AMD XC2V250-6FGG456C

Overview

XC2V250-6FGG456C from Xilinx is a 250K-system-gate Virtex-II platform FPGA in a 456-pin fine-pitch BGA (FGG456) package, operating at commercial temperature range (0°C to +85°C) with -6 speed grade. It integrates 1,536 Configurable Logic Blocks (CLBs), 48 dedicated 18×18 multipliers, 24 Block SelectRAM™ modules (totaling 432 Kb RAM), and 8 Digital Clock Managers (DCMs). It targets high-speed telecommunication and DSP systems requiring PCI, LVDS, and DDR interfaces.

For engineers reviewing the XC2V250-6FGG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O standard support (LVDS, SSTL, HSTL, PCI-X), DCI termination capability, DCM timing parameters, and validated alternative FPGAs for migration or second-sourcing.

Technical Context

The XC2V250-6FGG456C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column, 120 hex lines, and predictable delay independent of fanout. Its IOBs support dual-edge DDR registers per I/O path, with clock pairs generated by DCMs phase-shifted by 180° for precise data capture.

Each CLB contains four slices with dual 4-input LUTs, two flip-flops/latches, carry chains, and horizontal cascade logic; each Block SelectRAM provides true dual-port 18-Kb RAM configurable from 16K×1 to 512×36, with three read-during-write modes. The device uses 1.5 V core (VCCINT), 3.3 V auxiliary (VCCAUX), and programmable VCCO per bank.

Key Specifications

Pinout & Package

XC2V256-6FGG456C is housed in a 456-ball fine-pitch BGA (FGG456) package with 1.00 mm pitch, Pb-free finish, and 23 mm × 23 mm body size. Pin definitions follow Xilinx's standardized Virtex-II I/O tile layout with dedicated configuration, JTAG, and global clock pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC2V250-6FGG456C, the -5 variant trades timing margin for cost, while the XC3S200 represents a generational shift with reduced clock management, memory, and I/O capabilities - making it suitable only for functionally simplified derivatives.

Availability

XC2V250-6FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, test equipment, and industrial embedded systems requiring stable component supply across extended production lifecycles.

Supply support for XC2V250-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering FPGA and adaptive computing solutions provider, acquired by AMD in 2022. It delivers programmable logic platforms for high-performance, low-latency applications across communications, aerospace, and defense.

The Virtex-II family was engineered for high-bandwidth, high-gate-count system integration - specifically targeting wireline/wireless infrastructure, video processing, and DSP acceleration where deterministic timing and multi-standard I/O are critical.

FAQ

What is the maximum LVDS data rate supported by XC2V250-6FGG456C?

XC2V250-6FGG456C supports LVDS signaling at up to 840 Mb/s, as specified in the Virtex-II DS031 datasheet Module 1. This rate is achievable using dedicated LVDS_33 or LVDS_25 I/O standards with proper board-level termination and DCM-controlled clocking. The -6 speed grade ensures timing closure for source-synchronous LVDS interfaces at this rate.

Does XC2V250-6FGG456C support on-chip termination for SSTL-2 I/O standards?

Yes, XC2V250-6FGG456C supports SSTL2_I and SSTL2_II via Digitally Controlled Impedance (DCI) when configured as SSTL2_I_DCI or SSTL2_II_DCI. This provides programmable parallel on-die termination matching 25 Ω or 50 Ω, eliminating external resistors and improving signal integrity for DDR SDRAM interfaces.

How many Digital Clock Managers (DCMs) are available in XC2V250-6FGG456C?

XC2V250-6FGG456C contains 8 Digital Clock Managers (DCMs), as confirmed in Table 1 of DS031 Module 1. Each DCM provides fully digital clock deskew, frequency synthesis (M/D ratios), and fine-grained phase shifting (1/256 cycle resolution), enabling robust multi-clock domain designs.

Is XC2V250-6FGG456C compatible with JTAG boundary-scan testing?

Yes, XC2V250-6FGG456C implements IEEE 1149.1-compliant boundary-scan logic with full TAP controller support (TCK, TMS, TDI, TDO, TRST). It supports EXTEST, INTEST, and HIGHZ instructions, allowing board-level interconnect testing and in-system programming without requiring additional debug hardware.

What configuration modes does XC2V250-6FGG456C support?

XC2V250-6FGG456C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up, and configuration data can be encrypted using on-chip Triple-DES decryption for IP protection.