AMD XC2V250-6FG256C

Overview

XC2V250-6FG256C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FG256) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kbits RAM), and 8 Digital Clock Managers (DCMs). It targets high-speed telecommunication and DSP systems requiring LVDS, DDR, and PCI-X interfaces.

For engineers reviewing the XC2V256C datasheet, XC2V250-6FG256C pinout, XC2V250-6FG256C application, or XC2V250-6FG256C equivalent, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCM timing parameters, CLB resource mapping, and validated alternative FPGAs for migration or second-sourcing - all grounded in DS031 (v3.5) November 2007 official specification.

Technical Context

The XC2V250-6FG256C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support dual-data-rate (DDR) input/output paths using two phase-opposed clocks generated by integrated DCMs, enabling 840 Mb/s I/O performance.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, fast carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36. The device uses 1.5V VCCINT core supply, 3.3V VCCAUX auxiliary supply, and programmable VCCO per bank (1.5V–3.3V).

Key Specifications

Pinout & Package

XC2V250-6FG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FG256) package with 1.00 mm pitch, 17 mm × 17 mm body size, and wire-bond interconnect. It includes 172 user I/O pins distributed across 12 banks, plus 15 dedicated configuration and boundary-scan control pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD) and VBATT.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC2V250-6FG256C, the -5 variant trades 30 MHz peak performance for lower cost and power, while the -6FG456C retains identical logic resources but expands I/O count and package size - making it unsuitable for footprint-constrained deployments but valuable for scalable platform designs.

Availability

XC2V250-6FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and broadcast video applications requiring stable component supply across extended production lifecycles.

Supply support for XC2V250-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as high-performance, SRAM-based FPGAs for demanding system-level integration.

The Virtex-II product line was engineered for high-bandwidth, low-latency applications in telecommunications, networking, and DSP - emphasizing I/O flexibility, embedded memory, and deterministic clock management over raw gate count.

FAQ

What is the maximum operating frequency of the XC2V250-6FG256C?

The XC2V250-6FG256C has a -6 speed grade, guaranteeing a maximum internal clock frequency of 420 MHz under specified voltage and temperature conditions. This rating applies to CLB-to-CLB paths; actual system frequency depends on design complexity, routing, and I/O timing constraints as defined in DS031 Module 3 switching characteristics.

Does the XC2V250-6FG256C support DDR memory interfaces?

Yes, the XC2V250-6FG256C supports DDR SDRAM and DDR SRAM interfaces through its SelectIO-Ultra I/O blocks, which include built-in DDR input and output registers. It also supports SSTL and HSTL standards required for DDR signaling, with per-bank VCCO and programmable drive strength to meet JEDEC specifications.

How many block RAM resources does the XC2V250-6FG256C provide?

The XC2V250-6FG256C integrates 24 Block SelectRAM modules, each delivering 18 Kbits of true dual-port RAM, for a total of 432 Kbits. These blocks support configurable widths (up to 36 bits) and depths (down to 512 words), with three read-during-write modes essential for real-time buffering and FIFO applications.

Is the XC2V250-6FG256C RoHS compliant?

The XC2V250-6FG256C is offered in both standard and Pb-free variants. The part number suffix "FGG256" denotes the Pb-free version; "FG256" (as in XC2V250-6FG256C) refers to the standard leaded package. RoHS compliance documentation is available upon request from Xilinx or authorized distributors.

Can the XC2V250-6FG256C perform bitstream encryption?

Yes, the XC2V250-6FG256C includes an on-chip Triple-DES decryptor supporting one or two key sets. When enabled, it decrypts encrypted configuration bitstreams loaded via SelectMAP or JTAG, protecting intellectual property from unauthorized readback or cloning - a feature confirmed in DS031 Module 1 configuration section.