AMD XC2V3000-4BF957C

Overview

XC2V3000-4BF957C from Xilinx is a high-density Virtex-II platform FPGA with 3 million system gates, 14,336 configurable logic blocks (CLBs), 448 dedicated 18×18 multipliers, and 96 Digital Clock Manager (DCM) modules. It features 720 user I/Os in a 957-pin flip-chip BGA package, supporting LVDS, PCI-X, SSTL, and HSTL interfaces for telecom and networking infrastructure applications.

For engineers reviewing the XC2V3000-4BF957C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720), DCM count (96), core voltage (1.5 V), maximum I/O speed (840 Mb/s), and flip-chip thermal performance for high-throughput signal processing designs.

Technical Context

The XC2V3000-4BF957C implements a hierarchical, segmented Active Interconnect routing architecture with 24 long lines per row/column and predictable delay independent of fanout. Its IOBs support DDR input/output registers with 180° phase-shifted clocks generated by integrated DCMs, enabling source-synchronous data capture at up to 840 Mb/s.

Each CLB contains four slices with dual 4-input LUTs, dual storage elements, and fast carry chains; block SelectRAM provides 18-Kb dual-port RAM configurable from 16K×1 to 512×36, while dedicated 18×18 multipliers enable efficient DSP filtering and read-multiply-accumulate operations.

Key Specifications

Pinout & Package

XC2V3000-4BF957C uses a 957-ball flip-chip BGA (BF957) package with 1.27 mm pitch, 40 mm × 40 mm body size, and 684 user I/Os (per Table 6, Module 1). The BF957 footprint is pin-compatible with other BF-series packages but not with FG/FF/CS/BG families.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XC2V3000-4BF957C, XC2V3000-5FF1152C offers more I/Os and thermal headroom but requires PCB redesign, while XC2V2000-4BF957C provides pin-compatible down-binning with 25% fewer CLBs and DCMs for lower-cost deployment.

Availability

XC2V3000-4BF957C is available at Aetrix Electronics and suitable for wireless infrastructure, network switching, broadcast video, and industrial vision applications requiring stable component supply across extended production lifecycles.

Supply support for XC2V3000-4BF957C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance digital systems.

The Virtex-II family was designed for high-speed, high-density applications including telecom infrastructure, video processing, and DSP acceleration-leveraging 0.15 µm/0.12 µm process technology and advanced clock management.

FAQ

What is the maximum I/O count supported by XC2V3000-4BF957C?

XC2V3000-4BF957C supports 720 user I/Os in its BF957 flip-chip BGA package, as confirmed in Table 6 of DS031-1 (v3.5). This includes all user-configurable pins except 15 dedicated control signals (CCLK, DONE, M0–M2, PROG_B, etc.) and VBATT. The 720 I/O count enables high-bandwidth parallel interfaces such as DDR SDRAM, QDR SRAM, and PCI-X 133 MHz in the XC2V3000-4BF957C design.

Does XC2V3000-4BF957C support DDR I/O signaling?

Yes, XC2V3000-4BF957C supports DDR I/O signaling through dedicated DDR input and output registers within each IOB block. These registers are clocked by 180° phase-shifted clocks generated by its 96 integrated DCM modules, enabling true double-data-rate operation without external circuitry. The XC2V3000-4BF957C datasheet confirms DDR support for LVTTL, LVCMOS, SSTL, and HSTL standards.

What is the core voltage requirement for XC2V3000-4BF957C?

XC2V3000-4BF957C requires a 1.5 V ±3% core supply (VCCINT) for its CLBs, DCMs, and internal routing resources. This voltage is specified in the General Description section of DS031-1 (v3.5) and is critical for stable operation at rated speed grade -4. Deviation beyond tolerance risks timing violations or configuration failure in the XC2V3000-4BF957C device.

How many Digital Clock Managers (DCMs) does XC2V3000-4BF957C include?

XC2V3000-4BF957C includes 96 Digital Clock Manager (DCM) modules, as documented in Table 1 of DS031-1 (v3.5). Each DCM provides clock de-skew, frequency synthesis (M/D ratio), and fine-grained phase shifting (1/256 period resolution), enabling precise multi-domain clocking essential for high-speed interfaces in the XC2V3000-4BF957C implementation.

Is XC2V3000-4BF957C compatible with Pb-free assembly processes?

No, XC2V3000-4BF957C is not a Pb-free part. The BF957 package variant is leaded; Pb-free alternatives for the Virtex-II family use BGG suffixes (e.g., BGG728), but no Pb-free version exists for the BF957 package. Per DS031-1 (v3.5), only wire-bond packages (CSG, FGG, BGG) are offered in Pb-free form-not flip-chip variants like BF957 used in XC2V3000-4BF957C.