AMD XC2V250-6FGG256C

Overview

XC2V250-6FGG256C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 256-pin Fine-Pitch BGA (FGG256) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs). It targets high-speed interface bridging in telecom line cards requiring LVDS, PCI-X, and DDR I/O support.

For engineers reviewing the XC2V250-6FGG256C datasheet, XC2V256C pinout, XC2V250-6FGG256C application, or XC2V250-6FGG256C equivalent, key selection criteria include I/O count (200 user pins), DCM count (8), distributed RAM capacity (200 Kb), and compatibility with 3.3V/2.5V/1.8V single-ended and LVDS differential standards - all confirmed for this exact FGG256-packaged variant.

Technical Context

The XC2V250-6FGG256C implements Xilinx's IP-Immersion architecture with a 0.15 µm/0.12 µm 8-layer metal CMOS process, delivering up to 420 MHz internal logic performance and 840 Mb/s I/O rates. Its routing uses fourth-generation Active Interconnect Technology with predictable delay independent of fanout.

Each CLB contains four slices with dual 4-input LUTs, dual flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM provides dual-port 18 Kb RAM configurable from 16K×1 to 512×36; and each DCM supports precise de-skew, ±180° coarse phase shift, and fine-grained 1/256-cycle adjustments.

Key Specifications

Pinout & Package

XC2V256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.00 mm pitch, 17 mm × 17 mm body size, and Pb-free construction. Pin definitions follow Xilinx's standardized Virtex-II IOB layout with dedicated configuration, clock, and boundary-scan pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Compared with XC2V250-6FGG256C, the -5 variant trades timing margin for cost, while XC2V40-6FGG256C retains mechanical compatibility but sacrifices 84% of logic resources and all embedded RAM - making it viable only for minimal re-use scenarios with strict gate-count constraints.

Availability

XC2V250-6FGG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, broadcast video, and storage controller applications requiring stable component supply and long-term obsolescence management.

Supply support for XC2V250-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as its flagship high-performance platform for system-level integration.

The Virtex-II product line was engineered for demanding communications and signal-processing systems, emphasizing high-speed I/O, embedded memory, and deterministic clock management - directly enabling XC2V250-6FGG256C's role in PCI-X, LVDS, and DDR interface consolidation.

FAQ

What is the maximum number of user I/O pins supported by XC2V250-6FGG256C?

XC2V250-6FGG256C supports exactly 200 user I/O pins in the FGG256 package, as confirmed in Table 6 of DS031-1 (v3.5). This count excludes 15 dedicated control pins (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. All 200 pins are fully programmable for single-ended or differential signaling per IOSTANDARD attribute configuration.

Does XC2V250-6FGG256C support LVDS I/O, and what are the voltage requirements?

Yes, XC2V250-6FGG256C supports LVDS_25 and LVDS_33 standards with 2.5V or 3.3V VCCO supply, respectively. Differential pairs require two adjacent IOBs sharing the same switch matrix, and LVDS outputs deliver 0.25–0.40 V differential swing. No external termination is needed when using LVDS_DCI mode with internal 100 Ω differential termination.

How many Block SelectRAM modules does XC2V250-6FGG256C contain, and what configurations are supported?

XC2V250-6FGG256C contains 24 Block SelectRAM modules, totaling 432 Kb of dual-port RAM. Each 18 Kb block supports configurations from 16K×1 to 512×36 bits, with independent synchronous read/write ports and three read-during-write modes - enabling efficient FIFOs, frame buffers, and lookup tables without external memory.

Is XC2V250-6FGG256C compatible with JTAG boundary-scan testing?

Yes, XC2V250-6FGG256C fully complies with IEEE 1149.1 (JTAG) and supports BYPASS, SAMPLE, EXTEST, INTEST, and HIGHZ instructions. Its TCK/TMS/TDI/TDO pins implement a standard 4-wire test access port, enabling in-circuit programming, interconnect testing, and real-time register access during production and field diagnostics.

What configuration modes are supported by XC2V250-6FGG256C?

XC2V250-6FGG256C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Mode selection is controlled by M0–M2 pins at power-up. Fast SelectMAP mode enables parallel configuration speeds exceeding 100 Mbps, while boundary-scan allows secure, standards-based programming via JTAG.