AMD XC2V250-6CSG144C

Overview

XC2V250-6CSG144C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 144-ball chip-scale BGA (CSG144) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs). It targets high-speed interface bridging in telecom line cards requiring LVDS, PCI-X, and DDR I/O support.

For engineers reviewing the XC2V250-6CSG144C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard compatibility (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource mapping, and validated alternatives for migration or second-sourcing in legacy FPGA designs.

Technical Context

The XC2V250-6CSG144C implements a 0.15 µm/0.12 µm 8-layer metal CMOS architecture with SRAM-based configuration, 1.5 V core supply (VCCINT), and dual 3.3 V auxiliary supplies (VCCAUX and VCCO). Its routing uses fourth-generation Active Interconnect Technology with 24 long lines per row/column and predictable delay independent of fanout.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic. IOBs support single-ended (LVTTL, LVCMOS, SSTL, HSTL, PCI-X) and differential (LVDS, BLVDS, LVPECL) standards, with Digitally Controlled Impedance (DCI) enabling on-die series or split termination for 15 I/O families.

Key Specifications

Pinout & Package

XC2V250-6CSG144C uses a 144-ball chip-scale BGA (CSG144) package with 0.80 mm pitch, 12 mm × 12 mm body size, and Pb-free construction. The package supports 200 user I/Os plus 15 dedicated configuration/control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XCV2000E-6FG456C, XC2V250-6CSG144C offers smaller footprint and lower I/O count but identical DCM precision and DCI capability; versus XC3S200-4PQ208C, it delivers superior clock control, higher I/O bandwidth, and hardware-optimized memory interfaces at the cost of higher static power and legacy toolchain dependency.

Availability

XC2V250-6CSG144C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and video processing applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2V250-6CSG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA manufacturer acquired by AMD in 2022, known for programmable logic architectures enabling high-performance digital system design across communications, aerospace, and test equipment.

The Virtex-II family was engineered for high-speed, high-density applications demanding advanced clock management, memory-rich logic fabric, and multi-standard I/O-targeting systems where ASIC-level performance meets FPGA flexibility.

FAQ

What is the maximum operating frequency of the XC2V250-6CSG144C core logic?

The XC2V250-6CSG144C has a -6 speed grade specifying a guaranteed maximum internal clock frequency of 420 MHz under worst-case commercial conditions (0°C to +85°C, VCCINT = 1.5 V ±3%). This value is derived from silicon characterization and documented in Module 3 (DC and Switching Characteristics) of DS031. Actual achievable frequency depends on design topology, placement, and routing; the XC2V250-6CSG144C DCMs support output frequencies up to 500 MHz with appropriate feedback configuration.

Does the XC2V250-6CSG144C support DDR2 SDRAM interfaces?

No, the XC2V250-6CSG144C does not natively support DDR2 SDRAM interfaces. Its I/O standards include DDR SDRAM (single-data-rate) and QDR SRAM, but DDR2-specific signaling (SSTL_18 with dynamic ODT, 1.8 V VDDQ, and extended timing parameters) is not supported. The device supports SSTL_2_I and SSTL_2_II for 2.5 V DDR SDRAM only, as confirmed in Table 1 of DS031-2.

Can the XC2V250-6CSG144C be configured via JTAG after power-up?

Yes, the XC2V250-6CSG144C supports IEEE 1532 boundary-scan configuration through its dedicated TCK/TMS/TDI/TDO pins. This mode allows in-system programming and reconfiguration without requiring external PROM or configuration controllers. JTAG configuration is fully compliant with IEEE 1149.1 and supports readback of configuration data and internal register states, as detailed in the Configuration section of DS031-2.

How many global clock lines are available in the XC2V250-6CSG144C?

The XC2V250-6CSG144C provides 16 global clock lines, with eight allocated per quadrant. These lines connect to 16 global clock multiplexer buffers, each capable of glitch-free switching between two input clocks. Each of the eight DCMs can drive up to four of these buffers, enabling hierarchical clock distribution with minimal skew across large logic regions.

Is the XC2V250-6CSG144C RoHS compliant?

Yes, the XC2V250-6CSG144C is RoHS compliant and manufactured in Pb-free packaging, as indicated by the "G" suffix in CSG144 (Chip-Scale BGA, Pb-free). Xilinx confirms Pb-free status for all CSG, FGG, and BGG packages per its Pb-Free Packaging Program documentation referenced in DS031-1.