-mode drivers and on-die termination options. It implements LVDS_25 and LVDS_33 standards per Table 2 in Module 2 of DS031, and supports differential pair routing with matched trace lengths. Each LVDS pair consumes two adjacent I/O pins and requires proper VCCO = 2.5 V or 3.3 V.

What clock management resources are integrated into XC2V250-5FGG456I?

The XC2V250-5FGG456I integrates eight Digital Clock Manager (DCM) modules. Each DCM provides clock de-skew, frequency synthesis (M/D ratio), and phase shifting in increments of 1/256 of the input clock period. These DCMs drive up to 16 global clock multiplexer buffers and support input frequencies from 12 MHz to 240 MHz, enabling robust multi-clock domain synchronization.

Is XC2V250-5FGG456I RoHS compliant?

Yes, XC2V250-5FGG456I is RoHS compliant. The "G" in FGG456 denotes Pb-free packaging, as defined in Xilinx documentation (Module 1, page 6). It uses lead-free solder spheres and complies with EU Directive 2011/65/EU, with full material declarations available in Xilinx's Pb-Free Packaging Reference Guide (UG014).

Can XC2V250-5FGG456I perform partial reconfiguration?

Yes, XC2V250-5FGG456I supports partial reconfiguration as specified in Module 1 of DS031. This capability allows dynamic modification of specific logic regions while the rest of the design remains operational - critical for adaptive radio protocols and field-upgradable control algorithms. Implementation requires Xilinx ISE 6.3i or later and appropriate bitstream partitioning tools.